Equipment for removing protective coatings from substrates

Patent metadata

Field	Value
Publication number	US-10293465-B2
Application number	US-201514841596-A
Country	US
Kind code	B2
Filing date	Aug 31, 2015
Priority date	Aug 29, 2014
Publication date	May 21, 2019
Grant date	May 21, 2019

Abstract

Apparatuses and systems that enable selective removal of protective coatings from substrates are disclosed. Such a material removal system may use pressurized solid carbon dioxide (CO 2 ) (i.e., dry ice) to remove a selected portion of a protective coating from a substrate. The material removal system may include one or more templates that provide selectivity in removing protective coatings from one or more substrates, fixtures for holding one or more substrates in place while material removal processes occur and apparatuses for positioning one or more substrates at desired locations in material removal systems.

First claim

What is claimed:

1. A method for removing material from a substrate, comprising:
forming a seal of a first element of a template against a first side of substrate, the first element comprising at least one exposure aperture for exposing at least a portion of the first side of the substrate;
forming a second seal of a second element of the template a second side of the substrate, the second element comprising a second exposure aperture for exposing at least a portion of the second side of the substrate, wherein the first side is opposite the second side;
securing the first element to the second element with the substrate in between the first element and the second element;
positioning the template relative to a platen or a support plate of a material removal system; and
removing a parylene coating from the substrate through the at least one aperture and the second exposure aperture of the template using the material removal system.

2. The method of claim 1 , wherein the method further comprises:
assembling together the template and a plurality of templates, each of the plurality of templates sealed against a respective substrate, with a fixture, wherein positioning the template relative to the platen or the support plate of the material removal system comprises positioning the fixture relative to the platen or the support plate of the material removal system.

3. The method of claim 1 , wherein removing the parylene coating from the substrate comprises directing thy ice under pressure into the at least one aperture of the template.

Assignees

• Hzo Inc

Inventors

• Popeck Heidi L
• Kanavel Caleb Edward
• Anderson Samuel R
• Child Tyler Christensen
• Triplett Daniel J

Classifications

• H10P72/0421

  for drying etching · CPC title

• B24C1/086

  Descaling; Removing coating films · CPC title

• B24C1/04

  for treating only selected parts of a surface, e.g. for carving stone or glass · CPC title

• B24C1/003 Primary

  using material which dissolves or changes phase after the treatment, e.g. ice, CO2 · CPC title

• H01L21/67069

  Electricity · mapped topic