Film-forming method

Patent metadata

Field	Value
Publication number	US-10293368-B2
Application number	US-201615567589-A
Country	US
Kind code	B2
Filing date	Feb 24, 2016
Priority date	Apr 20, 2015
Publication date	May 21, 2019
Grant date	May 21, 2019

Abstract

A film-forming method for forming a thin film on a substrate includes a contact step, an external force removal step, and a film-forming step. At the contact step (step B), the substrate 30 and a member 31 in contact with one surface of the substrate is stacked, and the substrate 30 and the member 31 in contact with one surface of the substrate are placed under vacuum while an external force is applied in a direction in which the substrate 30 and the member 31 in contact with one surface of the substrate are stacked. At the external force removal step (step C), the external force is removed at atmospheric pressure or under vacuum. At a film-forming step (step E), a thin film is formed on the one surface or the other surface of the substrate 30.

First claim

The invention claimed is:

1. A film-forming method for forming a thin film on a substrate, the method comprising:
a contact step of stacking the substrate and a member in contact with one surface of the substrate and placing the substrate and the member vacuum while an external force generated by a magnet is applied in a direction in which the substrate and the member are stacked;
an external force removal step of removing the external force by separating the magnet from the member at atmospheric pressure or under vacuum; and
a film-forming step of forming a thin film on the one surface or the other surface of the substrate after the external force removal step.

2. The film-forming method according to claim 1 , wherein
the member is a metal mask having an opening,
at the contact step, the magnet is arranged on a side of the other surface of the substrate and the external force is applied while the substrate is held between the metal mask and the magnet,
at the external force removal step, the external force is removed by separating the magnet and the metal mask, and
at the film-forming step, the thin film is formed in a region of the one surface of the substrate, the region corresponding to an area where the opening of the metal mask is provided.

3. The film-forming method according to claim 2 , wherein
at the contact step, a non-magnetic member is further arranged in a stacked manner to contact the other surface of the substrate, and the external force is applied in a direction in which the metal mask, the substrate, and the non-magnetic member are stacked while the substrate and the non-magnetic member are held between the metal mask and the magnet.

4. The film-forming method according to claim 2 , wherein
at the film-forming step, the thin film is formed on the one surface of the substrate by using a chemical vapor deposition method, and
the magnet and the metal mask are separated at the external force removal step before the film-forming step.

5. The film-forming method according to claim 1 , wherein
the member is a non-magnetic member made of a non-magnetic material,
at the contact step, a magnetic member is further arranged in a stacked manner to contact the other surface of the substrate, the magnet is arranged to contact the non-magnetic member, and the external force is applied in a direction in which the magnetic member, the substrate, and the non-magnetic member are stacked while the substrate and the non-magnetic member are held between the magnet and the magnetic member,
at the external force removal step, the external force is removed by separating the magnetic member and the magnet from the substrate and the non-magnetic member, and
at the film-forming step, the thin film is formed on the other surface of the substrate.

Assignees

• Sharp Kk

Inventors

• Sakai Toshihiko
• Kamikawa Takeshi
• Harada Masatomi
• Kuniyoshi Tokuaki
• ZOU Liumin

Classifications

• C23C14/50

  Substrate holders · CPC title

• C23C14/04

  Coating on selected surface areas, e.g. using masks · CPC title

• C23C16/44

  characterised by the method of coating (C23C16/04 takes precedence) · CPC title

• C23C16/04

  Coating on selected surface areas, e.g. using masks · CPC title

• B05D1/60

  Deposition of organic layers from vapour phase (vapour phase deposition in general C23C14/00, C23C16/00) · CPC title