Microfluidic cartridge assembly

Patent metadata

Field	Value
Publication number	US-10293339-B2
Application number	US-201715844562-A
Country	US
Kind code	B2
Filing date	Dec 17, 2017
Priority date	Jul 22, 2013
Publication date	May 21, 2019
Grant date	May 21, 2019

Abstract

According to aspects of the present invention, a cartridge assembly for transporting fluid into or out of one or more fluidic devices includes a first layer and a second layer. The first layer includes a first surface. The first surface includes at least one partial channel disposed thereon. The second layer abuts the first surface, thereby forming a channel from the at least one partial channel. At least one of the first layer and the second layer is a resilient layer formed from a pliable material. At least one of the first layer and the second layer includes a via hole. The via hole is aligned with the channel to pass fluid thereto. The via hole is configured to pass fluid through the first layer or the second layer substantially perpendicularly to the channel. Embossments are also used to define aspects of a fluidic channel.

First claim

What is claimed is:

1. A fluidic device configured for fluidic interconnection with a microfluidic device, the fluidic device comprising:
a first structure including a surface and an embossment, the embossment being disposed on the surface of the first structure;
a second structure coupled to the first structure configured such that the embossment abuts the second structure, the abutment thereby forming a seal between the embossment and the second structure; and
an interconnect adapter abutting at least one of the first structure or the second structure, the interconnect adapter configured to form a fluidic connection between the fluidic device and the microfluidic device,
wherein the embossment, when abutting the second structure, is configured to define an aspect of a fluidic channel that connects a first via hole and a second via hole, the fluidic channel being disposed between the first structure and the second structure, wherein in response to the embossment abutting the second structure, a working fluid is configured to flow within the fluidic channel from the first via hole to the second via hole, and
wherein at least one of the first structure and the second structure include a resilient material.

2. The fluidic device of claim 1 , wherein the channel is a microfluidic channel.

3. The fluidic device of claim 1 , wherein the embossment defines the entire channel.

4. The fluidic device of claim 3 , wherein the embossment encloses one or more via holes passing through the surface.

5. The fluidic device of claim 1 , wherein the first structure is formed from a resilient material.

6. The fluidic device of claim 5 , wherein the second structure is formed from a resilient material.

7. The fluidic device of claim 1 , wherein the first structure is formed from a rigid material.

8. The fluidic device of claim 1 , further comprising a third structure, the third structure being disposed between the first structure and the second structure, the third structure including an aperture forming a passageway therethrough, the embossment extending between the first layer and the second layer through the passageway.

9. The fluidic device of claim 1 , wherein the second structure is a sensing element.

10. The fluidic device of claim 1 , wherein the first structure is a first layer and the second structure is a second layer.

Assignees

• Harvard College

Inventors

• Ingber Donald E
• Levner Daniel
• Thompson Ii Guy
• Hinojosa Christopher David

Classifications

• B01L2400/0481

  squeezing of channels or chambers · CPC title

• B01L2200/0684

  Venting, avoiding backpressure, avoid gas bubbles · CPC title

• B01L2200/12

  Specific details about manufacturing devices · CPC title

• B01L2300/0874

  Three dimensional network · CPC title

• B01L2300/0645

  Electrodes · CPC title