Method of connecting a wire to a feedthrough

Patent metadata

Field	Value
Publication number	US-10293172-B2
Application number	US-201715479243-A
Country	US
Kind code	B2
Filing date	Apr 4, 2017
Priority date	Apr 7, 2016
Publication date	May 21, 2019
Grant date	May 21, 2019

Abstract

One aspect relates to a feedthrough system. The feedthrough system includes a feedthrough and a wire. At least a portion of the feedthrough is made of an insulator and at least one area forming an electrically conductive cermet pathway. The cermet pathway may include an electrically conductive metal. The wire may be at least partially connected to the cermet pathway so that the material of the wire forms a joint microstructure with the electrically conductive material in the cermet pathway.

First claim

What is claimed is:

1. A feedthrough system comprising:
a feedthrough, a wire, and an electrode outside the feedthrough, all introduced into a human or animal body;
wherein the feedthrough comprises an insulator and an electrically conductive cermet pathway;
wherein the cermet pathway comprises an electrically conductive metallic material;
wherein the wire is arranged between the electrode and the cermet pathway;
wherein the wire is at least partially connected to the cermet pathway so that the material of the wire forms a joint microstructure with the electrically conductive material in the cermet pathway such that the material of the cermet pathway and the material of the wire are at least partially mixed with each other, the joint microstructure characterized by the absence of an intervening conductive material between the material of the wire and the electrically conductive material in the cermet pathway;
wherein the wire comprises a material selected from a group consisting of a platinum-iridium alloy and a nickel-cobalt-chromium alloy; and
wherein the connection between the wire and the cermet pathway shows a tensile strength between 500 MPa and 1500 MPa.

2. The feedthrough system of claim 1 , wherein the matrix of the material in the at least one area forming an electrically conductive cermet pathway comprises 30 to 90 percent by volume of a metal out of the group consisting of platinum, a platinum alloy, iridium, niobium, molybdenum, titanium, a titanium alloy, cobalt, zirconium, chromium, tantalum, a tantalum alloy, tungsten, a tungsten alloy.

3. The feedthrough system of claim 1 , wherein the area forming the electrically conductive cermet pathway has a cross-sectional diameter of up to 5 mm.

4. The feedthrough system of claim 1 , wherein the feedthrough comprises a plurality of electrically conductive cermet pathways, and wherein the wire comprises a plurality of wire leads, wherein different leads are connected to different cermet pathways, respectively.

5. The feedthrough system of claim 1 , wherein the joint microstructure consists exclusively of the electrically conductive metallic material of the cermet pathway and of the material of the wire, and characterized by the absence of a solder.

6. An implantable medical device comprising:
a feedthrough, a wire, and an electrode outside the feedthrough all introduced into a human or animal body;
wherein the feedthrough comprises an insulator and an electrically conductive cermet pathway;
wherein the cermet pathway comprises an electrically conductive metallic material;
wherein the wire is arranged between the electrode and the cermet pathway; and
wherein the wire is at least partially connected to the cermet pathway so that the material of the wire forms a joint microstructure with the electrically conductive material in the cermet pathway such that the material of the cermet pathway and the material of the wire are at least partially mixed with each other, the joint microstructure characterized by the absence of an intervening conductive material between the material of the wire and the electrically conductive material in the cermet pathway;
an electronic device arranged at least partially in electrical contact with the feedthrough and;
wherein the wire comprises a material selected from a group consisting of a platinum-iridium alloy and a nickel-cobalt-chromium alloy;
wherein the connection between the wire and the cermet pathway shows a tensile strength between 500 MPa and 1500 MPa.

7. The implantable medical device of claim 6 , wherein the matrix of the material in the at least one area forming an electrically conductive cermet pathway comprises 30 to 90 percent by volume of a metal out of the group consisting of platinum, a platinum alloy, iridium, niobium, molybdenum, titanium, a titanium alloy, cobalt, zirconium, chromium, tantalum, a tantalum alloy, tungsten, a tungsten alloy.

8. The implantable medical device of claim 6 , wherein the area forming the electrically conductive cermet pathway has a cross-sectional diameter of up to 5 mm.

Assignees

• Heraeus Deutschland Gmbh & Co Kg

Inventors

• Dittmer Robert
• BALASUBRAMANIAN Senthil Kumar
• Wilhelm Leoni
• Schmitt Thomas
• Kaiser Thorsten
• Asmus Tim

Classifications

• H01B1/02

  mainly consisting of metals or alloys · CPC title

• B23K26/22

  Spot welding · CPC title

• A61B5/686

  Permanently implanted devices, e.g. pacemakers, other stimulators, biochips (A61B5/6861 takes precedence) · CPC title

• H01R2201/12

  for medicine and surgery · CPC title

• H05K5/0091

  Housing specially adapted for small components (for resistors H01C; for capacitors H01G; for integrated circuits H10W99/00) · CPC title