Electrical shielding using bar vias and associated methods

Patent metadata

Field	Value
Publication number	US-10292259-B2
Application number	US-201615142213-A
Country	US
Kind code	B2
Filing date	Apr 29, 2016
Priority date	Apr 29, 2016
Publication date	May 14, 2019
Grant date	May 14, 2019

Abstract

An electronic device disclosed herein includes a first conductor layer, a first nonconducting layer, and a second conductor layer in a stacked arrangement. A signal carrying conductive via is formed in the first nonconducting layer and extends between the first conductor layer and the second conductor layer. A shielding conductive via is formed in the first nonconducting layer, is not electrically coupled to the signal carrying conductive via, and substantially completely surrounds the signal carrying conductive via in spaced apart relation thereto.

First claim

The invention claimed is:

1. An electronic device, comprising:
a first conductor layer, a first nonconducting layer, and a second conductor layer in a stacked arrangement;
a first signal carrying conductive via formed in the first nonconducting layer and extending between the first conductor layer and the second conductor layer;
a first shielding conductive via formed in the first nonconducting layer, not electrically coupled to the first signal carrying conductive via, and surrounding the first signal carrying conductive via in spaced apart relation thereto;
wherein the first shielding conductive via forms an arcuate shape about the first signal carrying conductive via;
a second signal carrying conductive via formed in the first nonconducting layer and extending between the first conductor layer and the second conductor layer;
a second shielding conductive via formed in the first nonconducting layer, spaced apart from the first shielding conductive via, not electrically coupled to the second signal carrying conductive via, and surrounding the second signal carrying conductive via in spaced apart relation thereto;
wherein the second shielding conductive via forms an arcuate shape about the second signal carrying conductive via;
wherein the first shielding conductive via has a same height as the first signal carrying conductive via;
wherein the first shielding conductive via has an unchanging diameter along its entire vertical length in the first nonconductive layer;
wherein the second shielding conductive via has a same height as the second signal carrying conductive via;
wherein the second shielding conductive via has an unchanging diameter along its entire vertical length in the first nonconductive layer;
a signal carrying conductive trace formed in the first conductor layer and electrically coupling the first signal carrying conductive via to the second signal carrying conductive via;
and wherein the first and second shielding conductive vias at least partially surround the signal carrying conductive trace in spaced apart relation thereto.

2. The electronic device of claim 1 , wherein the first shielding conductive via has a height no greater than a height of the first signal carrying conductive via.

3. The electronic device of claim 1 , wherein the first shielding conductive via does not extend beyond the first and second conductor layers.

4. The electronic device of claim 1 , wherein the first shielding conductive via does not more than partially surround conductive structures that are not directly electrically coupled to the first signal carrying conductive via.

5. The electronic device of claim 1 , wherein the first shielding conductive via at least partially surrounds only conductive structures that are directly electrically coupled to the first signal carrying conductive trace.

6. The electronic device of claim 1 , wherein the first shielding conductive via is coupled to a ground node.

7. The electronic device of claim 1 , wherein the first shielding conductive via is electrically floating.

8. The electronic device of claim 1 , wherein the first shielding conductive via and second conductive via are not electrically coupled to one another.

9. The electronic device of claim 1 , wherein the signal carrying conductive trace lacks shielding other than by the first and second shielding conductive vias.

Assignees

• St Microelectronics Grenoble 2

Inventors

• Marechal Laurent
• Rembert Richard
• Lopez Jerome

Classifications

• H05K1/0222

  for shielding around a single via or around a group of vias, e.g. coaxial vias or vias surrounded by a grounded via fence · CPC title

• H05K1/0251 Primary

  related to vias or transitions between vias and transmission lines · CPC title