Circuit board with ceramic inlays

Patent metadata

Field	Value
Publication number	US-10292254-B2
Application number	US-201414551680-A
Country	US
Kind code	B2
Filing date	Nov 24, 2014
Priority date	Nov 25, 2013
Publication date	May 14, 2019
Grant date	May 14, 2019

Abstract

A circuit board includes a plurality of conductive track levels disposed one above the other and insulation layers arranged between each of two adjacent conductive track levels. The circuit board includes a thermally conductive element, which includes ceramic, disposed between a first external insulation layer and a second external insulation layer.

First claim

What is claimed is:

1. A multi-layered printed circuit board for use in high voltage installations under vacuum conditions and configured to carry electrical components, the printed circuit board comprising:
a plurality of electrically conductive track layers disposed one above the other;
a plurality of insulation layers, each single insulation layer respectively arranged between each adjacent electrically conductive track layer of the plurality of electrically conductive track layers, so that the electrically conductive layers alternate with the insulation layers;
a thermally conductive element disposed between a first external insulation layer and a second external insulation layer of the insulation layers arranged between adjacent electrically conductive track layers of the plurality of electrically conductive track layers; and
an equipment layer to which an electrical component is mechanically and electrically coupled,
wherein the thermally conductive element includes ceramic and provides electrical insulation,
wherein the thermally conductive element is disposed in a recess that extends over more than one insulation layer in a depth direction of the printed circuit board,
wherein a first surface and a second surface of the thermally conductive element in each case adjoin a conductive track level between two adjacent insulation layers, and
wherein the thermally conductive element is disposed so that it congruently overlaps the electrical component without overhang in a longitudinal direction of the printed circuit board.

2. The printed circuit board of claim 1 , wherein the thermally conductive element also includes aluminium nitride.

3. The printed circuit board of claim 1 , the thermally conductive element is electrically insulating.

4. The printed circuit board of claim 1 , wherein the thermally conductive element is disposed in a recess in one of the insulation layers arranged between said each adjacent electrically conductive track layer.

5. The printed circuit board of claim 1 , wherein a first surface of the thermally conductive element adjoins a first electrically conductive track layer, of the plurality of electrically conductive track layers, in the depth direction of the printed circuit board.

6. The printed circuit board of claim 5 , wherein a second surface of the thermally conductive element adjoins a second electrically conductive track layer, of the plurality of electrically conductive track layers, in the depth direction of the printed circuit board.

7. An electrical component in a satellite, wherein the electrical component comprises:
a multi-layered printed circuit board comprising:
a plurality of electrically conductive track layers disposed one above the other;
one or more insulation layers, each single insulation layer respectively arranged between each adjacent electrically conductive track layer of the plurality of electrically conductive track layers, so that the electrically conductive layers alternate with the insulation layers; and
a thermally conductive element disposed between a first external insulation layer and a second external insulation layer of the insulation layers arranged between adjacent electrically conductive track layers of the plurality of electrically conductive track layers,
wherein the thermally conductive element includes ceramic and provides electrical insulation under vacuum conditions;

an electrical component mechanically and electrically coupled to an equipment layer of the printed circuit board,
wherein the thermally conductive element is disposed so that it congruently overlaps the electrical component without overhang in a longitudinal direction of the printed circuit board; and
a thermal coupling element that is thermally coupled to an external layer of the printed circuit board and is configured to discharge heat from the printed circuit board,
wherein the thermally conductive element is disposed so that it overlaps the thermal coupling element in the longitudinal direction of the printed circuit board,
wherein the thermal coupling element extends along a longitudinal direction of a bottom surface of the printed circuit board,
wherein the bottom surface extends in parallel to the equipment layer to which the electrical component is coupled,
wherein the thermally conductive element is disposed in a recess that extends over more than one insulation layer in a depth direction of the printed circuit board, and
wherein a first surface and a second surface of the thermally conductive element in each case adjoin a conductive track level between two adjacent insulation layers.

8. The electrical component of claim 7 , wherein the thermally conductive element is disposed so that it overlaps the electrical component in a transverse direction of the printed circuit board.

9. The electrical component of claim 7 , wherein the thermally conductive element also includes aluminium nitride.

10. The electrical component of claim 7 , wherein the thermally conductive element is electrically insulating.

11. The electrical component of claim 7 , wherein the thermally conductive element is disposed in a recess in one of the insulation layers arranged between said each adjacent electrically conductive track layer.

12. The electrical component of claim 7 , wherein a first surface of the thermally conductive element adjoins a first electrically conductive track layer, of the plurality of electrically conductive track layers, in the depth direction of the printed circuit board.

13. The electrical component of claim 12 , wherein a second surface of the thermally conductive element adjoins a second electrically conductive track layer, of the plurality of electrically conductive track layers, in the depth direction of the printed circuit board.

Assignees

• Tesat Spacecom Gmbh & Co Kg

Inventors

• Katz Hanspeter
• Artmann Jochen
• Wolf Eric
• Rapp Christian
• Koeger Ulrich

Classifications

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H05K1/0204 Primary

  using means for thermal conduction connection in the thickness direction of the substrate (H05K1/0207 takes precedence) · CPC title

• H05K1/181

  associated with surface mounted components · CPC title

• H05K2201/10416

  Metallic blocks or heatsinks completely inserted in a PCB · CPC title

• H05K1/0207

  using internal conductor planes parallel to the surface for thermal conduction, e.g. power planes · CPC title