Cable mounting substrate, cable-equipped substrate and method for connecting cables to cable mounting substrate

Patent metadata

Field	Value
Publication number	US-10290959-B2
Application number	US-201815893788-A
Country	US
Kind code	B2
Filing date	Feb 12, 2018
Priority date	Feb 24, 2017
Publication date	May 14, 2019
Grant date	May 14, 2019

Abstract

Provided is a cable mounting substrate for mounting plural cables each of which includes a center conductor, an insulation covering the center conductor and an outer conductor covering the insulation. The cable mounting substrate includes a plate-shaped base, a ground pattern that is arranged on the base and electrically connected to the outer conductor, and a solder member that is provided on the ground pattern and is melted to electrically connect and fix the outer conductor to the ground pattern. The solder member includes a recessed portion having a shape along an outer shape of the outer conductor.

First claim

What is claimed is:

1. A cable mounting substrate for mounting a plurality of cables each of which comprises a center conductor, an insulation covering the center conductor and an outer conductor covering the insulation, the cable mounting substrate comprising:
a plate-shaped base;
a ground pattern that is arranged on the base and electrically connected to the outer conductor; and
a solder member that is provided on the ground pattern and is melted to electrically connect and fix the outer conductor to the ground pattern,
wherein the solder member comprises a recessed portion having a shape along an outer shape of the outer conductor,
wherein the ground pattern comprises a hole formed in a thickness direction, and
wherein the solder member comprises a raised portion protruding into the hole.

2. The cable mounting substrate according to claim 1 , wherein the solder member adheres tightly to the ground pattern.

3. A cable mounting substrate for mounting a plurality of cables each of which comprises a center conductor, an insulation covering the center conductor and an outer conductor covering the insulation, the cable mounting substrate comprising:
a plate-shaped base;
a ground pattern that is arranged on the base and electrically connected to the outer conductor; and
a solder member that is provided on the ground pattern and is melted to electrically connect and fix the outer conductor to the ground pattern,
wherein the solder member comprises a recessed portion having a shape along an outer shape of the outer conductor,
wherein the ground pattern and the solder member are provided on both surfaces of the base, and
wherein the solder member on one surface of the base are not aligned with the solder member on an other surface of the base in a longitudinal direction of the cable.

4. The cable mounting substrate according to claim 3 , wherein the solder member adheres tightly to the ground pattern.

5. A cable-equipped substrate, comprising:
a plurality of cables each comprising a center conductor, an insulation covering the center conductor and an outer conductor covering the insulation; and
a cable mounting substrate that mounts the plurality of cables,
wherein the cable mounting substrate comprises:
a base comprising an insulating material;
a metal ground pattern provided on the base and electrically connected to the outer conductors; and a solder connection portion connecting the ground pattern to the outer conductors,
wherein the ground pattern comprises a hole formed in a thickness direction, and the solder connection portion protrudes into the hole.

6. A method for connecting cables to a cable mounting substrate in such a manner that a plurality of cables, each comprising a center conductor, an insulation covering the center conductor and an outer conductor covering the insulation, are mounted on the cable mounting substrate, the method comprising:
preparing the cable mounting substrate; and
mounting the cables on the cable mounting substrate,
wherein the preparing comprises forming a metal ground pattern to be connected to the outer conductors on a base comprising an insulating material, mounting a plate-shaped solder member on the ground pattern, and pressing the solder member against the ground pattern so that the solder member is tightly adhered to the ground pattern and a recessed portion having a shape along an outer shape of the outer conductor is formed on a surface of the solder member, and
wherein the mounting comprises arranging the cables so that the outer conductor is put in the recessed portion, and connecting the outer conductor to the ground pattern by heating and melting the solder member.

7. The method according to claim 6 , wherein the forming of the metal ground pattern comprises forming a hole formed in a thickness direction on the ground pattern, and
wherein a raised portion protruding into the hole is formed on the solder member by the pressing.

Assignees

• Hitachi Metals Ltd

Inventors

• Kumakura Takashi
• Nagai Hideharu

Classifications

• H01R9/035

  Electricity · mapped topic

• H01B7/02

  Disposition of insulation · CPC title

• H01R9/0515 Primary

  Connection to a rigid planar substrate, e.g. printed circuit board · CPC title

• H01R43/0256 Primary

  for soldering or welding connectors to a printed circuit board · CPC title

• H01R12/53

  connecting to cables except for flat or ribbon cables · CPC title