Light-emitting diode and manufacturing method therefor

Patent metadata

Field	Value
Publication number	US-10290772-B2
Application number	US-201815925533-A
Country	US
Kind code	B2
Filing date	Mar 19, 2018
Priority date	Aug 5, 2014
Publication date	May 14, 2019
Grant date	May 14, 2019

Abstract

A light-emitting diode and a manufacturing method therefor are disclosed. The light-emitting diode comprises: a first conductive semiconductor layer; at least two light-emitting units arranged by being spaced from each other on the first conductive semiconductor layer, respectively including an active layer and a second conductive semiconductor layer, and including one or more contact holes through which the first conductive semiconductor layer is partially exposed; an additional contact area located between the light-emitting units; a second electrode making ohmic contact with the second conductive semiconductor layer; a lower insulation layer; and a first electrode making ohmic contact with the first conductive semiconductor layer through the contact holes of each of the light-emitting units and the additional contact area.

First claim

We claim:

1. A light emitting diode comprising:
a first conductive type semiconductor layer;
a first light emitting unit disposed on the first conductive type semiconductor layer and comprising an active layer, a second conductive type semiconductor layer, and at least one contact hole formed through the second conductive type semiconductor layer and the active layer so as to expose a portion of the first conductive type semiconductor layer;
an additional contact region disposed outside the first light emitting unit and partially exposing the first conductive type semiconductor layer;
first electrodes forming ohmic contact with the first conductive type semiconductor layer through the contact hole of the first light emitting unit and the additional contact region;
a second electrode disposed on the first light emitting unit and forming ohmic contact with the second conductive type semiconductor layer; and
a lower insulation layer covering a side surface of the first conductive type semiconductor layer, the first light emitting unit, and the second electrodes,
wherein the lower insulation layer is shaped to include a first opening exposing the contact hole and the additional contact region and a second opening partially exposing the second electrode, the first and second electrode being insulated from each other, and
a first pad and a second pad that are disposed on the first light emitting unit.

2. The light emitting diode according to claim 1 , further comprising at least three additional light emitting units and the additional contact region is disposed in a region surrounded by the first light emitting unit and the at least three additional light emitting units.

3. The light emitting diode according to claim 2 , wherein the additional contact region is disposed in a region in which corners of each of the first light emitting unit and the at least three additional light emitting units meet.

4. The light emitting diode according to claim 2 , wherein distances from a center of the additional contact region to centers of the first light emitting unit and the at least three additional light emitting units are the same.

5. The light emitting diode according to claim 1 , wherein the contact hole is disposed in a central region of the first light emitting unit.

6. The light emitting diode according to claim 1 , further comprising:
one or more connection layers electrically connecting the second electrode disposed on the first light emitting units to the second electrode disposed on another light emitting unit adjacent to the first light emitting unit.

7. The light emitting diode according to claim 1 , wherein the first electrodes cover at least part of the lower insulation layer and contact the first conductive type semiconductor layer through the first opening.

8. The light emitting diode according to claim 7 , wherein the first electrodes further cover the first conductive type semiconductor layer and side surfaces of the first light emitting unit and are insulated by the lower insulation layer.

9. The light emitting diode according to claim 1 , wherein the first pad is electrically connected to one of plurality of the first electrodes, and the second pad is electrically connected to the second electrode.

10. The light emitting diode according to claim 9 , wherein the first electrodes comprise inner first electrodes under the first pad and an outer first electrode exposed by the first pad.

11. The light emitting diode according to claim 10 , wherein the inner first electrodes are separated by the insulation layer.

12. The light emitting diode according to claim 10 , wherein one of inner first electrodes is connected to the outer first electrode.

13. The light emitting diode according to claim 1 , wherein the contact hole is partly surrounded by the second electrode.

14. The light emitting diode according to claim 13 , further comprising a second connection electrode on the second electrode, the second connection comprising a main electrode disposed under the second pad and an extension electrode extending from the main electrode towards the first pad.

15. The light emitting diode according to claim 1 , further comprising a second light emitting diode disposed on the first conductive type semiconductor layer, comprising an active layer, a second conductive type semiconductor layer, and at least one contact hole formed through the second conductive type semiconductor layer and the active layer to expose a portion of the first conductive type semiconductor layer.

Assignees

• Seoul Viosys Co Ltd

Inventors

• Oh Se Hee
• Kim Jong Kyu
• Kim Jae Kwon
• Kang Min Woo
• Kim Hyun A

Classifications

• G02B6/0068

  Arrangements of plural sources, e.g. multi-colour light sources · CPC title

• G02B6/0073

  Light emitting diode [LED] · CPC title

• F21Y2115/10

  Light-emitting diodes [LED] · CPC title

• G02B6/0055

  Reflecting element, sheet or layer · CPC title

• G02B6/009

  of the light source in the package (G02B6/0021 takes precedence) · CPC title