Hot plate and substrate processing equipment using the same

Patent metadata

Field	Value
Publication number	US-10287686-B2
Application number	US-201113992165-A
Country	US
Kind code	B2
Filing date	Nov 23, 2011
Priority date	Dec 6, 2010
Publication date	May 14, 2019
Grant date	May 14, 2019

Abstract

The present invention provides a hot plate and substrate processing equipment using the same, wherein the hot plate comprises a central sub hot plate and at least one outer ring sub hot plate located around the central sub hot plate; thermal insulation parts are provided between the central sub hot plate and the outer ring sub hot plate and between two adjacent outer ring sub hot plates, so that the heat conduction between the adjacent sub hot plates can be effectively prevented or reduced by means of the thermal insulation parts. The hot plate and the substrate processing equipment using the same provided in the present invention can effectively compensate for the heat losses in the edge region of the substrate, so as to keep the heating rate the same in each region of the substrate.

First claim

What is claimed is:

1. A hot plate for heating a substrate, comprising:
a central sub hot plate;
at least one outer ring sub hot plate located around the central sub hot plate; and
at least one thermal insulation part provided between the central sub hot plate and the outer ring sub hot plate and between two adjacent outer sub hot plates, said thermal insulation part is used to prevent or reduce the heat conduction between adjacent sub hot plates;
wherein an edge of the central sub hot plate comprises a first flange, the first flange covers at least a portion of a topmost surface of the outer ring sub hot plate, and a topmost surface of the first flange is higher than the topmost surface of the outer ring sub hot plate, and
the hot plate compensates the heat dissipation at the edge of the substrate, by a thermal insulation effect of the thermal insulation part at the edge of the outer ring sub hot plate, the temperature of the outer ring sub hot plate may be higher than that of the central sub hot plate, such that the heat dissipation at the edge of the substrate being compensated, and the temperature distribution as well as the heating-up speed on a central region and the edge region of the substrate are substantially uniform.

2. The hot plate according to claim 1 , characterized in that, the materials of the central sub hot plate and the outer ring sub hot plate include at least one of graphite and aluminum.

3. The hot plate according to claim 2 , characterized in that, the materials of the central sub hot plate and the outer ring sub hot plate are made of aluminum material, and the surfaces thereof are sulfated hard anodized.

4. The hot plate according to claim 1 , characterized in that, the number of the at least one outer ring sub hot plate is at least two, and said at least two outer ring sub hot plate are socketed together.

5. The hot plate according to claim 1 , further comprising:
an annular groove formed on a lower surface of the hot plate located between the central sub hot plate and the outer ring sub hot plate;
wherein a thermal insulation filler is filled in the annular groove to form the thermal insulation part.

6. The hot plate according to claim 5 , wherein the thermal insulation filler includes at least one of quartz, ceramic insulation, and heat insulation rubber.

7. A substrate processing apparatus comprising:
a heating chamber;
at least two heating lamps;
a substrate support device opposed to the at least two heating lamps provided in the heating chamber; and
a hot plate disposed between the at least two heating lamps and the substrate support device so as to apply a partitioned heating to the substrate, the hot plate having a central sub hot plate and at least one outer ring sub hot plate located around the central sub hot plate,
wherein at least one thermal insulation part is provided between the central sub hot plate and the outer ring sub hot plate and between two adjacent outer sub hot plates, said thermal insulation part is used to prevent or reduce the heat conduction between adjacent sub hot plates; during the heating the at least two heating lamps are operated to provide a partitioned heating to the substrate, to control for the partitioned heating to the substrate as may be implemented by the hot plate, so as to achieve a uniform temperature distribution as well as the heating-up speed of the substrate, and
an edge of the central sub hot plate comprises a first flange, the first flange covers at least a portion of a topmost surface of the outer ring sub hot plate, and a topmost surface of the first flange is higher than the topmost surface of the outer ring sub hot plate.

8. The substrate processing apparatus according to claim 7 , characterized in that, the substrate processing apparatus comprises a physical vapor deposition device.

9. The substrate processing apparatus according to claim 7 , wherein the materials of the central sub hot plate and the outer ring sub hot plate include at least one of graphite and aluminum.

10. The substrate processing apparatus according to claim 9 , wherein the materials of the central sub hot plate and the outer ring sub hot plate are made of aluminum material, and the surfaces thereof are sulfated hard anodized.

11. The substrate processing apparatus according to claim 7 , wherein the number of the at least one outer ring sub hot plate is at least two, and said at least two outer ring sub hot plate are socketed together.

12. The substrate processing apparatus according to claim 7 , wherein the hot plat further comprises:
an annular groove formed on a lower surface of the hot plate located between the central sub hot plate and the outer ring sub hot plate;
wherein a thermal insulation filler is filled in the annular groove to form the thermal insulation part.

13. The substrate processing apparatus according to claim 12 , wherein the thermal insulation filler includes at least one of quartz, ceramic insulation, and heat insulation rubber.

14. A heating process chamber comprising:
a chamber body;
a substrate support platform provided inside the chamber body for supporting a substrate;
a hot plate provided inside the chamber body and spatially above the substrate support platform and the substrate, the hot plate comprising:
a central sub hot plate; and
at least one outer ring sub hot plate located around the central sub hot plate;
wherein an annular groove is formed on a lower surface of the hot plate located between the central sub hot plate and the outer ring sub hot plate; and
the central sub hot plate comprises a first flange at an outer edge of the central sub hot plate, the first flange covers at least a portion of a topmost surface of the outer ring sub hot plate, and a topmost surface of the first flange is higher than the topmost surface of the outer ring sub hot plate;

a sealing quartz window for dividing the chamber body into a vacuum portion and an air portion; and
a lamp set provided above the sealing quartz window for providing a heating source of the hot plate.

15. The heating process chamber according to claim 14 , wherein a thermal insulation filler is filled in the annular groove to form a thermal insulation part.

Assignees

• Zhao Mengxin
• Liu Xu
• Ding Peijun
• Wang Hougong
• Xia Wei
• Wen Lihui
• Beijing Naura Microelectronics Equipment Co Ltd

Inventors

• Zhao Mengxin
• Liu Xu
• Ding Peijun
• Wang Hougong
• Xia Wei
• Wen Lihui

Classifications

• H10P72/0432

  mainly by conduction · CPC title

• H01L21/67103

  Electricity · mapped topic

• C23C14/02 Primary

  Pretreatment of the material to be coated (C23C14/04 takes precedence) · CPC title

• C23C16/46 Primary

  characterised by the method used for heating the substrate (C23C16/48, C23C16/50 take precedence) · CPC title

• C23C14/22 Primary

  characterised by the process of coating · CPC title