Curing apparatus, image forming apparatus, and articles of manufacture

US10286687B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10286687-B2
Application numberUS-201715728774-A
CountryUS
Kind codeB2
Filing dateOct 10, 2017
Priority dateJul 1, 2011
Publication dateMay 14, 2019
Grant dateMay 14, 2019

How to read this patent

A practical reading order for non-experts. Skip the full description unless you need deep technical detail.

  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

Curing apparatus, image forming apparatus and articles of manufacture are disclosed. An example curing apparatus includes a curing unit to heat an area adjacent a substrate travel path, the curing unit having a width less than a width of the substrate travel path, and a controller to reciprocate the curing unit within the substrate width.

First claim

Opening claim text (preview).

What is claimed is: 1. A curing apparatus comprising: a curing unit to heat an area adjacent a substrate travel path, the curing unit having a width less than a width of the substrate travel path; and a controller to reciprocate the curing unit within the substrate width, wherein the controller is to move the curing unit at a first rate within a central region of a substrate in the substrate travel path and move the curing unit at a second rate within at least one edge region of the substrate, the second rate being slower than the first rate. 2. A curing apparatus as defined in claim 1 , wherein the curing unit comprises a lamp to provide radiation in a radiation curing area to cure a marking agent on the substrate. 3. A curing apparatus as defined in claim 2 , wherein the curing unit comprises a convection heater to apply heated air to the substrate. 4. A curing apparatus as defined in claim 3 , further comprising a temperature sensor to detect a temperature of the marking agent, the controller to control at least one of the lamp or the convection heater based on the temperature. 5. A curing apparatus as defined in claim 1 , further comprising a carriage to support the curing unit. 6. A curing apparatus as defined in claim 1 , wherein the curing unit is to heat the first area while a printing operation is applying marking agent to a second area of the substrate. 7. A curing assembly, comprising: a substrate travel path comprising a first width; a curing unit comprising an infrared (IR) lamp, a convection heater, air vents and a fan to move heated air from the convention heater out the air vents, the curing unit positioned in a direction of travel of a substrate in the substrate travel path, the curing unit to: move in a perpendicular direction relative to the direction of travel of the substrate travel path; and cease moving at outer edges of the substrate defining a second width, the second width being smaller than the first width; and a controller to control the movement of the curing unit based on the second width. 8. The curing assembly of claim 7 , wherein the controller is to move the curing unit at a first rate within a central region of the substrate in the substrate travel path and move the curing unit at a second rate within at least one edge region of the substrate, the second rate being slower than the first rate. 9. The curing assembly of claim 7 , further comprising a rail, a trolley coupled to the rail, and a motor coupled to the trolley to move the curing unit laterally across the substrate travel path. 10. The curing assembly of claim 7 , further comprising a memory comprising machine readable instructions which, when executed, cause the controller: receive information representative of a width of the substrate; and control the curing unit to move within the width of the substrate to cure fluid applied to the substrate. 11. The curing assembly of claim 10 , wherein the machine readable instructions, when executed, cause the controller to cure fluid applied to a first area of the substrate while simultaneously applying fluid to a second area of the substrate. 12. The curing assembly of claim 8 , wherein a size of the outer edges of the substrate is increased by the controller in response to an increase in the width of the print substrate. 13. The curing assembly of claim 7 , wherein the curing unit comprises a convection heater to apply heated air to the substrate, wherein the convection heater is fluidly coupled to the lamp, the lamp providing heat to the fluid convection heater. 14. A curing assembly to be positioned in a direction of travel of a substrate in a substrate travel path having a first width, the curing assembly comprising: a curing unit to move along a width of a substrate in the substrate travel path and cease moving at an outer edge of the substrate, a carriage to reciprocate the curing unit of the curing assembly across the width of the substrate, wherein the carriage is to move the curing unit at a first rate within a central region of the substrate and move the curing unit at a second rate within at least one edge region of the substrate, the second rate being slower than the first rate. 15. The curing assembly of claim 14 , wherein the curing unit comprises a width less than the width of the substrate. 16. The curing assembly of claim 14 , further comprising a rail, a trolley coupled to the rail, and a motor coupled to the trolley to move the curing unit laterally across the substrate travel path. 17. The curing assembly of claim 14 , further comprising a controller to control the movement of the curing unit based on the substrate width. 18. The curing assembly of claim 14 , further comprising a memory comprising machine readable instructions which, when executed, cause the controller: receive information representative of the width of the substrate; and control the curing unit to move within the width of the substrate to cure fluid applied to the substrate. 19. The curing assembly of claim 18 , wherein the machine readable instructions, when executed, cause the controller to cure fluid applied to a first area of the substrate while simultaneously applying fluid to a second area of the substrate. 20. A curing assembly of as defined in claim 1 , wherein a size of the edge regions of the substrate are increased by the controller in response to an increase in the width of the substrate in the substrate travel path.

Assignees

Inventors

Classifications

  • using electric heating (F26B23/10 takes precedence) · CPC title

  • Machines or apparatus for drying objects with progressive movement; Machines or apparatus with progressive movement for drying batches of material in compact form (F26B13/00, F26B17/00 take precedence; conveyors in general B65G) · CPC title

  • Arrangements for supplying or controlling air or other gases for drying solid materials or objects · CPC title

  • Drives, motors, controls or automatic cut-off devices for the entire printing mechanism · CPC title

  • B41J11/002Primary

    Curing or drying the ink on the copy materials, e.g. by heating or irradiating · CPC title

Patent family

Related publications grouped by family.

External sources

Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US10286687B2 cover?
Curing apparatus, image forming apparatus and articles of manufacture are disclosed. An example curing apparatus includes a curing unit to heat an area adjacent a substrate travel path, the curing unit having a width less than a width of the substrate travel path, and a controller to reciprocate the curing unit within the substrate width.
Who is the assignee on this patent?
Hewlett Packard Development Co
What technology area does this patent fall under?
Primary CPC classification B41J11/002. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue May 14 2019 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).