Object stage and hot pressing apparatus

Patent metadata

Field	Value
Publication number	US-10286595-B2
Application number	US-201515320027-A
Country	US
Kind code	B2
Filing date	Jan 13, 2015
Priority date	Aug 20, 2014
Publication date	May 14, 2019
Grant date	May 14, 2019

Abstract

An object stage and a hot pressing apparatus are disclosed. The object stage includes a base (1) and a support device (2) fixed on the base (1), wherein the support device (2) includes a plurality of detachable support sub-devices (21); the support device is configured to allow a printed circuit board (3) with at least one protruding structure (4) to be placed thereon, and no support sub-device (21) is disposed at a position on the support device (2) corresponding to the protruding structure (1). The object stage reduces manufacture cost, saves production time and improves production efficiency.

First claim

The invention claimed is:

1. An object stage, comprising a base and a support device fixed on the base, wherein
the support device comprises a plurality of detachable support sub-devices; and
the support device is configured to allow a printed circuit board (PCB) with at least one protruding structure to be placed thereon, and no support sub-device is disposed at a position on the support device corresponding to the protruding structure,
wherein the base is provided with an electromagnetic coil on its external surface,
wherein the electromagnetic coil is configured to provide the base and the support sub-device with opposite magnetic properties when powered on, so that the base and the support sub-devices are attracted with each other, and
wherein the electromagnetic coil is further configured to demagnetize both of the base and the support sub-devices when powered off, so that the base and the support sub-devices are no longer attracted with each other.

2. The object stage of claim 1 , wherein
the base is provided with location holes while each of the support sub-devices is provided with a location structure cooperated with one of the location holes in a manner of engaging the location structure into the location hole to fix the support sub-devices onto the base; or
the base is provided with location structures while each of the support sub-devices is provided with a location hole cooperated with one of the location structures in a manner of engaging the location structure into the location hole to fix the support sub-devices on the base.

3. The object stage of claim 2 , wherein the location structure is clipped into the location hole.

4. The object stage of claim 1 , wherein a rim is further disposed at an edge of the base and configured to block the support sub-devices so as to prevent the support sub-devices from falling off the base.

5. The object stage of claim 4 , wherein a height of the rim is less than that of the support sub-device.

6. The object stage of claim 1 , wherein the base is provided with first vacuum holes, the support sub-devices are provided with second vacuum holes, and the first vacuum holes are disposed opposite to the second vacuum holes respectively; and
the first vacuum holes and the second vacuum holes form vacuum air paths which are configured to absorb the PCB under a vacuum state.

7. The object stage of claim 6 , wherein the first vacuum holes and the second vacuum holes are evenly distributed.

8. The object stage of claim 6 , wherein orthographic projections of the second vacuum holes on the base are exactly consistent with the first vacuum holes, respectively.

9. The object stage of claim 1 , wherein an area of an orthographic projection of the support device on the base is less than or equal to an area of a supporting surface of the base.

10. A hot pressing apparatus, comprising an object stage, the object stage comprises a base and a support device fixed on the base, wherein
the support device comprises a plurality of detachable support sub-devices; and
the support device is configured to allow a printed circuit board (PCB) with at least one protruding structure to be placed thereon, and no support sub-device is disposed at a position on the support device corresponding to the protruding structure,
wherein the base is provided with an electromagnetic coil on its external surface,
wherein the electromagnetic coil is configured to provide the base and the support sub-device with opposite magnetic properties when powered on, so that the base and the support sub-devices are attracted with each other, and
wherein the electromagnetic coil is further configured to demagnetize both of the base and the support sub-devices when powered off, so that the base and the support sub-devices are no longer attracted with each other.

11. The hot pressing apparatus of claim 10 , wherein
the base is provided with location holes while each of the support sub-devices is provided with a location structure cooperated with one of the location holes in a manner of engaging the location structure into the location hole to fix the support sub-devices onto the base; or
the base is provided with location structures while each of the support sub-devices is provided with a location hole cooperated with one of the location structures in a manner of engaging the location structure into the location hole to fix the support sub-devices on the base.

12. The hot pressing apparatus of claim 10 , wherein the base is provided with first vacuum holes, the support sub-devices are provided with second vacuum holes, and the first vacuum holes are disposed opposite to the second vacuum holes respectively; and
the first vacuum holes and the second vacuum holes form vacuum air paths which are configured to absorb the PCB under a vacuum state.

13. The hot pressing apparatus of claim 11 , wherein the base is provided with first vacuum holes, the support sub-devices are provided with second vacuum holes, and the first vacuum holes are disposed opposite to the second vacuum holes respectively; and
the first vacuum holes and the second vacuum holes form vacuum air paths which are configured to absorb the PCB under a vacuum state.

14. The object stage of claim 2 , wherein the base is provided with first vacuum holes, the support sub-devices are provided with second vacuum holes, and the first vacuum holes are disposed opposite to the second vacuum holes respectively; and
the first vacuum holes and the second vacuum holes form vacuum air paths which are configured to absorb the PCB under a vacuum state.

15. The hot pressing apparatus of claim 11 , wherein the location structure is clipped into the location hole.

Assignees

• Boe Technology Group Co Ltd

Inventors

• Chen Lei

Classifications

• H05K2203/0113

  Female die used for patterning or transferring, e.g. temporary substrate having recessed pattern · CPC title

• B29C51/261 Primary

  Handling means, e.g. transfer means, feeding means (B29C51/44 takes precedence) · CPC title

• H05K3/323

  by applying an anisotropic conductive adhesive layer over an array of pads · CPC title

• B29L2031/3425

  Printed circuits · CPC title

• H05K2203/085

  Using vacuum or low pressure · CPC title