Recovery method for abrasive

Patent metadata

Field	Value
Publication number	US-10286522-B2
Application number	US-201615556910-A
Country	US
Kind code	B2
Filing date	Mar 9, 2016
Priority date	Mar 19, 2015
Publication date	May 14, 2019
Grant date	May 14, 2019

Abstract

A method for collecting an abrasive from an abrasive slurry which has been used for polishing an object including silicon as a main component includes: (i) adding a solvent to the abrasive slurry; (ii) dissolving particles of the polished object among components of the polished object contained in the abrasive slurry; and (iii) filtering the abrasive slurry to collect the abrasive, in which the steps (i) to (iii) are carried out without a pH adjuster to remove components of the polished object to collect the abrasive.

First claim

The invention claimed is:

1. is allowable over the prior art of record because the teachings of the references taken as a whole do not show or render obvious the combination set forth, including: (1) A method for collecting an abrasive from an abrasive slurry which has been used for polishing an object including silicon as a main component, the method at least comprising: (i) adding a solvent to the abrasive slurry, the abrasive slurry comprising an abrasive, components of the polished object, and a liquid; (ii) dissolving particles of the polished object among the components of the polished object contained in the abrasive slurry; and (iii) filtering the abrasive slurry to separate a filtrate from a concentrate; and (iv) collecting the concentrate to collect the abrasive, wherein the steps (i) to (iii) are carried out without a pH adjuster to remove the components of the polished object to collect the abrasive; and wherein adjusting an amount of the solvent added in the steps (i) and (ii) is adjusted in accordance with the concentration of the components of the polished object contained in the abrasive slurry; and (vi) analyzing the abrasive slurry prior to step (i) for a concentration of components of the polished object in the abrasive slurry which is used for polishing an object.

2. The method according to claim 1 , wherein the solvent is added to the abrasive slurry so that the concentration of the components of the polished object becomes, at the most, 1.8 times a saturation solubility of the polished object.

3. The method according to claim 1 , wherein, in the step (ii), heating is carried out after the solvent is added to the abrasive slurry.

4. The method according to claim 3 , wherein the heating is carried out so that a temperature of the abrasive slurry comes within a range between 40° C. and 90° C.

5. The method according to claim 1 , wherein the liquid comprises a liquid used for washing the object after polishing the object.

6. The method according to claim 1 , wherein the liquid comprises a liquid added to the abrasive slurry before polishing the object.

7. The method according to claim 1 , wherein the abrasive slurry in the step (i) is obtained directly after polishing the object without subjecting the abrasive slurry to any other steps.

8. The method according to claim 1 , wherein the abrasive slurry in the step (i) is obtained directly after polishing the object and subjecting the abrasive slurry to a filtration step with a filter of 20 to 100 μm.

Assignees

• Konica Minolta Inc

Inventors

• Inui Chie
• Maezawa Akihiro
• Nagai Yuuki
• Hirayama Natsumi

Classifications

• B24B37/02

  designed for working surfaces of revolution · CPC title

• B24B57/02 Primary

  for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents · CPC title

• B24B57/00 Primary

  Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents (for abrasive blasting B24C1/00, B24C7/00) · CPC title

• B24B37/24

  characterised by the composition or properties of the pad materials · CPC title

• B24B37/34

  Accessories · CPC title