Throw-away tip

US10286455B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10286455-B2
Application numberUS-201515027394-A
CountryUS
Kind codeB2
Filing dateJul 31, 2015
Priority dateSep 5, 2014
Publication dateMay 14, 2019
Grant dateMay 14, 2019

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  1. Title

    What the patent document calls the invention.

  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

There is provided a throw-away tip which includes a blade containing diamond and is excellent in chip processability. The throw-away tip comprises a body and a blade provided to the body and having a cutting edge, the blade containing 80% by volume or more of diamond, the blade having a land surface extending along the cutting edge, and a chip breaker having a recess located opposite to the cutting edge with the land surface therebetween, the recess having a side surface having an inclined surface that recedes continuously as a distance thereof from the land surface increases in magnitude and that has a shape identical to that of a portion of a side surface of a shape of a body of revolution.

First claim

Opening claim text (preview).

The invention claimed is: 1. A throw-away tip comprising a body and a blade provided to the body and having a cutting edge, the blade containing 80% by volume or more of diamond, the blade having a land surface extending along the cutting edge, and a chip breaker having a recess located opposite to the cutting edge with the land surface therebetween, the recess having a side surface having a rake face that recedes continuously from the land surface as a distance toward a center of the blade increases in magnitude, wherein the rake face has a shape identical to a portion of a side surface of a cone; the blade has a corner; the recess has on the side surface of the recess a projection formed along a bisector of an angle of the corner; the projection has a height in a range of 20% or more and 80% or less relative to a maximum depth of the recess; the maximum depth of the recess is a maximum value of a distance to a bottom of the recess from a plane assumed when the land surface is extended to above the recess; and the cone has an axis on the bisector of the angle of the corner of the blade. 2. The throw-away tip according to claim 1 , wherein an angle of inclination of the rake face relative to the land surface is in a range of 15° or more and 50° or less. 3. The throw-away tip according to claim 1 , wherein the land surface has a width in a direction perpendicular to the cutting edge in a range of 10 μm or more and 100 μm or less. 4. The throw-away tip according to claim 1 , wherein the recess has a maximum depth in a range of 60 μm or more and 300 μm or less. 5. The throw-away tip according to claim 1 , wherein the recess has a width in a direction perpendicular to the cutting edge in a range of 0.2 mm or more and 1.0 mm or less. 6. The throw-away tip according to claim 1 , wherein when the projection is seen in a cross section to which the bisector of the angle of the corner is a normal, the projection has a cross sectional shape increasing in width as the recess becomes deeper; and the cross sectional shape in a widthwise direction has a minimum value in a range of 5 μm or more and 40 μm or less. 7. The throw-away tip according to claim 1 , wherein the projection has a length in a direction along the bisector of the angle of the corner in a range of 0.2 mm or more and 1.0 mm or less. 8. The throw-away tip according to claim 1 , wherein: the land surface has a surface roughness in a range of 0.05 μm or more and 0.2 μm or less; and the rake face has a surface roughness in a range of 2 μm or more and 7 μm or less. 9. The throw-away tip according to claim 1 , wherein the diamond is single crystal diamond synthesized by vapor deposition. 10. The throw-away tip according to claim 9 , wherein the single crystal diamond has an absorption coefficient in a range of 2 cm −1 or more and 90 cm −1 or less for laser light of 190 μm or more and 11000 μm or less in wavelength. 11. The throw-away tip according to claim 1 , wherein the land surface, the rake face, the projection, a breaker wall surface, and an upper surface are arranged in order along the bisector, and wherein a width of the rake face along the bisector is larger than a width of the breaker wall surface along the bisector. 12. The throw-away tip according to claim 1 , wherein the land surface, the rake face, the projection, a breaker wall surface, and an upper surface are arranged in order along the bisector, and wherein a width of the rake face and the breaker wall surface along the bisector is greater than a width of the land surface along the bisector. 13. The throw-away tip according to claim 1 , wherein the rake face is linear along the bisector.

Assignees

Inventors

Classifications

  • polycrystalline [PCD] · CPC title

  • B23B27/20Primary

    with diamond bits {or cutting inserts} · CPC title

  • B23B27/143Primary

    characterised by having chip-breakers · CPC title

  • applied by chemical vapour deposition [CVD] · CPC title

  • Diamond · CPC title

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Frequently asked questions

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What does patent US10286455B2 cover?
There is provided a throw-away tip which includes a blade containing diamond and is excellent in chip processability. The throw-away tip comprises a body and a blade provided to the body and having a cutting edge, the blade containing 80% by volume or more of diamond, the blade having a land surface extending along the cutting edge, and a chip breaker having a recess located opposite to the cut…
Who is the assignee on this patent?
Sumitomo Electric Hardmetal Corp
What technology area does this patent fall under?
Primary CPC classification B23B27/20. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue May 14 2019 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 2 related publications on this page (citations in our corpus or others sharing the same primary CPC).