Electronic device enclosures having a monolithic appearance

Patent metadata

Field	Value
Publication number	US-10283898-B2
Application number	US-201815974185-A
Country	US
Kind code	B2
Filing date	May 8, 2018
Priority date	Sep 8, 2017
Publication date	May 7, 2019
Grant date	May 7, 2019

Abstract

An enclosure for an AC to DC adapter has a continuous and apparently monolithic exterior appearance. The enclosure includes a housing and a cap that are joined together by one or more weld joints. The weld joints create flash on the exterior surface of the enclosure and the flash is removed by forming a chamfer along the weld joint such that it removes a portion of the housing and the cap.

First claim

What is claimed is:

1. An enclosure for an electronic assembly, the enclosure having a seamless exterior appearance and comprising:
a housing including a bottom wall and at least one side wall extending from the bottom wall, the at least one side wall having a distal end portion and an interior surface opposite an exterior surface;
a cap comprising:
an outer surface opposite an inner surface; and
a perimeter region coupled to the distal end portion of the at least one side wall;
wherein the cap, the bottom wall, and the at least one side wall define a cavity sized and shaped to accommodate the electronic assembly;

a first weld joint formed between the distal end portion and the perimeter region and located adjacent the exterior surface of the housing and the outer surface of the cap;
a second weld joint formed between the distal end portion and the perimeter region and located adjacent the interior surface of the housing and the inner surface of the cap, wherein the first weld joint, the second weld joint, the cap and the housing define a central flash trap; and
a chamfer formed along a length of the first weld joint and extending across a portion of the exterior surface of the at least one side wall and a portion of the outer surface of the cap.

2. The enclosure of claim 1 wherein the central flash trap includes welding flash from the first and the second weld joints.

3. The enclosure of claim 1 , wherein the central flash trap is defined by the at least one side wall of the housing and the cap.

4. The enclosure of claim 1 wherein the first weld joint is formed along an entire perimeter of the at least one side wall and an entire perimeter region of the cap such that a liquid-tight interface is formed between the housing and the cap.

5. The enclosure of claim 1 further comprising an interior flash trap defined by the second weld joint, the interior surface of the at least one side wall and the inner surface of the cap.

6. The enclosure of claim 1 wherein the electronic assembly comprises an AC to DC converter.

7. The enclosure of claim 1 wherein the cap includes an aperture sized to receive a DC connector from the electronic assembly.

8. An enclosure for an electronic assembly, the enclosure having a seamless exterior appearance and comprising:
a housing including a bottom wall and at least one side wall extending from the bottom wall, the at least one side wall having a distal end portion and an interior surface opposite an exterior surface;
a cap comprising:
an outer surface opposite an inner surface; and
a perimeter region coupled to the distal end portion of the at least one side wall;
wherein the cap, the bottom wall, and the at least one side wall define a cavity sized and shaped to accommodate the electronic assembly;

a first weld joint formed between the distal end portion and the perimeter region and located adjacent the exterior surface of the housing and the outer surface of the cap;
a chamfer formed along a length of the first weld joint and extending across a portion of the exterior surface of the at least one side wall and a portion of the outer surface of the cap; and
a second weld joint formed between the distal end portion and the perimeter region and located adjacent the interior surface of the housing and the inner surface of the cap;
wherein the second weld joint, the interior surface of the at least one side wall and the inner surface of the cap define an interior flash trap that contains welding flash from the second weld joint.

9. The enclosure of claim 8 wherein the first weld joint is formed along an entire perimeter of the at least one side wall and an entire perimeter region of the cap such that a liquid-tight interface is formed between the housing and the cap.

10. The enclosure of claim 9 further comprising a central flash trap defined by the first and the second weld joints, the cap and the at least one side wall.

11. The enclosure of claim 10 wherein the central flash trap includes welding flash from the first and the second weld joints.

12. The enclosure of claim 9 , further comprising a polished region formed along a length the first weld joint and extending across a portion of the exterior surface of the housing and a portion of the outer surface of the cap.

13. The enclosure of claim 8 wherein the first weld joint is not visible when viewing an exterior of the enclosure.

14. The enclosure of claim 8 wherein the electronic assembly is an AC to DC converter.

15. The enclosure of claim 14 wherein at least two electrical prongs extend through the bottom wall and are coupled to the AC to DC converter.

16. The enclosure of claim 14 wherein an electrical connector extends through the cap and is coupled to the AC to DC converter.

17. A method of forming an electronic device having a seamless exterior appearance, the method comprising:
forming a housing having a bottom wall and at least one side wall extending from the bottom wall, the at least one side wall including a distal end portion having a curved tip, and wherein the bottom wall is formed around at least two electrical prongs extending through the bottom wall;
disposing an electronic assembly within the housing such that the electronic assembly is electrically coupled to the at least two electrical prongs;
positioning a cap on the housing such that the curved tip of the at least one sidewall is in contact with a curved profile of a perimeter region of the cap; and
forming a first weld joint between the distal end portion of the at least one side wall and the perimeter region of the cap, wherein the cap, the bottom wall, and the at least one side wall define a cavity in which the electronic assembly positioned thereby forming a first flash formation on an exterior portion of the first weld joint and a second flash formation on an interior portion of the first weld joint; and
forming a chamfer along a length the first weld joint such that the first flash formation, a portion of the housing and a portion of the cap are removed.

18. The method of claim 17 wherein the first weld joint is formed by ultrasonic welding.

19. The method of claim 17 further comprising forming a second weld joint between the at least one side wall and the cap simultaneously with forming the first weld joint.

20. The method of claim 19 wherein the first and second weld joints are separated by a flash trap that receives flash from the first and the second weld joints.

Assignees

• Apple Inc

Inventors

• Heyman Ross C
• Castillo Alfredo
• Varma Arun R

Classifications

• B29D99/006

  Producing casings, e.g. accumulator cases · CPC title

• H02M7/003

  Constructional details, e.g. physical layout, assembly, wiring or busbar connections · CPC title

• B29C66/24244

  forming a rectangle · CPC title

• B29C37/04

  of welded articles, e.g. deburring or deflashing in combination with welding {(shaping the burr B29C66/32)} · CPC title

• B29C66/1222

  comprising at least a lapped joint-segment · CPC title