Photovoltaic devices including nitrogen-containing metal contact
US-2015380601-A1 · Dec 31, 2015 · US
US10283668B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10283668-B2 |
| Application number | US-201615229604-A |
| Country | US |
| Kind code | B2 |
| Filing date | Aug 5, 2016 |
| Priority date | Aug 4, 2010 |
| Publication date | May 7, 2019 |
| Grant date | May 7, 2019 |
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A Schottky-barrier-reducing layer is provided between a p-doped semiconductor layer and a transparent conductive material layer of a photovoltaic device. The Schottky-barrier-reducing layer can be a conductive material layer having a work function that is greater than the work function of the transparent conductive material layer. The conductive material layer can be a carbon-material layer such as a carbon nanotube layer or a graphene layer. Alternately, the conductive material layer can be another transparent conductive material layer having a greater work function than the transparent conductive material layer. The reduction of the Schottky barrier reduces the contact resistance across the transparent material layer and the p-doped semiconductor layer, thereby reducing the series resistance and increasing the efficiency of the photovoltaic device.
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What is claimed is: 1. A method of forming a photovoltaic device comprising: forming a transparent conductive material layer on a substrate; forming a Schottky-barrier-reducing layer directly on said transparent conductive material layer, wherein said Schottky-barrier-reducing layer is an optically transparent layer consisting essentially of single wall carbon nanotubes; and forming a p-doped semiconductor layer directly on said Schottky-barrier-reducing layer, wherein a Schottky barrier across a stack of said transparent conductive material layer, said Schottky-barrier-reducing layer, and said p-doped semiconductor layer has a lower contact resistance than a Schottky barrier across a comparative exemplary stack that includes all layers of said stack less said Schottky-barrier-reducing layer; forming an intrinsic semiconductor layer directly on said p-doped semiconductor layer; forming an n-doped semiconductor layer that contacts said intrinsic semiconductor layer; and forming a back reflector layer that is in direct contact with said n-doped semiconductor layer. 2. The method of claim 1 , wherein said transparent conductive material layer comprises aluminum-doped zinc oxide. 3. The method of claim 1 , wherein said transparent conductive material layer comprises fluorine-doped tin oxide. 4. The method of claim 1 , wherein said Schottky-barrier-reducing layer has a higher resistivity than a material of said transparent conductive material layer. 5. The method of claim 1 , wherein said Schottky-barrier-reducing layer has a work function that is greater than a work function of said transparent conductive material layer and is lesser than an absolute value of a Fermi level energy of said p-doped semiconductor layer. 6. The method of claim 1 , wherein said intrinsic semiconductor layer includes a hydrogenated amorphous intrinsic semiconductor material. 7. The method of claim 1 , wherein said n-doped semiconductor layer includes hydrogenated n-doped amorphous semiconductor material. 8. The method of claim 1 , wherein the p-doped semiconductor layer comprises a p-doped silicon material. 9. The method of claim 1 , further comprising forming a metallic back reflector layer directly on said back reflector layer. 10. The method of claim 1 , wherein said back reflector layer is optically transparent and comprises n-type materials. 11. The method of claim 1 , wherein said n-doped semiconductor layer is formed directly on said intrinsic semiconductor layer. 12. The method of claim 11 , wherein the back reflector layer comprises a transparent conductive oxide.
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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