Fan-out semiconductor package and photosensitive resin composition

Patent metadata

Field	Value
Publication number	US-10283426-B2
Application number	US-201715637725-A
Country	US
Kind code	B2
Filing date	Jun 29, 2017
Priority date	Oct 10, 2016
Publication date	May 7, 2019
Grant date	May 7, 2019

Abstract

A fan-out semiconductor package includes: a semiconductor chip having an active surface with connection pads disposed thereon and an inactive surface opposing the active surface; an encapsulant encapsulating at least portions of the semiconductor chip; and a first connection member disposed on the active surface of the semiconductor chip, wherein the encapsulant is a cured photosensitive resin composition including a thermosetting resin, a carboxylic resin, an ethylenically unsaturated compound, and a reinforcing agent. The photosensitive resin composition may be used in the fan-out semiconductor package.

First claim

What is claimed is:

1. A fan-out semiconductor package comprising:
a semiconductor chip having an active surface with connection pads disposed thereon and an inactive surface opposing the active surface;
an encapsulant encapsulating at least portions of the semiconductor chip; and
a first connection member disposed on the active surface of the semiconductor chip,
wherein the encapsulant includes a cured photosensitive resin composition including 7 to 12 wt % of thermosetting resin, 12 to 20 wt % of carboxylic resin, 2 to 4 wt % ethylenically unsaturated compound, and 60 to 70 wt % reinforcing agent, based on a total weight of the photosensitive resin composition.

2. The fan-out semiconductor package of claim 1 , wherein the carboxylic resin has a thermosetting reaction group and an ethylenically unsaturated group.

3. The fan-out semiconductor package of claim 1 , wherein the thermosetting resin includes an epoxy resin,
the carboxylic resin includes a carboxylic epoxy acrylate resin,
the ethylenically unsaturated compound includes an acrylate compound, and
the reinforcing agent includes an inorganic filler.

4. The fan-out semiconductor package of claim 3 , wherein the epoxy resin includes at least one of a bisphenol type epoxy resin and a biphenyl type epoxy resin.

5. The fan-out semiconductor package of claim 3 , wherein the carboxylic epoxy acrylate resin includes at least one of a carboxylic cresol novolac type epoxy acrylate resin and a carboxylic bisphenol type epoxy acrylate resin.

6. The fan-out semiconductor package of claim 3 , wherein the acrylate compound includes a multifunctional acrylate.

7. The fan-out semiconductor package of claim 3 , wherein the inorganic filler includes silica.

8. The fan-out semiconductor package of claim 1 , further comprising a second connection member having a through-hole,
wherein the semiconductor chip is disposed in the through-hole, and
the encapsulants fills a portion of the through-hole and is in physical contact with a side surface of the semiconductor chip connecting the inactive surface and the active surface of the semiconductor chip.

9. The fan-out semiconductor package of claim 8 , wherein the second connection member includes a first insulating layer, a first redistribution layer in contact with the first connection member and embedded in a first surface of the first insulating layer, a second redistribution layer disposed on a second surface of the first insulating layer opposing the first surface of the first insulating layer, and a first via penetrating through the first insulating layer, having a width smaller than a width of the first redistribution layer and a width of the second redistribution layer, and connecting the first and second redistribution layers to each other, and
the first and second redistribution layers are electrically connected to the connection pads.

10. The fan-out semiconductor package of claim 9 , wherein the second connection member further includes a second insulating layer disposed on the first insulating layer and covering the second redistribution layer, a third redistribution layer disposed on the second insulating layer, and a second via penetrating through the second insulating layer, having a width smaller than the width of the second redistribution layer and a width of the third redistribution layer, and connecting the second and third redistribution layers to each other, and
the third redistribution layer is electrically connected to the connection pads.

11. The fan-out semiconductor package of claim 8 , wherein the second connection member includes a first insulating layer, a first redistribution layer and a second redistribution layer disposed on opposite surfaces of the first insulating layer, respectively, a second insulating layer disposed on the first insulating layer and covering the first redistribution layer, and a third redistribution layer disposed on the second insulating layer, and
the first to third redistribution layers are electrically connected to the connection pads.

12. The fan-out semiconductor package of claim 11 , wherein the second connection member further includes a third insulating layer disposed on the first insulating layer and covering the second redistribution layer and a fourth redistribution layer disposed on the third insulating layer, and
the fourth redistribution layer is electrically connected to the connection pads.

13. A photosensitive resin composition comprising:
7 to 12 wt % thermosetting resin, 12 to 20 wt % carboxylic resin, 2 to 4 wt % ethylenically unsaturated compound, and 60 to 70 wt % reinforcing agent, based on a total weight of the photosensitive resin composition.

14. The photosensitive resin composition of claim 13 , further comprising:
an initiator; and
a solvent.

15. The photosensitive resin composition of claim 14 , wherein the thermosetting resin includes an epoxy resin,
the carboxylic resin includes a carboxylic epoxy acrylate resin,
the ethylenically unsaturated compound includes an acrylate compound,
the reinforcing agent includes an inorganic filler, and
the initiator includes a photopolymerization initiator.

16. The photosensitive resin composition of claim 15 , wherein a content of the inorganic filler is 60 wt % or more, based on the total weight of the photosensitive resin composition.

17. The photosensitive resin composition of claim 14 , wherein the photosensitive resin composition includes:
0.3 to 0.6 wt % of the initiator, and 0 to 12 wt % of the solvent, based on the total weight of the photosensitive resin composition.

Assignees

• Samsung Electro Mech

Inventors

• Yun Geum Hee
• Lee Hwa Young
• Lee Su Yeon
• Park Yong Jin
• Yoon Soo Young

Classifications

• G03F7/004

  Photosensitive materials (G03F7/12, G03F7/14 take precedence) · CPC title

• H05K3/287

  Photosensitive compositions · CPC title

• H05K3/284

  for encapsulating mounted components (H05K1/185 takes precedence) · CPC title

• G03F7/0388

  with ethylenic or acetylenic bands in the side chains of the photopolymer · CPC title

• H10W90/734

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title