Lighting device and corresponding manufacturing method

Patent metadata

Field	Value
Publication number	US-10281090-B2
Application number	US-201815877409-A
Country	US
Kind code	B2
Filing date	Jan 23, 2018
Priority date	Jan 24, 2017
Publication date	May 7, 2019
Grant date	May 7, 2019

Abstract

A lighting device comprising: an elongated laminar substrate having opposed front and back surfaces, one or more electrically-powered light radiation sources, e.g. LED sources, at the front surface of the substrate, a protective encapsulation sealingly encapsulating the substrate and the light radiation source(s), the encapsulation being light-permeable to facilitate propagation of light radiation from the device. The encapsulation includes thermally-conductive material at the back surface of the substrate.

First claim

The invention claimed is:

1. A lighting device, comprising:
an elongated laminar substrate having opposed front and back surfaces,
at least one electrically-powered light radiation source at the front surface of the substrate,
a protective encapsulation sealingly encapsulating the substrate and the at least one light radiation source, the encapsulation being light-permeable at the at least one light radiation source to facilitate propagation of light radiation from the device, the encapsulation including thermally-conductive material facing the back surface of the substrate;
wherein the encapsulation comprises a channel-shaped housing having a central wall and side walls laterally of the central wall, the housing including thermally-conductive material at the central wall,
the substrate with the at least one light radiation source is located in the channel-shape of the housing with the back surface of the substrate towards the central wall of the housing,
the encapsulation comprises a sealing mass extending over the front surface of the substrate and the at least one light radiation source from the one to the other of the side walls of the housing.

2. The lighting device of claim 1 , further comprising a flexible substrate encapsulated by a flexible encapsulation.

3. The lighting device of claim 1 , wherein the thermally-conductive material comprises a matrix having thermally-conductive particles dispersed therein.

4. The lighting device of claim 1 , further comprising a thermally-conductive layer between the back surface of the substrate and the encapsulation.

5. The lighting device of claim 1 , wherein:
the encapsulation further comprises a sealing mass extending over the at least one light radiation source from the one to the other of the side walls of the housing.

6. The lighting device of claim 1 , wherein the side walls of the housing comprises mutually facing light-reflective surfaces.

7. The lighting device of claim 1 , wherein the at least one light radiation source comprises an LED source.

8. A method of manufacturing a lighting device, the method comprising:
providing an elongated laminar substrate having opposed front and back surfaces,
providing at least one electrically-powered light radiation source at the front surface of the substrate,
sealingly encapsulating the substrate and the at least one light radiation source with a protective encapsulation light-permeable at the at least one light radiation source to facilitate propagation of light radiation from the device,
including thermally-conductive material in the encapsulation at a position facing the back surface of the substrate;
providing a channel-shaped mould comprising a bottom wall, lateral walls extending sidewise of the bottom wall and a pair of ribs protruding from the bottom wall inwardly of the channel shape of the mould, the ribs defining a central mould cavity therebetween and a pair of lateral mould cavities between the protruding ribs and the lateral walls of the mould,
dispensing thermally-conductive material into the central mould cavity to provide a thermally-conductive filling therein,
coupling the laminar substrate with the thermally-conductive filling in the central mould cavity,
dispensing into the mould a sealing mass to sealingly cover the front surface of the substrate.

9. The method of claim 8 , further comprising:
dispensing into the mould a sealing mass to sealingly cover the at least one light radiation source, the sealing mass penetrating into said lateral mould cavities to provide side extensions of the sealing mass sidewise of and spaced to the thermally-conductive material in the central mould cavity,
disengaging from the mould the laminar substrate with the at least one light radiation source thereon coupled with said thermally-conductive material and said sealing mass, and
dispensing into the spacings between the thermally-conductive material and said side extensions of the sealing mass one of:
a transparent or light diffusive material, or
a thermally-conductive material.

10. The method of claim 8 , wherein the thermally-conductive material further comprises a matrix having thermally-conductive particles dispersed therein.

11. A lighting device, comprising:
an elongated laminar substrate having opposed front and back surfaces,
at least one electrically-powered light radiation source at the front surface of the substrate,
a protective encapsulation sealingly encapsulating the substrate and the at least one light radiation source, the encapsulation being light-permeable at the at least one light radiation source to facilitate propagation of light radiation from the device, the encapsulation including thermally-conductive material facing the back surface of the substrate;
a channel-shaped mould comprising a bottom wall and lateral walls which extend sidewise of the bottom wall and a pair of ribs which protrude from the bottom wall inwardly of the channel shape of the mould,
wherein the ribs define a central mould cavity therebetween and a pair of lateral mould cavities between the protruding ribs and the lateral walls of the mould,
a thermally-conductive material is arranged in the central mould cavity,
wherein the laminar substrate and the thermally-conductive material in the central mould cavity are coupled,
wherein a sealing mass is arranged to sealingly cover the front surface of the substrate.

12. The lighting device of claim 11 ,
wherein the sealing mass is further arranged to sealingly cover the at least one light radiation source,
wherein the sealing mass is arranged such that it penetrates into the lateral mould cavities to provides side extensions of the sealing mass sidewise of the thermally-conductive material in the central mould cavity and spaced to the thermally-conductive material in the central mould cavity,
wherein the laminar substrate with the at least one light radiation source coupled with the thermally conductive material and the sealing mass is disengagable from the mould, and
wherein, one of:
a transparent or light diffusive material, or
a thermally-conductive material,

is arranged between the thermally conductive material and the side extensions of the sealing mass.

Assignees

• Osram Gmbh

Inventors

• Reiss Martin
• Didone' Roberto
• Pezzato Luigi
• Baldo Lorenzo

Classifications

• F21V29/87

  Organic material, e.g. filled polymer composites; Thermo-conductive additives or coatings therefor · CPC title

• F21S4/22

  flexible or deformable, e.g. into a curved shape · CPC title

• F21V31/04

  Provision of filling media · CPC title

• F21Y2115/10

  Light-emitting diodes [LED] · CPC title

• F21S4/20

  with light sources held by or within elongate supports · CPC title