Method and composition for depolymerization of cured epoxy resin materials

Patent metadata

Field	Value
Publication number	US-10280534-B2
Application number	US-201816126580-A
Country	US
Kind code	B2
Filing date	Sep 10, 2018
Priority date	Jul 22, 2015
Publication date	May 7, 2019
Grant date	May 7, 2019

Abstract

A cured epoxy resin material is depolymerized by using a composition including a compound represented by the chemical formula of XO m Y n (wherein X is hydrogen, alkali metal or alkaline earth metal, Y is halogen, m is a number satisfying 1≤m≤8 and n is a number satisfying 1≤n≤6), and a reaction solvent, wherein X is capable of being dissociated from XO m Y n and Y radical is capable of being produced from XO m Y n in the reaction solvent. It is possible to carry out depolymerization of a cured epoxy resin material, for example, at a temperature of 200° C., specifically 100° C. or lower, and to reduce processing cost and energy requirement. It is also possible to substitute for a reaction system using an organic solvent as main solvent, so that the contamination problems caused by the organic solvent functioning as separate contamination source may be solved and environmental contamination or pollution may be minimized.

First claim

What is claimed is:

1. A method for depolymerization of a cured epoxy resin material, comprising:
depolymerizing a cured epoxy resin material by using a composition for depolymerization of a cured epoxy resin material,
the composition comprising a compound represented by a chemical formula of XO m Y n wherein X is hydrogen, alkali metal or alkaline earth metal, Y is halogen, m is a number satisfying 1≤m≤8 and n is a number satisfying 1≤n≤6; and a reaction solvent; wherein X is capable of being dissociated from XO m Y n and Y radical is capable of being produced from XO m Y n in the reaction solvent.

2. The method according to claim 1 , wherein the reaction solvent has a dielectric constant of at least about 65 or at least about 70 or at least about 75 or at least about 80.

3. The method according to claim 1 , wherein the reaction solvent is a H 2 O-based reaction solvent that comprises H 2 O and has a dielectric constant of at least 65 or at least 70 or at least 75 or at least 80.

4. The method according to claim 1 , wherein the composition for depolymerization is an aqueous solution containing the compound.

5. The method according to claim 1 , wherein the depolymerization is carried out at a temperature of 20-200° C. or 20-100° C.

6. The method according to claim 1 , wherein the cured epoxy resin material is used in an amount of 1-90 parts by weight based on 100 parts by weight of the composition for depolymerization.

7. The method according to claim 1 , wherein the method for depolymerization of a cured epoxy resin material further comprises repeating depolymerization by adding a new cured epoxy resin material to the reaction solvent remaining after depolymerizing the cured epoxy resin material.

8. The method according to claim 1 , wherein the method for depolymerization of a cured epoxy resin material further comprises pretreating the cured epoxy resin material before subjecting the cured epoxy resin material to depolymerization in such a manner that the cured epoxy resin material has an increased reaction surface area.

9. The method according to claim 8 , wherein the pretreatment is physical pretreatment, chemical pretreatment or a combination thereof.

10. The method according to claim 9 , wherein the physical pretreatment is at least one selected from the group consisting of dry crushing and wet crushing.

11. The method according to claim 9 , wherein the chemical pretreatment is carried out by dipping the cured epoxy resin material into an acidic composition.

12. The method according to claim 1 , wherein the method for depolymerization of a cured epoxy resin material further comprises preparing the compound represented by the formula of XO m Y n .

13. The method according to claim 12 , wherein the compound represented by the formula of XO m Y n is HOY (wherein Y is halogen), and an aqueous solution containing HOY compound is prepared by bubbling Y gas in water.

14. The method according to claim 12 , wherein the compound represented by the formula of XO m Y n is XOY (wherein X is an alkali metal and Y is halogen), and an aqueous solution containing XOY compound is prepared by electrolyzing XY in water.

15. The method according to claim 1 , wherein the method for depolymerization of a cured epoxy resin material comprises forming a compound represented by the formula of XO m Y n in a reactor for depolymerization of a cured epoxy resin material, and carrying out depolymerization of the cured epoxy resin material.

16. The method according to claim 1 , wherein the compound represented by the formula of XO m Y n is sodium hypochlorite (NaOCl), and the method comprises forming sodium hypochlorite (NaOCl) from a mixture of sodium hydroxide (NaOH) with chlorine (Cl 2 ) in a reactor for depolymerization of a cured epoxy resin material, and carrying out depolymerization of the cured epoxy resin material.

17. The method according to claim 1 , wherein the composition for depolymerization further comprises a radical-providing additive capable of accelerating radical production of XO m Y n .

18. The method according to claim 17 , wherein the radical-providing additive is at least one selected from the group consisting of radical-containing compounds or compounds producing radicals in a reaction system.

Assignees

• Korea Inst Sci & Tech

Inventors

• Goh Munju
• Ku Bon-Cheol
• You Nam Ho
• Youn Sang Jun
• Yeo Hyeonuk

Classifications

• C08J11/16 Primary

  by treatment with inorganic material (C08J11/14 takes precedence) · CPC title

• C01B32/184

  Preparation · CPC title

• C08K7/06

  Elements · CPC title

• C03C13/00

  Fibre or filament compositions (manufacture of fibres or filaments C03B37/00) · CPC title

• C08J2363/00

  Characterised by the use of epoxy resins; Derivatives of epoxy resins · CPC title