One-part curable adhesive composition and the use thereof

Patent metadata

Field	Value
Publication number	US-10280346-B2
Application number	US-201715789283-A
Country	US
Kind code	B2
Filing date	Oct 20, 2017
Priority date	Apr 30, 2015
Publication date	May 7, 2019
Grant date	May 7, 2019

Abstract

The present invention relates to a one-part curable adhesive composition, in particular, a one-part adhesive composition having excellent initial and aged lap shear strength as well as low viscosity, and to the use thereof.

First claim

What is claimed is:

1. A one-part curable adhesive composition, comprising:
(a) a non-toughened epoxy resin having two glycidyl groups in one molecule,
(b) a non-toughened epoxy resin having more than two glycidyl groups in one molecule,
(c) a toughened epoxy resin,
(d) a latent curing agent,
(e) a curing accelerator,
(f) an aging resistant agent; and
(g) a non-reactive diluent selected from the group consisting of mono(meth)acrylate, di(meth)acrylate, tri(meth)acrylate, tetra(meth)acrylate and combination thereof.

2. The one-part curable adhesive composition according to claim 1 , wherein the non-toughened epoxy resin having two glycidyl groups in one molecule is at least one of selected from the group consisting of bisphenol A based diglycidyl ethers, bisphenol F based diglycidyl ethers, bisphenol S based diglycidyl ethers, bisphenol Z based diglycidyl ethers, halides thereof and hydrides thereof, and combination thereof.

3. The one-part curable adhesive composition according to claim 1 , wherein the non-toughened epoxy resin having more than two glycidyl groups in one molecule is selected from the group consisting of a non-toughened epoxy resin having three glycidyl groups in one molecule and a non-toughened epoxy resin having four glycidyl groups in one molecule, and combination thereof.

4. The one-part curable adhesive composition according to claim 3 , wherein non-toughened epoxy resin having three glycidyl groups in one molecule is selected from the group consisting of N,N,O-triglycidyl-m-aminophenol, N,N,O-triglycidyl-p-aminophenol, fluoroglycinol triglycidyl ether, trihydroxybiphenyl triglycidyl ether, triglycidylaminophenol, and combination thereof.

5. The one-part curable adhesive composition according to claim 4 , wherein the non-toughened epoxy resin having four glycidyl groups in one molecule is selected from the group consisting of tetraglycidyldiaminodiphenylmethane, tetraglycidyl-m-xylenediamine, tetraglycidylbis(aminomethylcyclohexane), tetraglycidylbenzophenone, bisresorcinol tetraglycidyl ether, tetraglycidyl ether of methylene dianiline, and combination thereof.

6. The one-part curable adhesive composition according to claim 1 , wherein the toughened epoxy resin is an epoxy resin having two or more glycidyl groups modified by core-shell rubber particles or a carboxyl-terminated butadiene nitrile polymer.

7. The one-part curable adhesive composition according to claim 1 , wherein the latent curing agent is dicyandiamides.

8. The one-part curable adhesive composition according to claim 1 , wherein the curing accelerator is selected from the group consisting of tertiary amine, imidazole, urea derivative, and combination thereof.

9. The one-part curable adhesive composition according to claim 1 , wherein the aging resistant agent is selected from at least one of the group consisting of aminosalicylic acids, aminoisophthalic acids, carbodiimides, and derivatives thereof.

10. The one-part curable adhesive composition according to claim 1 , wherein the non-reactive diluent is selected from the group consisting of pentaerythritol tetracrylate, pentaerythritol triacrylate, 1,6-hexanediol diacrylate, 1,4-butanediol diacrylate, propoxylated glyceryl triacrylate, trimethylolpropane triacrylate, and combination thereof.

11. The one-part curable adhesive composition according to claim 1 , wherein the one-part curable adhesive composition optionally comprises a reactive diluent, a thixotropic agent, a silane coupling agent, a filler, and combination thereof.

12. The one-part curable adhesive composition according to claim 1 , wherein the component (a) is present in an amount of 10% to 50% by weight based on the total weight of all components of the composition.

13. The one-part curable adhesive composition according to claim 1 , wherein the component (b) is present in an amount of 5% to 20% by weight based on the total weight of all components of the composition.

14. The one-part curable adhesive composition according to claim 1 , wherein the component (c) is present in an amount of 10% to 50% by weight based on the total weight of all components of the composition.

15. The one-part curable adhesive composition according to claim 1 , wherein the component (d) is present in an amount of 2% to 20% by weight based on the total weight of all components of the composition.

16. The one-part curable adhesive composition according to claim 1 , wherein the component (e) is present in an amount of 0.1% to 5% by weight based on the total weight of all components of the composition.

17. The one-part curable adhesive composition according to claim 1 , wherein the component (f) is present in an amount of 0.1% to 5% by weight based on the total weight of all components of the composition.

18. The one-part curable adhesive composition according to claim 1 , wherein the component (g) is present in an amount of 1% to 20% by weight based on the total weight of all components of the composition.

19. The one-part curable adhesive composition according to claim 1 , comprising:
(a) 10% to 50% by weight of the non-toughened epoxy resin having two glycidyl groups in one molecule,
(b) 5% to 20% by weight of a non-toughened epoxy resin having more than two glycidyl groups in one molecule,
(c) 10% to 50% by weight of the toughened epoxy resin,
(d) 2% to 20% by weight of the latent curing agent,
(e) 0.1% to 5% by weight of the curing accelerator,
(f) 0.1% to 5% by weight of the aging resistant agent,
(g) 1% to 20% by weight of the non-reactive diluent,
(h) 0% to 5% by weight of a thixotropic agent,
(i) 0% to 5% by weight of a silane coupling agent,
(j) 0% to 20% by weight of a filler, and
(k) 0% to 15% by weight of a reactive diluent,

in which the weight ratios are based on the total weight of all components of the composition.

20. A method of bonding substrates together which comprises applying the one-part curable adhesive composition according to claim 1 to a first substrate, bringing a second substrate in contact with the adhesive composition applied to the first substrate, and subjecting the applied composition to conditions which allow the applied composition to be cured.

21. The method of bonding substrates together according to claim 20 , wherein the substrate is independently comprised of metals, glasses, resin-based composite materials or ceramics.

Assignees

• Henkel Ag & Co Kgaa

Inventors

• Wu Haiping
• Bachon Thomas
• Schonfeld Rainer
• Lin Xiaowei
• Cao Zhenfeng

Classifications

• C09J163/00 Primary

  Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins · CPC title

• C09J11/06

  organic · CPC title

• C09J5/00

  Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers · CPC title

• C08L63/00

  Compositions of epoxy resins; Compositions of derivatives of epoxy resins · CPC title

• C08G59/4021

  Ureas; Thioureas; Guanidines; Dicyandiamides · CPC title