Adhesive resin composition, adhesive film, and flexible metal laminate

Patent metadata

Field	Value
Publication number	US-10280343-B2
Application number	US-201515521359-A
Country	US
Kind code	B2
Filing date	Dec 8, 2015
Priority date	Dec 8, 2014
Publication date	May 7, 2019
Grant date	May 7, 2019

Abstract

The present invention relates to an adhesive resin composition including a styrene-ethylene-butylene-styrene copolymer with a specific chemical structure, an epoxy resin, an acid anhydride compound, and a curing catalyst, an adhesive film obtained from the resin composition, and a flexible metal laminate including the adhesive film.

First claim

What is claimed is:

1. An adhesive resin composition comprising: a styrene-ethylene-butylene-styrene copolymer to which 0.1 wt % to 15 wt % of dicarboxylic acid or an anhydride thereof is bonded;
an epoxy resin;
a curing catalyst comprising one or more compounds selected from the group consisting of an imidazole-based compound, an imine-based compound, and an amine-based compound; and
an acid anhydride compound,
wherein a weight ratio of the epoxy resin to the acid anhydride compound is 2.0 to 0.05, and wherein the adhesive resin composition has a dielectric constant (Dk) of 2.8 or less in a dried state and at 5 GHz.

2. The adhesive resin composition according to claim 1 ,
wherein the acid anhydride compound includes one or more compounds selected from the group consisting of a styrene-maleic anhydride copolymer, methyltetrahydrophthalic anhydride, phthalic anhydride, hexahydrophthalic anhydride, tetrahydrophthalic anhydride, methylhexahydrophthalic anhydride, methyl himic anhydride, nadic methyl anhydride, nadic anhydride, and dodecenyl succinic anhydride.

3. The adhesive resin composition according to claim 1 ,
wherein the dicarboxylic acid includes one or more selected from the group consisting of maleic acid, phthalic acid, itaconic acid, citraconic acid, alkenyl succinic acid, cis-1,2,3,6-tetrahydrophthalic acid, and 4-methyl-1,2,3,6-tetrahydrophthalic acid.

4. The adhesive resin composition according to claim 1 ,
wherein the styrene-ethylene-butylene-styrene copolymer to which 0.1 wt % to 15 wt % of dicarboxylic acid or an anhydride thereof is bonded has a weight average molecular weight of 30,000 to 800,000.

5. The adhesive resin composition according to claim 1 ,
wherein the styrene-ethylene-butylene-styrene copolymer to which 0.1 wt % to 15 wt % of dicarboxylic acid or an anhydride thereof is bonded comprises 5 to 50 wt % of styrene-derived repeat units.

6. The adhesive resin composition according to claim 1 ,
wherein the epoxy resin includes one or more selected from the group consisting of biphenyl novolac epoxy resin, bisphenol A epoxy resin, and dicylcopentadiene phenol epoxy resin.

7. The adhesive resin composition according to claim 1 ,
wherein the adhesive resin composition comprises, based on 100 parts by weight of the styrene-ethylene-butylene-styrene copolymer to which 0.1 wt % to 15 wt % of dicarboxylic acid or anhydride thereof is bonded:
10 to 80 parts by weight of the epoxy resin;
10 to 80 parts by weight of the acid anhydride compound; and
0.05 to 5 parts by weight of the curing catalyst comprising one or more compounds selected from the group consisting of an imidazole-based compound, an imine-based compound, and an amine-based compound.

8. The adhesive resin composition according to claim 1 ,
further comprising 50 to 1000 parts by weight of an organic solvent, based on 100 parts by weight of the styrene-ethylene-butylene-styrene copolymer.

9. The adhesive resin composition according to claim 8 ,
wherein a viscosity of the adhesive resin composition changes by a ratio of 2 times or less compared to the initial viscosity within 72 hours, when exposed to the outside at room temperature.

10. The adhesive resin composition according to claim 1 ,
wherein the adhesive resin composition has a dielectric loss factor (Df) of 0.010 or less in a dried state and at 5 GHz.

11. An adhesive film comprising a cured product of the adhesive resin composition of claim 1 , and having a dielectric constant (Dk) of 2.8 or less in a dried state and at 5 GHz.

12. The adhesive film according to claim 11 ,
wherein the adhesive film has a dielectric loss factor (Df) of 0.010 or less in a dried state and at 5 GHz.

13. The adhesive film according to claim 11 ,
wherein the adhesive film has a thickness of 1 μm to 100 μm.

14. The adhesive resin composition according to claim 2 ,
wherein the styrene-maleic anhydride copolymer has a weight average molecular weight of 1000 to 50,000.

15. The adhesive resin composition according to claim 2 ,
wherein the styrene-maleic anhydride copolymer comprises 50 wt % to 95 wt % of styrene-derived repeat units.

16. A flexible metal laminate comprising: a polyimide resin film;
a metal thin film comprising one or more selected from the group consisting of copper, iron, nickel, titanium, aluminum, silver, gold, and alloys of two or more kinds thereof; and
the adhesive film of claim 14 formed between the polyimide film and the metal thin film.

17. The flexible metal laminate according to claim 16 ,
wherein the polyimide resin film has a thickness of 1 μm to 50 μm, and
the polyimide resin film contains 5 to 75 wt % of a fluorine-based resin.

18. The flexible metal laminate according to claim 16 ,
wherein the adhesive film has a dielectric constant (Dk) of 2.2 to 2.8 in a dried state and at 5 GHz.

19. The flexible metal laminate according to claim 16 ,
wherein the adhesive film has a dielectric loss factor (Df) of 0.010 or less in a dried state and at 5 GHz.

Assignees

• Shengyi Technology Co Ltd

Inventors

• Tae Young Ji
• Park Young Seok
• Ahn Byeong In

Classifications

• C09J151/006

  grafted on to block copolymers containing at least one sequence of polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds · CPC title

• B32B2307/546

  Flexural strength; Flexion stiffness · CPC title

• C09J9/00

  Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks (C09J7/00 takes precedence) · CPC title

• B32B27/34

  comprising polyamides · CPC title

• C09J2463/00

  Presence of epoxy resin · CPC title