Manufacturing method of light emitting device

Patent metadata

Field	Value
Publication number	US-10279552-B2
Application number	US-201615271086-A
Country	US
Kind code	B2
Filing date	Sep 20, 2016
Priority date	Sep 29, 2015
Publication date	May 7, 2019
Grant date	May 7, 2019

Abstract

A manufacturing method of a side view type light emitting device including a package body made of a synthetic resin material, the manufacturing method includes: providing an injection molding mold, for injection-molding the package body, including: a first mold provided with a first convex part for forming an upper surface side flat part on an upper surface of the package body; and a second mold provided with a first concave part for forming the upper surface side flat part; and fitting the first concave part around the first convex part so as to enter a liquid tight state with no space, injecting the synthetic resin material into each of the first and second molds so as to be filled therein, and hardening the synthetic resin material to form the package body in a state in which the first mold and the second mold are aligned with each other.

First claim

What is claimed is:

1. A manufacturing method of a side view type light emitting device, the side view type light emitting device including a package body including a synthetic resin material, the manufacturing method comprising:
providing an injection-molding mold for injection-molding the package body, the injection-molding mold including:
a first mold provided with a first convex part for forming an upper surface side flat part on an upper surface of the package body; and
a second mold provided with a first concave part for forming the upper surface side flat part;

fitting the first concave part around the first convex part so as to enter a liquid tight state with no gap provided between the first concave part and the first convex part; and
injecting the synthetic resin material into each of the first and second molds so as to be filled therein, and hardening the synthetic resin material to form the package body in a state in which the first mold and the second mold are aligned with each other.

2. The manufacturing method of the light emitting device according to claim 1 , wherein the first mold is further provided with a second convex part for forming the upper surface side flat part on the upper surface of the package body,
wherein the second mold is further provided with a second concave part for forming the lower surface side flat part, and
wherein the second concave part is fitted around the second convex part so as to enter a liquid tight state with no gap provided between the second concave part and the second convex part in a state in which the first mold and the second mold are aligned with each other.

3. The manufacturing method of the light emitting device according to claim 1 , wherein the convex part and the concave part have a trapezoidal shape according to shape dimensions of the flat parts when viewed in a plan view, and
wherein both sides of the convex part and the concave part have a tapered shape such that widths of both sides are narrowed toward a front end side of each of the convex part and the concave part.

4. The manufacturing method of the light emitting device according to claim 1 , wherein a depth of the concave part is smaller than a height of the mold provided with the concave part.

5. The manufacturing method of the light emitting device according to claim 1 , wherein the flat part is arranged to be formed at a center part in a longitudinal direction of the package body.

6. The manufacturing method of the light emitting device according to claim 1 , wherein the flat part includes a plurality of parts, and the plurality of parts are arranged to be line symmetric with respect to a center line in a longitudinal direction of the package body.

7. The manufacturing method of the light emitting device according to claim 1 , wherein an upper surface of the first convex part abuts a bottom surface of the first concave part.

8. The manufacturing method of the light emitting device according to claim 7 , wherein a side surface of the first convex part abuts a side surface of the first concave part.

9. The manufacturing method of the light emitting device according to claim 1 , wherein a side surface of the first convex part abuts a side surface of the first concave part.

10. The manufacturing method of the light emitting device according to claim 1 , wherein the first mold includes a first flat surface provided adjacently on opposing sides of the first convex part, and the second mold includes a second flat surface provided adjacently on opposing sides of the first concave part, and
wherein, in the fitting, the first flat surface of the first mold abuts the second flat surface of the second mold.

11. The manufacturing method of the light emitting device according to claim 10 , wherein a height of the first convex part from the first flat surface is equal to a depth of the first concave part from the second flat surface.

12. The manufacturing method of the light emitting device according to claim 11 , wherein a ratio of the depth of the first concave part to a thickness of the second mold is in a range from ⅛ to ¼.

13. The manufacturing method of the light emitting device according to claim 1 , wherein a ratio of the depth of the first concave part to a thickness of the second mold is in a range from ¼ to ½.

14. A manufacturing method of a side view type light emitting device, the manufacturing method comprising:
providing an injection-molding mold for injection-molding a package body of the side view type light emitting device, the injection-molding mold including:
a first mold provided with at least one convex part for forming an upper surface side flat part on an upper surface of the package body; and
a second mold provided with at least one concave part for forming the upper surface side flat part;

fitting the at least one concave part around the at least one convex part so as to a liquid tight state such that the at least one concave part abuts the at least one convex part; and
injecting the synthetic resin material into each of the first and second molds so as to be filled therein to form the package body in a state in which the first mold and the second mold are aligned with each other.

15. The manufacturing method of the light emitting device according to claim 14 , wherein the package body includes a synthetic resin material.

16. The manufacturing method of the light emitting device according to claim 14 , wherein an upper surface of the at least one convex part abuts a bottom surface of the at least one concave part.

17. The manufacturing method of the light emitting device according to claim 14 , wherein a side surface of the at least one convex part abuts a side surface of the at least one concave part.

18. The manufacturing method of the light emitting device according to claim 14 , wherein the first mold includes a first flat surface provided adjacently on opposing sides of the at least one convex part, and the second mold includes a second flat surface provided adjacently on opposing sides of the at least one concave part, and
wherein, in the fitting, the first flat surface of the first mold abuts the second flat surface of the second mold.

19. The manufacturing method of the light emitting device according to claim 18 , wherein a height of the at least one convex part from the first flat surface is equal to a depth of the at least one concave part from the second flat surface.

20. The manufacturing method of the light emitting device according to claim 18 , wherein a ratio of the depth of the at least one concave part to a thickness of the second mold is in a range from ¼ to ½.

Assignees

• Toyoda Gosei Kk

Inventors

• Tanaka Motoyuki
• Tsuchiya Yosuke
• Tajima Hiroyuki

Classifications

• H10W90/756

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W74/01

  Manufacture or treatment · CPC title

• H01L21/56

  Electricity · mapped topic

• B29C45/14655

  connected to or mounted on a carrier, e.g. lead frame · CPC title

• B29D11/0074 Primary

  Production of other optical elements not provided for in B29D11/00009- B29D11/0073 · CPC title