Method of molding a thermoplastic resin article and apparatus for molding same

US10279539B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10279539-B2
Application numberUS-201816149321-A
CountryUS
Kind codeB2
Filing dateOct 2, 2018
Priority dateMar 22, 2012
Publication dateMay 7, 2019
Grant dateMay 7, 2019

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  1. Title

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  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

Aimed at providing a method for molding a thermoplastic resin product and a molding apparatus therefor that enable productivity, transfer quality or the like to be improved. Provided is a method for molding a thermoplastic resin product that includes a heating step, a transfer step, a cooling step and a mold-releasing step, and wherein, in the heating step, a stamper is irradiated with infrared rays in a state where a cooling member is not irradiated with infrared rays, and at least in the final stage of the transfer step, the stamper and the cooling member are brought into contact.

First claim

Opening claim text (preview).

The invention claimed is: 1. An apparatus for molding a thermoplastic resin product comprising: a heating apparatus for conducting infrared radiation heating by using a light source; a stamper that is radiatingly heated by infrared rays emitted from the light source; a cooling member that is brought into contact with the stamper that has been radiatingly heated to cool the stamper; a first mold having an advancing/retreating means that allows the cooling member to advance to or retreat from the irradiation path of infrared rays; a second mold that holds a thermoplastic resin to which the structure of the shape-forming surface of the stamper is transferred; and a stamp-holding means for holding the stamper in a relatively movable manner in order to allow the stamper and the cooling member to contact with or separate from each other; wherein in the state where the cooling member is retreated from the irradiation path of infrared rays, the stamper is irradiated with infrared rays emitted from the heating apparatus, thereby to radiatingly heat the stamper; and at least in the final stage of the transfer, the stamper is brought into contact with the cooling member that has entered the irradiation path of infrared rays, whereby the cooling member reinforces the stamper. 2. The apparatus for molding the thermoplastic resin product according to claim 1 , wherein the stamper-holding means has an energizing means that energizes the stamper that is held in the direction of the thermoplastic resin and/or a pulling means that pulls the stamper that is held in an outward direction. 3. The apparatus for molding the thermoplastic resin product according to claim 1 , wherein the stamper-holding means has a supporting part that supports the stamper in the point contact and/or line contact state, a pressing part that presses the stamper and a moving means for moving the supporting part and/or the pressing part. 4. The apparatus for molding the thermoplastic resin product according to claim 1 , wherein the heating apparatus is provided with a light pipe which has a polygonal cross section, a light box which is connected to the light pipe and has a polygonal cross section, and a light source accommodated within the light box, and the shape of the cross section of the light pipe is a triangle, a square, a regular hexagon or a parallel hexagon and the shape of the cross section of the light box is a triangle, a square, a regular hexagon or a parallel hexagon. 5. The apparatus for molding the thermoplastic resin product according to claim 1 , wherein the cooling member shields the infrared rays. 6. The apparatus for molding the thermoplastic resin product according to claim 1 , wherein the stamper is held in the first mold via a heat-insulating member. 7. The apparatus for molding the thermoplastic resin product according to claim 1 , wherein the first mold is provided with a guiding means that guides the movement of the stamper and/or the cooling member. 8. The apparatus for molding the thermoplastic resin product according to claim 1 , wherein the cooling member is forcedly cooled.

Assignees

Inventors

Classifications

  • using electromagnetic radiation · CPC title

  • B29C59/02Primary

    by mechanical means, e.g. pressing {(B29C59/007 takes precedence; embossing expanded porous articles B29C44/5627)} · CPC title

  • using IR radiation · CPC title

  • Fresnel lenses · CPC title

  • Thermoplastic materials · CPC title

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Frequently asked questions

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What does patent US10279539B2 cover?
Aimed at providing a method for molding a thermoplastic resin product and a molding apparatus therefor that enable productivity, transfer quality or the like to be improved. Provided is a method for molding a thermoplastic resin product that includes a heating step, a transfer step, a cooling step and a mold-releasing step, and wherein, in the heating step, a stamper is irradiated with infrared…
Who is the assignee on this patent?
Toyo Seikan Group Holdings Ltd
What technology area does this patent fall under?
Primary CPC classification B29C59/02. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue May 07 2019 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).