Polycrystalline compacts including diamond nanoparticles, cutting elements and earth- boring tools including such compacts, and methods of forming same

US10279454B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10279454-B2
Application numberUS-201313839589-A
CountryUS
Kind codeB2
Filing dateMar 15, 2013
Priority dateMar 15, 2013
Publication dateMay 7, 2019
Grant dateMay 7, 2019

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A polycrystalline compact includes a plurality of diamond grains of micron size, submicron size, or both, and a plurality of diamond nanoparticles disposed in interstitial spaces between the plurality of diamond grains. A method of forming a polycrystalline compact includes combining a plurality of micron and/or submicron-sized diamond grains and a plurality of diamond nanoparticles to form a mixture and sintering the mixture in a presence of a carburized binder to form a polycrystalline hard material having a plurality of inter-bonded diamond grains and diamond nanoparticles. Cutting elements including a polycrystalline compact and earth-boring tools bearing such compacts are also disclosed.

First claim

Opening claim text (preview).

What is claimed is: 1. A method of fabricating polycrystalline diamond, comprising: saturating a Group VIII-A metal or metal alloy with carbon and forming a carburized binder, the carburized binder including the Group VIII-A metal or metal alloy having a concentration of carbon beyond a carbon-saturation limit for the Group VIII-A metal or metal alloy at room temperature and pressure conditions; mixing micron-sized diamond grains and diamond nanoparticles with the carburized binder to form a mixture; encapsulating the mixture of micron-sized diamond grains, diamond nanoparticles, and carburized binder in a canister; and after saturating the Group VIII-A metal or metal alloy with carbon and forming the carburized binder and mixing the micron-sized diamond grains, diamond nanoparticles, and carburized binder, subjecting the encapsulated mixture of micron-sized diamond grains, diamond nanoparticles, and carburized binder to a pressure of at least 5.0 GPa and a temperature of at least 1000° C. to form polycrystalline diamond having inter-granular bonds between the micron-sized diamond grains and the diamond nanoparticles and carburized binder between the micron-sized diamond grains and the diamond nanoparticles. 2. The method of claim 1 , wherein mixing the micron-sized diamond grains and the diamond nanoparticles with the carburized binder comprises at least partially filling a volume between the micron-sized diamond grains and the diamond nanoparticles with the carburized binder. 3. The method of claim 1 , further comprising leaching at least a portion of the carburized binder from the polycrystalline diamond. 4. A method of fabricating a polycrystalline diamond cutting element, comprising: saturating a Group VIII-A metal or metal alloy with carbon to form a carburized binder, the carburized binder including the Group VIII-A metal or metal alloy having a concentration of carbon beyond a carbon-saturation limit for the Group VIII-A metal or metal alloy at room temperature and pressure conditions; mixing micron-sized diamond grains and diamond nanoparticles with the carburized binder to form a mixture; encapsulating a substrate blank adjacent to the mixture of micron-sized diamond grains, diamond nanoparticles, and the carburized binder in a canister; after saturating the Group VIII-A metal or metal alloy with carbon and forming the carburized binder and mixing the micron-sized diamond grains, diamond nanoparticles, and carburized binder, subjecting the encapsulated mixture of micron-sized diamond grains, diamond nanoparticles, and the carburized binder in the presence of the substrate blank in the canister to a pressure of at least 5.0 GPa and a temperature of at least 1000° C. and forming polycrystalline diamond having inter-granular bonds between the micron-sized diamond grains and the diamond nanoparticles having carburized binder therebetween on the substrate blank. 5. The method of claim 4 , further comprising leaching at least a portion of the carburized binder from the polycrystalline diamond. 6. The method of claim 4 , wherein the substrate blank comprises a diamond-enhanced carbide substrate. 7. The method of claim 4 , wherein the substrate blank comprises a cobalt-cemented tungsten carbide substrate. 8. The method of claim 1 , further comprising encapsulating a substrate blank in the canister. 9. The method of claim 8 , wherein the substrate blank comprises a diamond-enhanced carbide substrate. 10. The method of claim 8 , wherein the substrate blank comprises a cobalt-cemented tungsten carbide substrate. 11. The method of claim 1 , wherein the Group VIII-A metal or metal alloy comprises at least one of iron, cobalt, and nickel. 12. The method of claim 1 , wherein subjecting the encapsulated mixture of micron-sized diamond grains, diamond nanoparticles, and carburized binder to a pressure of at least 5.0 GPa and a temperature of at least 1000° C. to form polycrystalline diamond comprises converting excess carbon of the carburized binder to diamond.

Assignees

Inventors

Classifications

  • Nanosized particles · CPC title

  • characterised by support details, e.g. the substrate construction or the interface between the substrate and the cutting element · CPC title

  • nanometer sized, i.e. below 100 nm · CPC title

  • micrometer sized, i.e. from 1 to 100 micron · CPC title

  • obtained from carbonaceous particles with or without other non-organic components · CPC title

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What does patent US10279454B2 cover?
A polycrystalline compact includes a plurality of diamond grains of micron size, submicron size, or both, and a plurality of diamond nanoparticles disposed in interstitial spaces between the plurality of diamond grains. A method of forming a polycrystalline compact includes combining a plurality of micron and/or submicron-sized diamond grains and a plurality of diamond nanoparticles to form a m…
Who is the assignee on this patent?
Baker Hughes Inc, Element Six Ltd
What technology area does this patent fall under?
Primary CPC classification B24D18/0009. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue May 07 2019 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).