Electric component assembly

Patent metadata

Field	Value
Publication number	US-10278285-B2
Application number	US-201314422676-A
Country	US
Kind code	B2
Filing date	Aug 2, 2013
Priority date	Aug 21, 2012
Publication date	Apr 30, 2019
Grant date	Apr 30, 2019

Abstract

A component assembly is disclosed. In an embodiment the assembly includes a carrier, a metallic structure arranged on the carrier, wherein the metallic structure comprises at least one cavity and an electrical component arranged at least in part in the cavity, wherein the metallic structure comprises at least two part regions which are not connected to each other by any further part of the metallic structure, and wherein the cavity is located between the two part regions. The assembly further includes two contact areas located on the carrier, wherein the component is located on the two contact areas such that each part region of the two part regions is located on one of the two contact areas.

First claim

The invention claimed is:

1. A component assembly comprising:
a carrier comprising an electrically insulating material, wherein the electrically insulating material forms a planar surface;
a metallic structure arranged on the planar surface of the carrier such that the metallic structure is neither partially nor fully embedded in the electrically insulating material of the carrier, wherein the metallic structure defines at least one cavity such that a surface of an inner wall of the cavity is formed by the metallic structure; and
an electrical component arranged at least in part in the cavity,
wherein the metallic structure comprises at least two part regions which are not connected to each other by any further part of the metallic structure,
wherein the cavity is located between the two part regions,
wherein a thickness of the metallic structure in a direction perpendicular to the planar surface of the electrically insulating material is larger than a height of the electrical component in the direction perpendicular to the planar surface of the electrically insulating material, and
wherein the metallic structure is neither in electrical connection with the electrical component arranged at least in part in the cavity nor in electrical connection with any further electrical component of the component assembly.

2. The component assembly according to claim 1 , wherein the electrical component is a thermistor element, varistor element, TVS diode or light-emitting diode.

3. The component assembly according to claim 1 , wherein the electrical component is a chip.

4. The component assembly according to claim 1 , wherein the carrier comprises a ceramic or an organic material.

5. The component assembly according to claim 1 ,
wherein the cavity is at least partially covered at least in part by a further element, wherein the further element is located on the metallic structure,
wherein the carrier has a plain outer surface, and
wherein the metallic structure and the electrical component are located on the plain outer surface.

6. The component assembly according to claim 1 , wherein a width of each of the part regions is larger than a width of the electrical component such that the two part regions laterally project over the electrical component.

7. The component assembly according to claim 5 , wherein the further element is a further electrical component or a further carrier.

8. The component assembly according to claim 5 , wherein the metallic structure fastens the further element on the carrier.

Assignees

• Epcos Ag

Inventors

• Brunner Sebastian
• Feichtinger Thomas

Classifications

• H05K1/0313

  Organic insulating material · CPC title

• H05K2201/10106

  Light emitting diode [LED] · CPC title

• H05K1/0306

  Inorganic insulating substrates, e.g. ceramic, glass · CPC title

• H01C7/02

  having positive temperature coefficient · CPC title

• H05K1/181

  associated with surface mounted components · CPC title