Electro-optic device

Patent metadata

Field	Value
Publication number	US-10274757-B2
Application number	US-201615559911-A
Country	US
Kind code	B2
Filing date	Feb 17, 2016
Priority date	Mar 31, 2015
Publication date	Apr 30, 2019
Grant date	Apr 30, 2019

Abstract

An electro-optic device includes a first semiconductor layer including the rib-type waveguide, which includes a rib part and a first slab part, which extends in a first direction from the rib part; a dielectric layer, which is formed on the rib part; a second semiconductor layer, which extends in a second direction, which is opposite to the first direction, from an upper surface of the dielectric layer; a first high-concentration impurity region, which is formed in the first semiconductor layer to be in contact with the first slab part on the first direction side; and a second high-concentration impurity region, which is formed in a region of the second semiconductor layer on the second direction side. The second high-concentration impurity region is formed in a region other than a region overlapping the first semiconductor layer in a lamination direction.

First claim

What is claimed is:

1. An electro-optic device, comprising:
a first semiconductor layer including a rib-type waveguide, which includes a rib part and a first slab part, which extends in a first direction from the rib part, the rib part having a first height, the first slab part having a second height lower than the first height;
a dielectric layer, which is formed on the rib part;
a second semiconductor layer, which extends in a second direction, which is opposite to the first direction, from an upper surface of the dielectric layer;
a first high-concentration impurity region, which is formed in the first semiconductor layer to be in contact with the first slab part on the first direction side; and
a second high-concentration impurity region, which is formed in a region of the second semiconductor layer on the second direction side other than a region overlapping the first semiconductor layer in a lamination direction
wherein the first semiconductor layer further includes a second slab part, which extends in the second direction from the rib part, the second slab part having the second height, and any high-concentration impurity region being not in contact with the second slab part.

2. An electro-optic device according to claim 1 , wherein the second slab part has a length in the second direction of 1 μm or less.

3. An electro-optic device according to claim 1 , wherein the first semiconductor layer is of a first conductivity type, and the second semiconductor layer is of a second conductivity type.

4. An electro-optic device according to claim 1 , wherein the first semiconductor layer includes a first electrical contact portion which has a height that is equal to the first height of the rib part.

5. An electro-optic device according to claim 1 , wherein the rib part has one of a Si 1-x Ge x layer and a strained Si 1-x Ge x layer formed to be at least partially buried therein.

6. An electro-optic device according to claim 5 , wherein the Si 1-x Ge x layer comprises one of a laminated layer of a plurality of Si 1-x Ge x layers having different compositions and a composition-modulated Si 1-x Ge x layer having a composition changed in a thickness direction.

7. An electro-optic device according to claim 5 , wherein a surface of the Si 1-x Ge x layer is subjected to one of oxidization and nitriding to form at least a part of the dielectric layer.

8. An electro-optic device according to claim 1 , wherein the dielectric layer is formed of one of: one kind selected from the group consisting of silicon oxide, silicon nitride, hafnium oxide, zirconium oxide, and a rare earth oxide; and one of an alloy and a laminated film made of at least two kinds thereof.

9. An electro-optic device according to claim 1 , wherein the first semiconductor layer and the second semiconductor layer each comprise at least one layer selected from the group consisting of polysilicon, amorphous silicon, strained silicon, single crystal silicon, and Si 1-x Ge x .

Assignees

• Nec Corp
• Photonics Electronics Technology Res Ass

Inventors

• Fujikata Junichi
• Takahashi Shigeki

Classifications

• G02F2202/10

  semiconductor · CPC title

• G02F1/025 Primary

  in an optical waveguide structure (G02F1/017, {G02F1/2257} take precedence) · CPC title

• G02F2001/0152

  Physics · mapped topic

• G02F2201/063

  ridge; rib; strip loaded · CPC title

• G02F1/0152

  using free carrier effects, e.g. plasma effect · CPC title