Support substrates for microfluidic die

Patent metadata

Field	Value
Publication number	US-10272684-B2
Application number	US-201615253601-A
Country	US
Kind code	B2
Filing date	Aug 31, 2016
Priority date	Dec 30, 2015
Publication date	Apr 30, 2019
Grant date	Apr 30, 2019

Abstract

The present disclosure provides supports for microfluidic die that allow for nozzles of the microfluidic die to be on a different plane or face a different direction from electrical contacts on the same support. This includes a rigid support having electrical contacts on a different side of the rigid support with respect to a direction of ejection of the nozzles, and a semi-flexible support or semi-rigid support that allow the electrical contacts to be moved with respect to a direction of ejection of the nozzles. The semi-flexible and semi-rigid supports allow the die to be up to and beyond a 90 degree angle with respect to a plane of the electrical contacts. The different supports allow for a variety of positions of the microfluidic die with respect to a position of the electrical contacts.

First claim

The invention claimed is:

1. A microfluidic component, comprising:
a unitary microfluidic support including:
a first end opposite a second end;
a support material that extends from the first end to the second end, the support material including:
a first surface, a second surface, a third surface, and a fourth surface, the first surface being opposite the second surface, the third surface, and the fourth surface;
a first rigid portion positioned at the first end having a first thickness and a first opening, the first thickness extending from the first surface to the second surface;
a second rigid portion positioned at the second end and having a second thickness, the second thickness extending from the first surface to the third surface; and
a flexible portion having a third thickness, the flexible portion coupling and separating the first rigid portion and the second rigid portion, the third thickness being less than the first thickness, the third thickness extending from the first surface to the fourth surface;

electrical traces coupled between first electrical contacts on the first rigid portion and second electrical contacts on the second rigid portion, and each electrical trace being coupled between a respective first electrical contact of the first electrical contacts and a respective second electrical contact of the second electrical contacts and extending from within the first rigid portion to the second rigid portion through the flexible portion.

2. The microfluidic component of claim 1 wherein the first thickness and the second thickness are substantially equal.

3. The microfluidic component of claim 1 , wherein the second electrical contacts are contact pads on the third surface of the second rigid portion.

4. The microfluidic component of claim 1 , further comprising a liner that covers sidewalls of the first opening.

5. The microfluidic component of claim 1 , further comprising a microfluidic die configured to eject fluid, the microfluidic die aligned with the first opening.

6. The microfluidic component of claim 1 , wherein the support material of the unitary microfluidic support includes:
a first sidewall extending from the fourth surface to the second surface; and
a second sidewall extending from the fourth surface to the third surface.

7. The microfluidic component of claim 1 , wherein the unitary microfluidic support includes a protective layer on the first surface, the second surface, and the third surface of the support material.

8. A microfluidic component, comprising:
a semi-flexible support having a first end and a second end, the semi-flexible support having a continuous integral layer made of a single continuous material that extends from the first end to the second end of the semi-flexible support, the continuous integral layer including:
a first side and a second side that is opposite the first side;
a first rigid portion adjacent to the first end, the first rigid portion having a fluid opening extending through the first rigid portion from the first side to the second side, the first rigid portion having a first thickness;
a second rigid portion adjacent to the second end, the second rigid portion having a second thickness that is substantially the same as the first thickness;
a flexible portion extending between the first rigid portion and the second rigid portion, the flexible portion having a third thickness that is less than the first thickness, the first rigid portion having a first length that extends from the first end to the flexible portion, the second rigid portion having a second length that extends from the second end to the flexible portion, the flexible portion having a third length that extends from the first rigid portion to the second rigid portion; and
wires extending through the continuous integral layer from the first rigid portion to the second rigid portion through the flexible portion.

9. The microfluidic component of claim 8 , further comprising:
a plurality of first contact pads on the first side of the first rigid portion, each one of the plurality of first contact pads coupled to one of the wires; and
a plurality of second contact pads on the first side of the second rigid portion, each one of the plurality of second contact pads coupled to one of the wires, the wires coupling respective ones of the plurality of first contact pads to respective ones of the plurality of second contact pads.

10. The microfluidic component of claim 9 wherein the plurality of wires are partially exposed on a surface of the flexible portion.

11. The microfluidic component of claim 9 wherein the plurality of second contact pads includes a first plurality of electrical contacts and a second plurality of electrical contacts, the first plurality of electrical contacts positioned closer to the plurality of first contact pads than the second plurality of electrical contacts.

12. The microfluidic component of claim 11 wherein the wires include:
a first group the of wires electrically coupled to the first plurality of the electrical contacts; and
a second group of the wires electrically coupled to the second plurality of electrical contacts.

13. The microfluidic component of claim 12 wherein each one of the first group of the wires is positioned in an alternating arrangement with each one of the second group of the wires.

14. The microfluidic component of claim 8 , wherein the semi-flexible support includes:
a first protective layer that covers the first side of the continuous integral layer; and
a second protective layer that partially covers the second side of the continuous integral layer.

15. A microfluidic component, comprising:
a single microfluidic support including:
a first end and a second end that is opposite the first end;
a single continuous material that extends from the first end to the second end of the single microfluidic support, the single continuous material including:
a first sidewall positioned between the first end and the second end;
a second sidewall positioned between the first sidewall and the second end;
a first rigid portion between the first end and the first sidewall, the first rigid portion having a fluid opening extending through the first rigid portion;
a second rigid portion between the second end and the second sidewall, the second rigid portion having a notch extending from the second end-toward the second sidewall, the notch extending through the second rigid portion; and
a flexible portion coupling and separating the first rigid portion from the second rigid portion, the flexible portion extending between the first sidewall and the second sidewall.

16. The microfluidic component of claim 15 wherein the microfluidic support includes an alignment hole adjacent to the notch.

Assignees

• St Microelectronics Inc
• St Microelectronics Int Nv
• St Microelectronics Srl

Inventors

• Dodd Simon
• Hunt David S
• Scheffelin Joseph Edward
• Gruenbacher Dana
• Hollinger Stefan H
• Schober Uwe
• Janouch Peter

Classifications

• B41J2/14201

  Structure of print heads with piezoelectric elements · CPC title

• B41J2/1433 Primary

  Structure of nozzle plates · CPC title

• B41J2002/14362

  Assembling elements of heads · CPC title

• B41J2/1753

  Details of contacts on the cartridge, e.g. protection of contacts · CPC title

• B41J2/14072 Primary

  Electrical connections, e.g. details on electrodes, connecting the chip to the outside... · CPC title