Method for micropatterning a substrate and a patterned substrate formed thereof

US10272657B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10272657-B2
Application numberUS-201113881000-A
CountryUS
Kind codeB2
Filing dateOct 25, 2011
Priority dateOct 25, 2010
Publication dateApr 30, 2019
Grant dateApr 30, 2019

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A method of micropatterning a substrate is provided. The method comprises providing a template substrate having a patterned surface inked with a composition of interest; contacting the patterned surface with an intermediate substrate, thereby transferring the composition to the surface of the intermediate substrate; contacting the surface of the intermediate substrate comprising the composition with the substrate; and removing the intermediate substrate by dissolution using a solvent. A patterned substrate formed using the method, as well as a biosensor comprising the patterned substrate is also provided.

First claim

Opening claim text (preview).

The invention claimed is: 1. A method of micropatterning a substrate, the method comprising: a) providing a mold having a patterned surface inked with a composition of interest; b) contacting the patterned surface with a surface of an intermediate substrate, thereby transferring the composition of interest to the surface of the intermediate substrate, whereby the surface of the intermediate substrate is not imprinted; c) contacting the surface of the intermediate substrate comprising the composition of interest with a surface of the substrate, thereby transferring the composition of interest from the intermediate substrate to the substrate, wherein the substrate comprises one selected from the group consisting of silicone polymers, polydimethysiloxane, hydrogels, polyacrylamide gels, poly(N-isopropylacrylamide), fibrin, and alginate; and d) dissolving the intermediate substrate using a solvent; wherein the composition of interest remains on the substrate after the intermediate substrate is removed. 2. The method of claim 1 , wherein the mold comprises a polymer selected from the group consisting of silicone polymers, polydimethylsiloxane, natural rubber, synthetic rubber, agarose and mixture thereof. 3. The method of claim 1 , wherein the step of providing a mold having a patterned surface inked with a composition of interest comprises (1) generating a polymer stamp with a patterned surface by (i) providing a master template having a patterned surface, (ii) contacting the master template with a solution of a polymer precursor, (iii) curing the polymer precursor solution, and (iv) removing the polymer stamp from the master template; and (2) inking the polymer stamp with the composition of interest. 4. The method of claim 1 , wherein the composition of interest comprises a biomolecule species. 5. The method of claim 4 , wherein the biomolecule species comprises one selected from the group consisting of peptides, polypeptides, proteins, oligonucleotides, polynucleotides, nucleic acids, carbohydrates, lipids and haptens. 6. The method of claim 4 , wherein the biomolecule species comprises fibronectin or collagen. 7. The method of claim 1 , wherein the intermediate substrate is a polymer film. 8. The method of claim 7 , wherein the polymer of the polymer film is a water-soluble polymer. 9. The method of claim 8 , wherein the water-soluble polymer is polyvinyl alcohol or polyethylene glycol. 10. The method of claim 7 , wherein the intermediate substrate comprises polyvinyl alcohol. 11. The method of claim 1 , wherein the substrate or the surface of the substrate being contacted with the surface of the intermediate substrate comprising the composition of interest is soft in that it has a Young's modulus of between about 1 Pa to about 50 kPa, sticky, or both. 12. The method of claim 1 , wherein the substrate comprises a material having a Young's modulus of between about 1 Pa to about 50 kPa. 13. The method of claim 1 , wherein the surface of the substrate being contacted with the surface of the intermediate substrate comprising the composition of interest has a non-planar topography. 14. The method of claim 13 , wherein the non-planar topography comprises one selected from the group consisting of an arcuate feature, a curved feature, and a spherical feature. 15. The method of claim 1 , wherein the substrate is a sphere, curved surface of a cylinder or curved surface of a cone. 16. The method of claim 1 , wherein the surface of the intermediate substrate comprising the composition of interest is placed in conformal contact with the substrate. 17. The method of claim 1 , wherein the solubility of the composition of interest in the solvent is lower than the solubility of the intermediate substrate in the solvent.

Assignees

Inventors

Classifications

  • Improving reaction conditions or stability, e.g. by coating or irradiation of surface, by reduction of non-specific binding, by promotion of specific binding · CPC title

  • B32B37/025Primary

    Transfer laminating · CPC title

  • Removing layers, or parts of layers, mechanically or chemically · CPC title

  • Modification of implant surfaces in order to improve biocompatibility, cell growth, fixation of biomolecules, e.g. plasma treatment · CPC title

  • Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] · CPC title

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What does patent US10272657B2 cover?
A method of micropatterning a substrate is provided. The method comprises providing a template substrate having a patterned surface inked with a composition of interest; contacting the patterned surface with an intermediate substrate, thereby transferring the composition to the surface of the intermediate substrate; contacting the surface of the intermediate substrate comprising the composition…
Who is the assignee on this patent?
Yu Haiyang, Tan Lay Poh, Univ Nanyang Tech
What technology area does this patent fall under?
Primary CPC classification B32B37/025. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Apr 30 2019 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).