Hermetic terminal for an active implantable medical device with composite co-fired filled via and body fluid side brazed leadwire

Patent metadata

Field	Value
Publication number	US-10272253-B2
Application number	US-201715797278-A
Country	US
Kind code	B2
Filing date	Oct 30, 2017
Priority date	Nov 10, 2016
Publication date	Apr 30, 2019
Grant date	Apr 30, 2019

Abstract

A feedthrough subassembly is attachable to an active implantable medical device. A via hole is disposed through an electrically insulative and biocompatible feedthrough body extending from a body fluid side to a device side. A composite fill partially disposed within the via hole extends between a first and a second composite fill end. The first composite fill end is disposed at or near the device side of the feedthrough body. The second composite fill end is disposed within the via hole recessed from the body fluid side. The composite fill includes a first portion of a ceramic reinforced metal composite including alumina and platinum and a second portion of a substantially pure platinum fill and/or a platinum wire. A via hole metallization covers a portion of the second composite fill end. A metallic leadwire is at least partially disposed within the via hole and gold brazed via hole metallization.

First claim

What is claimed is:

1. A feedthrough that is attachable to an active implantable medical device (AIMD), the feedthrough comprising:
a) an electrically conductive ferrule comprising a ferrule opening, wherein the ferrule is configured to be attachable to an opening in a housing of an AIMD;
b) an alumina insulator at least partially residing in the ferrule opening where a first gold braze hermetically seals the insulator to the ferrule, the insulator comprising an insulator outer surface extending to an insulator body fluid side and to an insulator device side, wherein, when the feedthrough is attached to the housing of the AIMD, the insulator body fluid side and the insulator device side reside outside the AIMD and inside the AIMD, respectively;
c) at least one via hole extending along a longitudinal axis and defined by a via hole inner surface extending through the alumina insulator to the insulator body fluid side and to the insulator device side;
d) a layer of a ceramic reinforced metal composite comprising alumina and platinum contacting the via hole inner surface, the layer of ceramic reinforced metal composite extending from a ceramic reinforced metal ceramic first end residing at or adjacent to the insulator device side to a ceramic reinforced metal ceramic second end recessed inwardly into the via hole from the insulator body fluid side, wherein an inner surface of the ceramic reinforced metal composite is spaced toward the longitudinal axis with respect to the via hole inner surface;
e) a substantially pure platinum material contacting the ceramic reinforced metal composite inner surface, the substantially pure platinum material extending from a substantially pure platinum material first end residing at or adjacent to the insulator device side to a substantially pure platinum material second end recessed inwardly into the via hole from the insulator body fluid side;
f) a via hole metallization contacted to the via hole inner surface and to at least the second end of the substantially pure platinum material, the via hole metallization extending toward the insulator body fluid side; and
g) a metallic leadwire at least partially disposed in the at least one via hole at the insulator body fluid side, wherein the leadwire is gold brazed to the via hole metallization so that the gold braze separates the insulator body fluid side from the insulator device side in the at least one via hole, and
h) wherein the leadwire is in electrical communication with the gold braze, the via hole metallization and the substantially pure platinum material, thereby forming an electrically conductive pathway extending from the leadwire adjacent to the insulator body fluid side to the first end of the substantially pure platinum material residing at or adjacent and to the insulator device side.

2. The feedthrough of claim 1 , wherein the via hole metallization does not contact the second end of the ceramic reinforced metal composite.

3. The feedthrough of claim 1 , wherein the substantially pure platinum material is exposed at the insulator device side.

4. The feedthrough of claim 1 , wherein either a perimeter metallization or a perimeter ceramic reinforced metal composite is disposed at least partially on the insulator outer surface, and wherein a perimeter braze hermetically seals either the perimeter metallization or the perimeter ceramic reinforced metal composite to the conductive ferrule to thereby form the hermetic seal of the insulator to the ferrule.

5. The feedthrough of claim 1 , wherein the ceramic reinforced metal composite first end is recessed inwardly into the via hole from the insulator device side and wherein the substantially pure platinum material extends from the via hole metallization to the insulator device side.

6. The feedthrough of claim 1 , wherein the ceramic reinforced metal composite first end extends to the insulator device side and wherein the substantially pure platinum material extends from the via hole metallization to the insulator device side.

7. The feedthrough of claim 1 , wherein the ceramic reinforced metal composite first end is recessed inwardly into the via hole from the insulator device side and wherein the substantially pure platinum material extending from the via hole metallization is recessed inwardly into the via hole from the insulator inner surface, and wherein a metallic end cap extends from the ceramic reinforced metal composite first end and the substantially pure platinum material first end to the insulator device side.

8. The feedthrough of claim 7 , wherein the metallic end cap comprises platinum.

9. The feedthrough of claim 1 , wherein the substantially pure platinum material is a platinum wire.

10. The feedthrough of claim 9 , wherein the platinum wire is exposed at the insulator device side.

11. The feedthrough of claim 1 , wherein a platinum wire extends through the substantially pure platinum material from the via hole metallization to the insulator device side, the platinum wire being spaced from the layer of ceramic reinforced metal composite contacting the via hole inner surface.

12. The feedthrough of claim 1 , wherein the electrically conductive pathway extends from the metallic leadwire at the insulator body fluid side to the first ends of both the ceramic reinforced metal composite and the substantially pure platinum material residing at or adjacent and to the insulator device side.

13. The feedthrough of claim 1 , wherein the at least one via hole comprises a counterbore or a countersink located at at least one of the insulator body fluid side and the insulator device side.

14. The feedthrough of claim 13 , wherein the ceramic reinforced metal composite first end is recessed inwardly into the via hole from the insulator device side and the at least one via hole comprises a counterbore or countersink extending the ceramic reinforced metal composite first end to the insulator device side, and wherein the substantially pure platinum material extends from the via hole metallization to the insulator device side.

15. The feedthrough of claim 4 , wherein at least one of the via hole metallization and the perimeter metallization comprises an adhesion layer contacting the respective via hole inner surface and the insulator inner surface, and a wetting layer contacting the adhesion layer.

16. The feedthrough of claim 1 , wherein the metallic leadwire has a substantially uniform cross-section perpendicular to its length.

17. The feedthrough of claim 1 , wherein a portion of the metallic leadwire that is disposed in the at least one via hole at the insulator body fluid side has an enlarged cross-section perpendicular to a length of the leadwire in comparison to an extending portion of the leadwire extending outwardly beyond the insulator body fluid side.

18. The feedthrough of claim 1 , wherein a portion of the metallic leadwire that extends outwardly beyond the insulator body fluid side has an enlarged cross-section perpendicular to a length of the leadwire in comparison to a portion of the leadwire that is disposed in the at least one via hole.

19. A feedthrough that is attachable to an active implantable medical device (AIMD), the feedthrough comprising:
a) an electrically conductive ferrule comprising a ferrule opening, wherein the ferrule is configured to be attachable to an opening in a housing of an AIMD;
b) an alumina insulator at least partially residing in the ferrule opening where a first gold braze hermetically seals the insulator to the ferrule, the insulator comprising an insulator outer sur

Assignees

• Greatbatch Ltd

Inventors

• Seitz Keith W
• Marzano Thomas
• Stevenson Robert A
• Frysz Christine A
• Woods Jason
• Brendel Richard L

Classifications

• H01B17/303

  Sealing of leads to lead-through insulators · CPC title

• A61N1/3754 Primary

  Feedthroughs · CPC title