Server system

Patent metadata

Field	Value
Publication number	US-10271460-B2
Application number	US-201614992143-A
Country	US
Kind code	B2
Filing date	Jan 11, 2016
Priority date	Jan 11, 2016
Publication date	Apr 23, 2019
Grant date	Apr 23, 2019

Abstract

A server system includes an enclosure, a first section, a motherboard section, a fan section, and a midplane board. The first section is disposed at a first end of the enclosure and includes at least one heat generating component. The motherboard section is disposed at a second end of the enclosure and includes at least one motherboard. The fan section is disposed between the front section and the motherboard section and includes at least one fan for directing air in from the first end and out of the second end. The midplane board is vertically interposed between the fan section and the motherboard section, and is configured to electrically and communicatively couple the at least one motherboard to one or more components in the first section, and includes one or more airflow cutouts. The one or more airflow cutouts of the midplane board make up at least thirty percent of a cross-sectional surface area of the midplane board.

First claim

The invention claimed is:

1. A server system, comprising:
an enclosure;
a first section disposed at a first end of the enclosure and comprising at least one power supply unit;
a motherboard section disposed at a second end of the enclosure and comprising at least one motherboard;
a fan section disposed between the first section and the motherboard section and comprising at least one fan for directing air in from the first end and out of the second end; and
a midplane board, vertically interposed between the fan section and the motherboard section, configured to electrically and communicatively couple the at least one motherboard to one or more components in the first section, and comprising one or more airflow cutouts, each of the one or more airflow cutouts at least being aligned with the at least one fan, or being aligned with at least one airflow channel defined by the at least one power supply unit.

2. The system of claim 1 , wherein the one or more airflow cutouts of the midplane board make up at least thirty percent of a cross-sectional surface area of the midplane board.

3. The system of claim 1 , wherein the motherboard section does not include a power supply unit.

4. The system of claim 1 , wherein the one or more components comprise at least one storage drive.

5. The system of claim 4 , wherein the first section comprises a first storage section that borders a left side of the server chassis and a second storage section that borders a right side of the server chassis, and wherein the at least one power supply unit is located between the first storage section and the second storage section.

6. The system of claim 4 , wherein the first section comprises a first power section that borders a left side of the server chassis and a second power section that borders a right side of the server chassis, and wherein the at least one storage drive is located between the first power section and the second power section.

7. The system of claim 1 , further comprising a backplane board configured to electrically and communicatively couple to the one or more components in the front section and the at least one fan.

8. The system of claim 1 , wherein each of the midplane board comprises at least one hot pluggable connector for connecting to the at least one motherboard.

9. The system of claim 1 , further comprising at least one air filter covering each of the one or more airflow cutouts.

10. The system of claim 1 , wherein each of the one or more airflow cutouts of the midplane board are equally sized and shaped.

11. The system of claim 1 , wherein each of the one or more airflow cutouts of the midplane board are circular shaped.

12. The system of claim 1 , wherein each of the one or more airflow cutouts of the midplane board are rectangular shaped.

13. The system of claim 1 , wherein the one or more airflow cutouts of the midplane board forms a mesh.

14. The system of claim 1 , wherein the one or more airflow cutouts of the midplane board make up at least seventy percent of a cross-sectional surface area of the midplane board.

15. The system of claim 1 , wherein at least one of the one or more airflow cutouts of the midplane board is aligned with a fan of the fan section.

16. The system of claim 1 , wherein at least one of the one or more airflow cutouts of the midplane board is aligned with airflow channels of the motherboard section.

17. The system of claim 1 , wherein at least one of the one or more airflow cutouts of the midplane board is coupled to at least one directional air vent structure.

18. The system of claim 1 , wherein at least one of the one or more airflow cutouts of the midplane board is aligned with at least one directional air vent structure.

19. The system of claim 1 , wherein the one or more airflow cutouts comprise at least four airflow cutouts.

20. The system of claim 1 , wherein the one or more airflow cutouts comprise more than 10 airflow cutouts.

Assignees

• Quanta Comp Inc

Inventors

• Huang Jen-Hsuen
• Lin Fa-Da
• Hung Pin-Hao

Classifications

• H05K7/1492

  having electrical distribution arrangements, e.g. power supply or data communications · CPC title

• H05K7/20727

  within server blades for removing heat from heat source · CPC title

• H05K7/1487 Primary

  Blade assemblies, e.g. blade cases or inner arrangements within a blade · CPC title

• H05K7/1489

  characterized by the mounting of blades therein, e.g. brackets, rails, trays (H05K7/1491 takes precedence) · CPC title

• H05K7/20736 Primary

  within cabinets for removing heat from server blades · CPC title