Diplexer

Patent metadata

Field	Value
Publication number	US-10270419-B2
Application number	US-201815985745-A
Country	US
Kind code	B2
Filing date	May 22, 2018
Priority date	Feb 10, 2016
Publication date	Apr 23, 2019
Grant date	Apr 23, 2019

Abstract

A diplexer includes a multilayer substrate, first, second, and third terminals, and a ground terminal provided on the multilayer substrate. The first filter is between the first terminal and the second terminal, the second filter is between the first terminal and the third terminal. An interlayer spacing of the multilayer substrate includes a first filter ground electrode, a second filter ground electrode, and a shield ground electrode shielding between the first filter and the second filter. The ground terminal includes a first filter ground terminal connected to the first filter ground electrode, a second filter ground terminal connected to the second filter ground electrode, and a shield ground terminal connected to the shield ground electrode.

First claim

What is claimed is:

1. A diplexer comprising:
a multilayer substrate including a mounting surface and a non-mounting surface, and a plurality of base layers that are stacked; and
a first terminal, a second terminal, a third terminal, and a ground terminal provided on the mounting surface of the multilayer substrate; wherein
a first filter is provided between the first terminal and the second terminal, and a second filter is provided between the first terminal and the third terminal;
the multilayer substrate includes, in an interlayer spacing of the multilayer substrate, a first filter ground electrode, a second filter ground electrode, and a shield ground electrode that provides shielding between the first filter and the second filter, wherein the first filter ground electrode, the second filter ground electrode, and the shield ground electrode are independent from each other;
the ground terminal includes a first filter ground terminal connected to the first filter ground electrode, a second filter ground terminal connected to the second filter ground electrode, and a shield ground terminal connected to the shield ground electrode, wherein the first filter ground terminal, the second filter ground terminal, and the shield ground terminal are independent from each other; and
a portion of each of the first filter and the second filter is mounted on the multilayer substrate, and another portion of each of the first filter and the second filter is provided inside of the multilayer substrate.

2. The diplexer according to claim 1 , wherein the first filter includes a low-pass filter, and the second filter includes a high-pass filter or a bandpass filter.

3. The diplexer according to claim 1 , wherein the first terminal is connected to each of the first filter and the second filter with a common inductor interposed therebetween, the common inductor being defined by a line electrode stacked in an interlayer spacing of the multilayer substrate.

4. The diplexer according to claim 3 , wherein the first filter includes a low-pass filter, and the second filter includes a bandpass filter or a high-pass filter.

5. The diplexer according to claim 1 , wherein the shield ground electrode provides shielding at least between an inductor on a second terminal side and an inductor on a third terminal side, the inductor on the second terminal side being one of a plurality of first inductors included in the first filter and being disposed on a side of the second terminal among inductors of the plurality of first inductors disposed between the first terminal and the second terminal, the inductor on a third terminal side being one of a plurality of second inductors included in the second filter and being disposed on a side of the third terminal among inductors of the plurality of second inductors disposed between the first terminal and the third terminal.

6. The diplexer according to claim 1 , wherein the shield ground electrode is provided between the first filter ground electrode and the second filter ground electrode within the multilayer substrate.

7. The diplexer according to claim 1 , wherein
the first filter ground electrode and the first filter ground terminal are connected by a first via conductor, and the second filter ground electrode and the second filter ground terminal are connected by a second via conductor; and
an inductance component between the first filter ground electrode and the first filter ground terminal is larger than an inductance component between the second filter ground electrode and the second filter ground terminal.

8. The diplexer according to claim 7 , wherein
an outer edge portion of the second filter ground electrode has a larger number of indentations and/or an indentation larger in size than an outer edge portion of the first filter ground electrode; and
a number of the via conductors connecting the first filter ground electrode and the first filter ground terminal is less than a number of the via conductors connecting the second filter ground electrode and the second filter ground terminal.

9. The diplexer according to claim 1 , wherein the first filter ground electrode and the shield ground electrode are electromagnetically coupled, and the second filter ground electrode and the shield ground electrode are electromagnetically coupled.

10. The diplexer according to claim 1 , wherein the shield ground electrode includes a plurality of shield ground electrodes stacked in a plurality of interlayer spacings of the multilayer substrate and connected to each other by a via conductor.

11. The diplexer according to claim 1 , wherein
the shield ground electrode is disposed on the non-mounting surface of the multilayer substrate; and
the shield ground electrode disposed on the non-mounting surface of the multilayer substrate is connected to the shield ground electrode stacked in an interlayer spacing of the multilayer substrate by a via conductor.

12. The diplexer according to claim 1 , wherein
the first filter ground electrode includes a plurality of first filter ground electrodes stacked in a plurality of interlayer spacings of the multilayer substrate and are connected to each other by a via conductor;
the second filter ground electrode includes a plurality of second filter ground electrodes stacked in a plurality of interlayer spacings of the multilayer substrate and connected to each other by a via conductor;
the shield ground electrode includes a plurality of shield ground electrodes stacked in a plurality of interlayer spacings of the multilayer substrate and connected to each other by a via conductor; and
in a stacking direction of the multilayer substrate, an interlayer spacing where the multilayer substrate in which the first filter ground electrode, the second filter ground electrode, and the shield ground electrode are stacked such that the shield ground electrode is interposed between the first filter ground electrode and the second filter ground electrode, and an interlayer spacing where the multilayer substrate in which the first filter ground electrode, the second filter ground electrode, and the shield ground electrode are not stacked, are repeatedly provided a plurality of times in an alternating fashion.

13. The diplexer according to claim 1 , wherein the multilayer substrate is made of a low temperature co-fired ceramic.

14. The diplexer according to claim 1 , wherein a chuck mark that defines and functions as a guide mark during vacuum suction of the diplexer is provided on the non-mounting surface.

15. The diplexer according to claim 1 , wherein pin marks indicating locations of the first, second, third, and ground terminals are provided on the non-mounting surface.

16. The diplexer according to claim 1 , wherein the shield ground electrode is provided on the non-mounting surface.

17. The diplexer according to claim 16 , wherein the shield ground electrode defines and functions as a guide mark during vacuum suction of the diplexer is provided on the non-mounting surface and defines and functions as pin marks indicating locations of the first, second, third, and ground terminals.

Assignees

• Murata Manufacturing Co

Inventors

• Mizoguchi Naoki

Classifications

• H03H7/0161

  Bandpass filters (H03H7/12 takes precedence) · CPC title

• H03H7/1758

  Series LC in shunt or branch path (H03H7/1791 takes precedence) · CPC title

• H03H7/1775

  Parallel LC in shunt or branch path (H03H7/1791 takes precedence) · CPC title

• H03H7/175

  Series LC in series path (H03H7/1783 takes precedence) · CPC title

• H03H2001/0085

  Multilayer, e.g. LTCC, HTCC, green sheets · CPC title