Ceramic electronic component

Patent metadata

Field	Value
Publication number	US-10269491-B2
Application number	US-201514744337-A
Country	US
Kind code	B2
Filing date	Jun 19, 2015
Priority date	Jun 30, 2014
Publication date	Apr 23, 2019
Grant date	Apr 23, 2019

Abstract

A ceramic electronic component includes an electronic component body, an inner electrode, and an outer electrode. The outer electrode includes a fired electrode layer and first and second plated layers. The fired electrode layer is disposed on the electronic component body. The first plated layer is disposed on the fired electrode layer. The thickness of the first plated layer is about 3 μm to about 8 μm, for example. The first plated layer contains nickel. The second plated layer is disposed on the first plated layer. The thickness of the second plated layer is about 0.025 μm to about 1 μm, for example. The second plated layer contains lead.

First claim

What is claimed is:

1. A ceramic electronic component comprising:
an electronic component body including first and second principal surfaces extending along a longitudinal direction and a widthwise direction, first and second side surfaces extending along the longitudinal direction and a thickness direction, and first and second end surfaces extending along the widthwise direction and the thickness direction;
an inner electrode disposed within the electronic component body; and
an outer electrode that is disposed on the electronic component body and that is electrically connected to the inner electrode; wherein
the outer electrode includes:
a fired electrode layer disposed on the electronic component body;
a first plated layer that is disposed on the fired electrode layer and that is a Ni-plated layer having a thickness of about 3 μm to about 8 μm; and
a second plated layer that is disposed on the first plated layer and that is a Pd-plated layer having a thickness of about 0.025 μm to about 1 μm.

2. The ceramic electronic component according to claim 1 , wherein the fired electrode layer contains glass.

3. The ceramic electronic component according to claim 1 , wherein the fired electrode layer contains Cu.

4. The ceramic electronic component according to claim 1 , wherein the ceramic electronic component is one of a ceramic capacitor, a piezoelectric component, a thermistor, and an inductor.

5. The ceramic electronic component according to claim 1 , wherein the electronic component body has a rectangular or substantially rectangular parallelepiped shape.

6. The ceramic electronic component according to claim 1 , wherein the electronic component body is made of dielectric ceramics.

7. The ceramic electronic component according to claim 1 , wherein the electronic component body is made of piezoelectric ceramics.

8. The ceramic electronic component according to claim 1 , wherein the electronic component body is made of semiconductor ceramics.

9. The ceramic electronic component according to claim 1 , wherein the electronic component body is made of magnetic ceramics.

10. The ceramic electronic component according to claim 1 , wherein the internal electrodes ha a rectangular or substantially rectangular parallelepiped shape.

Assignees

• Murata Manufacturing Co

Inventors

• Kodama Satoshi
• Katsuta Seiji

Classifications

• H01G4/30 Primary

  Stacked capacitors (H01G4/33 takes precedence) · CPC title

• H01G4/0085

  Fried electrodes · CPC title

• H01G4/2325

  characterised by the material of the terminals · CPC title

• H01G4/248

  the terminals embracing or surrounding the capacitive element, e.g. caps (H01G4/252 takes precedence) · CPC title

• H01G2/06

  specially adapted for mounting on a printed-circuit support · CPC title