Thermocurable electroconductive adhesive

Patent metadata

Field	Value
Publication number	US-10266729-B2
Application number	US-201615554278-A
Country	US
Kind code	B2
Filing date	Feb 29, 2016
Priority date	Mar 2, 2015
Publication date	Apr 23, 2019
Grant date	Apr 23, 2019

Abstract

Conventional electroconductive adhesives had difficulty to have simultaneously storage stability and low temperature curability, and to have at the same time exhibition of adhesion strength and electric conductivity for poorly-adhesive metal adherends such as gold and nickel. The present invention accordingly provides an isotropic electroconductive adhesive that has low temperature curability in an atmosphere of 80 to 130° C. A thermocurable electroconductive adhesive containing component (A) to component (E) such that the component (E) is contained at 100 parts by mass or more and 1000 parts by mass or less relative to 100 parts by mass of the total of the component (A) and component (B); component (A): a urethane modified oligomer having a (meth)acrylic group component (B): a monomer having one (meth)acrylic group in the molecule component (C): an organic peroxide having specific structure component (D): a phosphoric acid ester compound component (E): electroconductive particles that are surface-treated with stearic acid.

First claim

The invention claimed is:

1. An isotropic thermocurable electroconductive adhesive comprising component (A) to component (E) such that the component (E) is contained at 100 parts by mass or more and 1000 parts by mass or less relative to 100 parts by mass of the total of the component (A) and component (B);
component (A): a urethane modified oligomer having a (meth)acrylic group
component (B): a monomer having one (meth)acrylic group in the molecule
component (C): an organic peroxide having the following structure

wherein in the formula, R 1 each independently represents a hydrocarbon group
component (D): a phosphoric acid ester compound
component (E): electroconductive particles that are surface-treated with stearic acid.

2. The isotropic thermocurable electroconductive adhesive according to claim 1 , wherein the component (C) is an organic peroxide having the following structure:

in the formula, R 2 each independently represents a hydrocarbon group.

3. The isotropic thermocurable electroconductive adhesive according to claim 1 , wherein the component (E) is silver powder or silver-plated powder that is surface-treated with stearic acid.

4. The isotropic thermocurable electroconductive adhesive according to claim 1 , wherein the component (D) contains a phosphoric acid ester compound which has a (meth)acrylic group in the molecule.

5. The isotropic thermocurable electroconductive adhesive according to claim 1 , further comprising a phenoxy resin.

6. The isotropic thermocurable electroconductive adhesive according to claim 1 , further comprising a ferromagnetic powder.

7. The isotropic thermocurable electroconductive adhesive according to claim 1 , wherein the adhesive is used for adhesion to a gold and/or nickel adherend.

8. The isotropic thermocurable electroconductive adhesive according to claim 7 , wherein adhesion strength to a gold and/or nickel adherend is 5 MPa or higher.

9. The isotropic thermocurable electroconductive adhesive according to claim 1 , wherein the component (E) is contained at 100 parts by mass or more and 800 parts by mass or less relative to 100 parts by mass of the total of the component (A) and component (B).

Assignees

• Three Bond Co Ltd

Inventors

• Ota Soichi
• Mafune Hitoshi
• Kato Makoto
• Osada Masayuki
• Suzuki Takashi

Classifications

• C09J175/16

  having terminal carbon-to-carbon unsaturated bonds · CPC title

• C08K5/521

  Esters of phosphoric acids, e.g. of H3PO4 · CPC title

• C08K3/08

  Metals · CPC title

• C09J171/00

  Adhesives based on polyethers obtained by reactions forming an ether link in the main chain (based on polyacetals C09J159/00; based on epoxy resins C09J163/00; based on polythioether-ethers C09J181/02; based on polyethersulfones C09J181/06); Adhesives based on derivatives of such polymers · CPC title

• C09J11/06

  organic · CPC title