External-leadwire crimping apparatus

US10264718B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10264718-B2
Application numberUS-201615233995-A
CountryUS
Kind codeB2
Filing dateAug 11, 2016
Priority dateMar 8, 2016
Publication dateApr 16, 2019
Grant dateApr 16, 2019

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

An external-leadwire crimping apparatus is provided by embodiments of the present invention, including: a heating base provided with a heating rod and a temperature sensor; a crimping tool tip which is connected with the heating base and supplied with heat from the heating base, the crimping tool tip being configured to to crimp a leadwire of a flexible printed circuit board onto a printed circuit board assembly, by curing a conductive adhesive after receipt of heat, and the crimping tool tip comprising a crimping tool tip body. The crimping tool tip body is provided with at least one heat dissipation slot on an upper surface thereof, the heat dissipation slot being configured to extend in a thickness direction of the crimping tool tip body and to penetrate therethrough at both ends; and the crimping tool tip body is provided with at least one heat dissipation hole penetrating the thickness direction thereof.

First claim

Opening claim text (preview).

What is claimed is: 1. An external-leadwire crimping apparatus, comprising: a heating base provided with a heating rod and a temperature sensor, and a crimping tool tip which is connected with the heating base and supplied with heat from the heating base, the crimping tool tip being configured to crimp a leadwire of a flexible printed circuit board onto a printed circuit board assembly by curing a conductive adhesive after receipt of heat, and the crimping tool tip comprising a crimping tool tip body; wherein the crimping tool tip body is provided on an upper surface thereof with at least one heat dissipation slot, the heat dissipation slot being configured to extend in a thickness direction, between both ends of the crimping tool tip body and to penetrate the crimping tool tip body at both ends thereof; and wherein the crimping tool tip body is provided with at least one heat dissipation hole penetrating the thickness direction thereof. 2. The external-leadwire crimping apparatus according to claim 1 , wherein the crimping tool tip being provided with at least two heat dissipation holes passing through, the heat dissipation holes being arranged to be in parallel in a direction leading from one side towards another side of the crimping tool tip body. 3. The external-leadwire crimping apparatus according to claim 2 , wherein diameters of the heat dissipation holes are identical with each other. 4. The external-leadwire crimping apparatus according to claim 2 , wherein diameters of the heat dissipation holes descend sequentially in both directions leading from a center towards both ends of the crimping tool tip body. 5. The external-leadwire crimping apparatus according to claim 2 , wherein the heat dissipation holes are arranged in parallel in a direction transverse to the thickness direction of the crimping tool tip body, in a plane parallel to at least one of an upper surface and a lower surface of the crimping tool tip body. 6. The external-leadwire crimping apparatus according to claim 5 , wherein the heat dissipation holes are arranged in parallel in a direction orthogonal to the thickness direction of the crimping tool tip body. 7. The external-leadwire crimping apparatus according to claim 1 , wherein diameters of the heat dissipation holes range from 0.1 mm to 10 mm. 8. The external-leadwire crimping apparatus according to claim 1 , wherein widths of the heat dissipation slots range from 0.1 mm to 10 mm and depths thereof range from 0.1 mm to 10 mm. 9. The external-leadwire crimping apparatus according to claim 1 , wherein the crimping tool tip body comprises a contact portion in contact with a leadwire to be crimped, the contact portion further comprising a stepped integral structure formed by at least two overlapped cuboids; and wherein cross sections of the cuboids within the stepped integral structure decrease sequentially in a direction from the upper surface towards the lower surface of the crimping tool tip body. 10. The external-leadwire crimping apparatus according to claim 9 , wherein heights of the cuboids within the stepped integral structure range from 0.1 mm to 10 mm; and wherein a length difference between two adjacent cuboids of the cuboids within the stepped integral structure ranges from 0.2 mm to 200 mm. 11. The external-leadwire crimping apparatus according to claim 1 , wherein a distance between a lower surface of the heating base and the lower surface of the crimping tool tip body ranges from 2 mm to 100 mm. 12. The external-leadwire crimping apparatus according to claim 1 , wherein the heat dissipation slots are provided in an amount of not more than 10. 13. The external-leadwire crimping apparatus according to claim 1 , wherein the heat dissipation holes are provided in an amount of not more than 50. 14. The external-leadwire crimping apparatus according to claim 2 , wherein at least two rows of heat dissipation holes are provided in parallel in a direction transverse to the thickness direction of the crimping tool tip body, the at least two rows of heat dissipation holes being arranged to be in parallel with at least one of the upper surface and the lower surface of the crimping tool tip body. 15. The external-leadwire crimping apparatus according to claim 14 , wherein the at least two rows of heat dissipation holes are arranged in parallel in a direction orthogonal to the thickness direction of the crimping tool tip body. 16. The external-leadwire crimping apparatus according to claim 14 , wherein any one row of the at least two rows of heat dissipation holes are configured to be aligned, relative to other row or rows of heat dissipation holes, in a vertical direction perpendicular to at least one of the upper surface and the lower surface of the crimping tool tip body. 17. The external-leadwire crimping apparatus according to claim 14 , wherein any one row of the at least two rows of heat dissipation holes are configured to be not completely aligned, relative to other row or rows of heat dissipation holes, in a vertical direction perpendicular to at least one of the upper surface and the lower surface of the crimping tool tip body. 18. The external-leadwire crimping apparatus according to claim 17 , wherein any one row of the at least two rows of heat dissipation holes are configured in a staggered and non-aligned arrangement relative to other row or rows of heat dissipation holes, in the vertical direction.

Assignees

Inventors

Classifications

  • by abutting, i.e. without alloying process · CPC title

  • H01R12/79Primary

    connecting to rigid printed circuits or like structures · CPC title

  • comprising means for controlling the temperature, e.g. making use of the curie point · CPC title

  • Treatment of the terminal leads as a separate operation (during transport H05K13/0076, H05K13/023; during mounting H05K13/04) · CPC title

  • using electrically conductive adhesives · CPC title

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Frequently asked questions

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What does patent US10264718B2 cover?
An external-leadwire crimping apparatus is provided by embodiments of the present invention, including: a heating base provided with a heating rod and a temperature sensor; a crimping tool tip which is connected with the heating base and supplied with heat from the heating base, the crimping tool tip being configured to to crimp a leadwire of a flexible printed circuit board onto a printed circ…
Who is the assignee on this patent?
Boe Technology Group Co Ltd, Hefei Xinsheng Optoelectronics Technology Co Ltd
What technology area does this patent fall under?
Primary CPC classification H01R12/79. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Apr 16 2019 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 2 related publications on this page (citations in our corpus or others sharing the same primary CPC).