Electronic component and manufacturing method therefor

Patent metadata

Field	Value
Publication number	US-10264677-B2
Application number	US-201715610658-A
Country	US
Kind code	B2
Filing date	Jun 1, 2017
Priority date	Dec 4, 2014
Publication date	Apr 16, 2019
Grant date	Apr 16, 2019

Abstract

An electronic component includes an electronic component element including first and second main surfaces, a heat-dissipation accelerating member on the first main surface, a sealing resin layer sealing the electronic component element, and a shielding member provided on the sealing resin layer and electrically connected to the heat-dissipation accelerating member. The heat-dissipation accelerating member includes fourth and fifth main surfaces. The electronic component includes a connecting member disposed on the fifth main surface of the heat-dissipation accelerating member and electrically connecting at least one portion of the heat-dissipation accelerating member and the shielding member. The connecting member has a higher thermal conductivity than the sealing resin layer. The contact area between the heat-dissipation accelerating member and the connecting member is smaller than the area of the fifth main surface.

First claim

What is claimed is:

1. An electronic component comprising:
an electronic component element including first and second main surfaces which oppose each other;
a heat-dissipation accelerating member that is disposed on the first main surface of the electronic component element and that is defined by a conductor;
a mounting substrate including a third main surface which opposes the second main surface of the electronic component element, the electronic component element being mounted on the mounting substrate;
a sealing resin layer disposed on the third main surface of the mounting substrate so as to seal the electronic component element; and
a shielding member disposed at least on a surface of the sealing resin layer opposite a surface positioned on the mounting substrate and that is electrically connected to the heat-dissipation accelerating member; wherein
the heat-dissipation accelerating member includes a fourth main surface positioned close or adjacent to the electronic component element and a fifth main surface which opposes the fourth main surface;
the electronic component further comprising:
a connecting member that is disposed on the fifth main surface of the heat-dissipation accelerating member and that electrically connects at least one portion of the heat-dissipation accelerating member and the shielding member with each other, the connecting member having a higher thermal conductivity than the sealing resin layer;

a contact area between the heat-dissipation accelerating member and the connecting member is smaller than an area of the fifth main surface of the heat-dissipation accelerating member; and
the fifth main surface of the heat-dissipation accelerating member and the sealing resin layer are in contact with each other.

2. The electronic component according to claim 1 , wherein the shielding member covers an external area of the sealing resin layer so that the sealing resin layer is not exposed to an exterior of the electronic component.

3. The electronic component according to claim 1 , wherein the connecting member includes a portion which is not connected to the shielding member, and the portion of the connecting member is exposed to an exterior of the electronic component.

4. The electronic component according to claim 1 , wherein
the sealing resin layer includes a sixth main surface, which is a surface opposite to the surface positioned on the mounting substrate;
the connecting member is not exposed to an exterior of the electronic component and includes a connecting end portion connected to the shielding member; and
the sixth main surface and the connecting end portion are flush with each other, and the shielding member includes a portion provided on the sixth main surface and on the connecting end portion.

5. The electronic component according to claim 1 , wherein the shielding member is connected to a ground potential.

6. The electronic component according to claim 1 , wherein a circuit of the electronic component element and the heat-dissipation accelerating member are electrically insulated from each other.

7. The electronic component according to claim 1 , further comprising:
a bonding agent that bonds the electronic component element and the heat-dissipation accelerating member to each other.

8. The electronic component according to claim 1 , wherein the heat-dissipation accelerating member is made of a metal.

9. The electronic component according to claim 1 , wherein the connecting member is made of a metal.

10. The electronic component according to claim 1 , wherein
the electronic component element includes a substrate including seventh and eighth main surfaces, a support member including a cavity provided on the eighth main surface of the substrate, and a cover member disposed on the support member so as to cover the cavity of the support member, a hollow portion being defined by the substrate, the support member, and the cover member; and
the seventh main surface of the substrate is the first main surface of the electronic component element.

11. The electronic component according to claim 10 , wherein a width of the eighth main surface of the substrate and a width of the cover member are smaller than a width of the seventh main surface of the substrate.

12. The electronic component according to claim 11 , wherein side surfaces connecting the seventh and eighth main surfaces of the substrate are tapered so that the width of the eighth main surface of the substrate becomes smaller than the width of the seventh main surface of the substrate.

13. The electronic component according to claim 12 , wherein
step sections are provided on the side surfaces connecting the seventh and eighth main surfaces of the substrate so that the width of the eighth main surface of the substrate becomes smaller than the width of the seventh main surface of the substrate;
the heat-dissipation accelerating member extends from the seventh main surface of the substrate to reach a portion of the step sections on the side surfaces;
the width of the cover member is smaller than the width of the seventh main surface of the substrate; and
the heat-dissipation accelerating member is neither disposed on the cover member nor on portions of the step sections with a smaller width.

14. The electronic component according to claim 11 , wherein the substrate is a piezoelectric substrate, and at least one IDT electrode is provided on the second main surface of the substrate.

15. The electronic component according to claim 1 , wherein the electronic component element is a surface acoustic wave element.

16. The electronic component according to claim 1 , wherein
the electronic component element includes a substrate including a piezoelectric body, the substrate including seventh and eighth main surfaces, at least one IDT electrode being provided on the eighth main surface of the substrate, the seventh main surface of the substrate being the first main surface of the electronic component element; and
the electronic component element does not include a hollow portion.

17. The electronic component according to claim 11 , wherein the heat-dissipation accelerating member includes a material having a higher toughness than a material of the substrate.

18. The electronic component according to claim 15 , wherein a region where the heat-dissipation accelerating member is disposed is superposed on at least one of the at least one IDT electrode, in a plan view of the heat-dissipation accelerating member.

19. The electronic component according to claim 1 , wherein the electronic component element is mounted on the mounting substrate via a bump, and the bump is disposed at a position superposed on the heat-dissipation accelerating member in a plan view of the heat-dissipation accelerating member.

Assignees

• Murata Manufacturing Co

Inventors

• Kawasaki Koichiro
• Kikuchi Taku
• Kitahara Takashi
• Noto Hiroki

Classifications

• H10W99/00

  Subject matter not provided for in other groups of this subclass · CPC title

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• H10W40/00

  Arrangements for thermal protection or thermal control (integrated devices comprising arrangements for thermal protection H10D89/60) · CPC title

• H03H9/02834

  of temperature influence (cut angles H03H9/02543) · CPC title

• H05K1/0216

  Reduction of cross-talk, noise or electromagnetic interference (grounding H05K1/0215) · CPC title