Low resistance vertical cavity light source with pnpn blocking
US-2018019572-A1 · Jan 18, 2018 · US
US10263393B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10263393-B2 |
| Application number | US-201815897672-A |
| Country | US |
| Kind code | B2 |
| Filing date | Feb 15, 2018 |
| Priority date | Feb 15, 2017 |
| Publication date | Apr 16, 2019 |
| Grant date | Apr 16, 2019 |
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A semiconductor vertical resonant cavity light source includes an upper and lower mirror that define a vertical resonant cavity. An active region is within the cavity for light generation between the upper and lower mirror. At least one cavity spacer region is between the active region and the upper mirror or lower mirror. The cavity includes an inner mode confinement region and an outer current blocking region. An index guide in the inner mode confinement region is between the cavity spacer region and the upper or lower mirror. The index guide and outer current blocking region each include a lower and upper epitaxial material layer thereon with an epitaxial interface region in between. At least a top surface of the lower material layer includes aluminum in the interface region throughout a full area of an active part of the vertical light source.
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The invention claimed is: 1. A semiconductor vertical resonant cavity light source (vertical light source), comprising: an upper mirror and a lower mirror that define ends of a vertical resonant cavity; an active region within said vertical resonant cavity for light generation; at least one cavity spacer region between said active region and said upper mirror or said lower mirror; an outer current blocking region and an inner mode confinement region within said outer current blocking region; an index guide in said inner mode confinement region between said cavity spacer region and said upper mirror or said lower mirror; wherein said index guide and said outer current blocking region each comprise a lower epitaxial material layer and an upper epitaxial material layer thereon with an epitaxial interface region in between, and wherein at least a top surface of said lower material layer comprises an Al-comprising material in said interface region throughout a full area of an active part of said vertical light source. 2. The vertical light source of claim 1 , wherein said lower material layer has an Al composition between 5% and 50% of Column III lattice sites at said interface region. 3. The vertical light source of claim 1 , wherein said lower material layer has an Al composition between 15% and 35% of Column III lattice sites at said interface region. 4. The vertical light source of claim 1 , wherein an epitaxial step height (ΔH) between (i) a height of said epitaxial interface in said inner mode confinement region having said index guide minus (ii) a height of said epitaxial interface in said outer current blocking region is zero. 5. The vertical light source of claim 1 , wherein an epitaxial step height (ΔH) between (i) a height of said epitaxial interface in said inner mode confinement region having said index guide minus (ii) a height of said epitaxial interface in said outer current blocking region is between 10 Å and 400 Å. 6. The vertical light source of claim 5 , wherein said ΔH is 10 Å to 200 Å. 7. The vertical light source of claim 1 , wherein said lower material layer has an Al composition >90% of Column III lattice sites at said interface region. 8. A semiconductor partial vertical resonant cavity light source (partial vertical light source), comprising: a lower mirror that defines a bottom end of a partial vertical resonant cavity; an active region within said partial vertical resonant cavity for light generation; at least one cavity spacer region between said active region and said lower mirror; said partial vertical resonant cavity further comprising a lower material layer providing at least a portion of a top mirror for said vertical resonant cavity and at least one layer intended to be patterned to form an inner mode confinement region within an outer current blocking portion having an epitaxial interface region in between, wherein said intended to be patterned-layer is for later removal; wherein a top surface of said lower material layer comprises an Al-comprising material in said interface region throughout a full area of an active part of said partial vertical light source. 9. The partial vertical light source of claim 8 , wherein said lower material layer has an Al composition between 5% and 50% of Column III lattice sites at said interface region. 10. The partial vertical light source of claim 8 , wherein said lower material layer has an Al composition between 15% and 35% of Column III lattice sites at said interface region. 11. The partial vertical light source of claim 8 , wherein said lower material layer has an Al composition greater than 90% of Column III lattice sites at said interface region. 12. The partial vertical light source of claim 8 , wherein said lower material layer has an Al composition greater than 90% of Column III lattice sites at said interface region. 13. The partial vertical light source of claim 8 , wherein said layer for later removal comprises a plurality of layers intended for later removal. 14. The partial vertical light source of claim 13 , wherein at least one of said plurality of layers includes indium (In). 15. A method for forming a semiconductor vertical resonant cavity light source (vertical light source), comprising: forming a partial vertical resonant cavity light source (partial vertical light source), comprising forming: a lower mirror that defines one end of a vertical resonant cavity; an active region within said vertical resonant cavity for light generation; at least one cavity spacer region between said active region and said lower mirror; at least one epitaxial terminating layer over said cavity spacer region; a lower material layer that forms an epitaxial interface region with said terminating layer, wherein at least a top surface of said lower material layer that adjoins said terminating layer comprises an Al-comprising material along said interface region; patterning said terminating layer to define at least one region intended to form index confining regions such that said terminating layer remains covering at least within said region intended to form said index confining regions; forming at least one current blocking portion for providing at least one outer current blocking region; placing said patterned partial vertical cavity light source into an epitaxial growth system, and then: thermal annealing to remove said terminating layers such that at least said top surface of said lower material layer that is Al-bearing in at least one area of said partial vertical light source intended to form a full area of an active part of said vertical light source is exposed to an epitaxial growth ambient, and epitaxial growing to deposit at least one epitaxial upper material layer on said lower material layer, wherein said upper material layer and said lower material layer comprises an Al-bearing material in at least said top surface of said lower material layer at said interface region. 16. The method of claim 15 , wherein said lower material layer has an Al composition between 5% and 50% of Column III lattice sites at said interface region. 17. The method of claim 15 , wherein said lower material layer has an Al composition between 15% and 35% of Column III lattice sites at said interface region. 18. The method of claim 15 , wherein an epitaxial step height (ΔH) between (i) a height of said epitaxial interface in an inner mode confinement region having an index guide minus (ii) a height of said epitaxial interface in said outer current blocking region is zero. 19. The method of claim 15 , wherein an epitaxial step height (ΔH) between (i) a height of said epitaxial interface in said inner mode confinement region having said index guide minus (ii) a height of said epitaxial interface in said outer current blocking region is between 10 Å and 400 Å. 20. The method of claim 15 , wherein an epitaxial step height (ΔH) between (i) a height of said epitaxial interface in said inner mode confinement region having said index guide minus (ii) a height of said epitaxial interface in said outer current blocking region is 10 Å to 200 Å. 21. The method of claim 15 , wherein said lower material layer has an Al composition >90% of Column III lattice sites at said interface region.
having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL] · CPC title
with more than one structure · CPC title
by means of particular conductivity zones, e.g. obtained by particle bombardment or diffusion · CPC title
containing spacer layers to adjust the phase of the light wave in the cavity · CPC title
having a special structure for lateral current or light confinement · CPC title
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