Electronic component including a material comprising epdxysilane-modified polyorganosiloxane

Patent metadata

Field	Value
Publication number	US-10263164-B2
Application number	US-201615549136-A
Country	US
Kind code	B2
Filing date	Feb 4, 2016
Priority date	Feb 6, 2015
Publication date	Apr 16, 2019
Grant date	Apr 16, 2019

Abstract

The present invention relates to an optoelectronic component comprising a semiconductor (1) and a polyorganosiloxane. The polyorganosiloxane is obtainable by crosslinking a composition comprising a first organosiloxane having at least one terminal vinyl group, a second organosiloxane having at least one silicon-hydrogen bond and an alkoxysilane having at least one epoxy group. Additionally specified is a method of producing an optoelectronic component.

First claim

The invention claimed is:

1. An optoelectronic component comprising an optoelectronic semiconductor and a polyorganosiloxane obtainable by crosslinking a composition comprising
a first organosiloxane having at least one terminal vinyl group,
a second organosiloxane having at least one silicon-hydrogen bond, and
an cpoxysilane having at least one epoxy group,
wherein the epoxysilane is present in a proportion of 0.1 to 20 wt. %, based on the total weight of the composition,
wherein the polyorganosiloxane has a Shore A hardness of at least 40, and
wherein the component additionally comprising a carrier, wherein the semiconductor is arranged on the carrier by means of an adhesion promoter and the adhesion promoter contains or consists of the polyorganosiloxane.

2. The optoelectronic component according to claim 1 , wherein the first organosiloxane comprises one or more monomer units of general formula (I)

wherein
R 1 is a C 2 -C 18 alkenyl, preferably vinyl, and
R 2 and R 3 are, independently of one another, a C 1 -C 18 alkyl or aryl, a C 2 -C 18 alkenyl or *—O.

3. The optoelectronic component according to claim 1 , wherein the second organosiloxane comprises one or more monomer units of general formula (II)

wherein
R 4 and R 5 are, independently of one another, a C 1 -C 10 alkyl or aryl, a hydrogen or *—O.

4. The optoelectronic component according to claim 1 , wherein the epoxysilane has a general formula
[R 6 (CH 2 ) a ] b H c Si(OR 7 ) d
wherein
R 6 comprises a C 2 -C 10 epoxyalkyl or epoxyalkoxy,
R 7 is a C 1 -C 18 alkyl or aryl, and
a=0 to 10, b=1, 2 or 3, c=0, 1 or 2, d=1, 2 or 3 and a÷b+c+d=4.

5. The optoelectronic component according to claim 1 , wherein the epoxysilane comprises an
(epoxyalkoxy)alkyltrialkoxysilane, in particular gamma-glycidoxypropyltrimethoxysilane, and/or
(epoxycycloalkyl)alkyltrialkoxysilane, in particular beta-(3,4-epoxycyclohexyl)ethyltrimethoxysilane and beta-(3,4-epoxycyclohexyl)ethyltriethoxysilane.

6. The optoelectronic component according to claim 1 , wherein the epoxysilane is present in a proportion of 0.1 to 20 wt. %, preferably 1 to 10 wt. %, particularly preferably 1 to 5 wt. %, based on the total weight of the composition.

7. The optoelectronic component according to claim 1 , wherein the semiconductor comprises a radiation-emitting or radiation-detecting semiconductor selected from a group consisting of light-emitting diode, organic light-emitting diode, optoelectronic sensor and photoactive element.

8. The optoelectronic component according to claim 7 , additionally comprising a radiation-transmitting element, which is arranged in a ray path or detector window of the rays emitted or detected by the semiconductor and comprises or consists of the polyorganosiloxane.

9. The optoelectronic component according to claim 8 , wherein the radiation-transmitting element is selected from the group consisting of an encapsulation, a lens and a light conversion element.

10. The optoelectronic component according to claim 7 , additionally comprising a radiation-reflecting element, which is arranged at least partially to the side of or opposite a radiation-emitting or radiation-detecting main surface of the semiconductor and comprises or consists of the polyorganosiloxane and a radiation-reflecting component.

11. The optoelectronic component according to claim 1 , additionally comprising a package body, wherein the package body surrounds the semiconductor at least in some areas and comprises or consists of the polyorganosiloxane.

12. The optoelectronic component according to claim 1 , wherein the component comprises a metallic and/or ceramic material, in particular Ag, Au, Cu and/or Al 2 O 3 , AlN, Si 3 N 4 , SiC or GaN, and the polyorganosiloxane is arranged in contact with the metallic and/or ceramic material at least in a partial area.

13. The optoelectronic component according to claim 1 , wherein the component further comprises a heat-dissipating element having a thermal conductivity of 0.5 to 15 W/mK which is applied as a layer on a metallic or ceramic carrier and/or additionally comprises or consists of a package body and the polyorganosiloxane and contains a heat-conductive component, preferably Al 2 O 3 or wherein the optoelectronic component is used for outdoor applications.

14. A method of producing an optoelectronic component according to claim 1 , comprising the steps of
providing the semiconductor and the composition,
thermally crosslinking the composition to obtain the polyorganosiloxane.

15. The method according to claim 14 , wherein the first organosiloxane has an average dynamic viscosity at 20° C. of no more than 100000 millipascal-seconds (mPa·s), preferably no more than 50000 mPa·s, particularly preferably no more than 20000 mPa·s and/or
the second organosiloxane has an average dynamic viscosity at 20° C. of no more than 100000 mPa·s, preferably no more than 35000 mPa·s, particularly preferably no more than 15000 mPa·s.

16. The method according to claim 14 , wherein the composition has an average dynamic viscosity at 20° C. of no more than 100000 mPa·s, preferably no more than 50000, particularly preferably no more than 20000 mPa·s.

17. An optoelectronic component comprising an optoelectronic semiconductor and a polyorganosiloxane obtainable by crosslinking a composition comprising
a first organosiloxane having at least one terminal vinyl group,
a second organosiloxane having at least one silicon-hydrogen bond and
an epoxysilane having at least one epoxy group,
wherein the epoxysilane is present in a proportion of 0.1 to 20 wt. %, based on the total weight of the composition, and
wherein the polyorganosiloxane has a Shore A hardness of at least 40.

18. The optoelectronic component according to claim 17 , additionally comprising a carrier, wherein the semiconductor is arranged on the carrier by means of an adhesion promoter and the adhesion promoter contains or consists of the polyorganosiloxane.

Assignees

• Osram Opto Semiconductors Gmbh

Inventors

• Keith Christina
• Schmidtke Kathy
• Hoehn Klaus

Classifications

• H10W90/734

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H01L2224/32225

  Electricity · mapped topic

• C08G77/12

  containing silicon bound to hydrogen · CPC title

• H01L33/56 Primary

  Electricity · mapped topic

• C08L83/04

  Polysiloxanes · CPC title