Method and device for removing material from a substrate

Patent metadata

Field	Value
Publication number	US-10259094-B2
Application number	US-201715425579-A
Country	US
Kind code	B2
Filing date	Feb 6, 2017
Priority date	Jan 3, 2017
Publication date	Apr 16, 2019
Grant date	Apr 16, 2019

Abstract

A material removal device for removing material from a substrate includes a holder extending between first and second sides and a grinding wheel supported by the holder and being operable to remove the material from the substrate. The holder has a guide frame at the first side and a support frame at the second side. The guide frame has a first bottom surface and the support frame has a second bottom surface. The first and second bottom surfaces are vertically offset from each other. The grinding wheel has an axle supported by the guide frame and the support frame. The grinding wheel has a grinding surface located below the first bottom surface and above the second bottom surface.

First claim

What is claimed is:

1. A material removal device for removing material from a substrate, the material removal device comprising:
a holder extending between first and second sides, the holder having a guide frame at the first side and a support frame at the second side, the guide frame having a first bottom surface, the support frame having a second bottom surface, the first and second bottom surfaces being vertically offset from each other;
a grinding wheel supported by the holder and being operable to remove the material from the substrate, the grinding wheel having an axle supported by the guide frame and the support frame, the grinding wheel having a grinding surface, the grinding surface being located below the first bottom surface and above the second bottom surface; and
a cover attached to the holder and partially surrounding the grinding wheel, the cover having a handle used to advance the material removal device in a grinding direction along the substrate, the cover includes a funnel for collecting the material removed by the grinding wheel.

2. The material removal device of claim 1 , wherein the first bottom surface is configured to rest on the substrate and the second bottom surface is configured to rest on the material a distance above the substrate.

3. The material removal device of claim 1 , wherein the grinding surface is parallel to the axle.

4. The material removal device of claim 1 , wherein the grinding surface is angled transverse relative to the axle.

5. The material removal device of claim 1 , wherein the grinding wheel is configured to remove a layer of the material having a thickness equal to a vertical distance between the grinding surface and the first bottom surface.

6. The material removal device of claim 1 , wherein the grinding wheel is configured to leave a layer of the material on the substrate having a thickness equal to a vertical distance between the grinding surface and the second bottom surface.

7. The material removal device of claim 1 , further comprising an actuator operably coupled to the axle to rotate the grinding wheel.

8. The material removal device of claim 1 , further comprising bearings held in the guide frame and the support frame, the bearings supporting the axle.

9. The material removal device of claim 1 , wherein the axle and the grinding wheel are integral including a common, unitary body.

10. The material removal device of claim 1 , wherein the guide frame includes a guide surface configured to engage a guide rail to guide advancing of the material removal device in a grinding direction along the substrate.

11. The material removal device of claim 1 , wherein the first bottom surface is milled down to a first offset distance from the grinding surface and the second bottom surface is milled down to a second offset distance from the grinding surface.

12. The material removal device of claim 1 , wherein the holder includes removable feet at bottoms of the guide frame and the support frame defining the first and second bottom surfaces, the removable feet being replaceable to adjust the position of the grinding wheel relative to the substrate.

13. The material removal device of claim 1 , wherein the holder has a support plane defined between the guide frame and the support frame, the grinding surface being nonparallel to the support plane.

14. The material removal device of claim 13 , wherein the support plane is non-horizontal.

15. A material removal system for removing material from a substrate, the material removal system comprising:
a guide rail configured to be mounted to the substrate, the guide rail having a datum edge;
a planing device for removing a first section of material, the planing device comprising a planing device holder and a planing device grinding wheel supported by the planing device holder and being operable to remove the first section of material from the substrate, the planing device holder extending between first and second sides, the planing device holder having a guide frame at the first side and a support frame at the second side, the guide frame configured to engage and slide along the datum edge of the guide rail during use, the guide frame having a first bottom surface, the support frame having a second bottom surface, the first and second bottom surfaces being vertically offset from each other, the planing device grinding wheel having a first axle supported by the guide frame and the support frame, the planing device grinding wheel having a planing grinding surface orientated parallel to the first axle; and
a tapering device for removing a second section of material, the tapering device comprising a tapering device holder and a tapering device grinding wheel supported by the tapering device holder and being operable to remove the second section of material from the substrate, the tapering device holder extending between first and second sides, the tapering device holder having a guide frame at the first side and a support frame at the second side, the guide frame configured to engage and slide along the datum edge of the guide rail during use, the guide frame having a first bottom surface, the support frame having a second bottom surface, the first and second bottom surfaces being vertically offset from each other, the tapering device grinding wheel having a second axle supported by the guide frame and the support frame, the tapering device grinding wheel having a tapering grinding surface orientated transverse to the second axle.

16. The material removal system of claim 15 , wherein a width of the planing device holder is wider than a width of the tapering device holder to position the planing device grinding wheel further from the datum edge for removing the first section of material and to position the tapering device grinding wheel closer to the datum edge for removing the second section of material.

17. The material removal system of claim 15 , wherein the guide rail is configured to be positioned a first distance from a joint of the substrate, the guide rail orienting the planing device a second distance from the joint and orienting the tapering device a third distance from the joint.

18. The material removal system of claim 15 , wherein the planing device is configured to remove substantially all of the material from the first section and orients the planing device grounding wheel a distance above the substrate such that a thin remaining layer of the material remains at the first section, the tapering device tapers the material from the thin remaining layer to an exterior surface of the material at the second section of material.

19. A material removal kit comprising:
a planing device for removing a first section of material from a substrate, the planing device comprising a planing device grinding wheel having a first axle and a planing grinding surface orientated parallel to the first axle; and
a tapering device for removing a second section of material from the substrate immediately adjacent the first section of material, the tapering device comprising a tapering device grinding wheel having a second axle and a tapering grinding surface orientated transverse to the second axle;
wherein the planing device is configured to traverse along the substrate to remove the first section of material and wherein the tapering device is configured to traverse along the substrate adjacent to the area where the first section was removed to remove the second section of material; and
wherein the planing device is a first planing device having a first planing device holder hol

Assignees

• Boeing Co

Inventors

• Toberman Daniel L
• Fritsche David L
• Miller Michael R
• Wolf Robert M

Classifications

• B24B7/10 Primary

  Single-purpose machines or devices (grinding tools or machines specially designed for use on assembled railway track E01B31/17) · CPC title

• B64F5/40

  Maintaining or repairing aircraft · CPC title