Connecting metal foils/wires and components in 3D printed substrates with wire bonding

Patent metadata

Field	Value
Publication number	US-10259081-B2
Application number	US-201715426379-A
Country	US
Kind code	B2
Filing date	Feb 7, 2017
Priority date	Feb 8, 2016
Publication date	Apr 16, 2019
Grant date	Apr 16, 2019

Abstract

A three-dimensional electronic, biological, chemical, thermal management, or electromechanical apparatus and method thereof. One or more layers of a three-dimensional structure are deposited on a substrate. The three-dimensional structure is configured to include one or more internal cavities using, an extrusion-based additive manufacturing system enhanced with a range of secondary embedding processes. The three-dimensional structure includes one or more structural integrated metal objects spanning the one or more of the internal cavities of the three-dimensional structure for enhanced electromagnetic properties and bonded between two or more other metal objects located at the same layer or different layers of the three-dimensional structure.

First claim

What is claimed is:

1. A method of forming a three-dimensional electronic apparatus, biological, chemical, thermal management, or electromechanical apparatus, said method comprising:
forming a first polymer layer of a three-dimensional structure using extrusion based additive manufacturing;
depositing a first metallic component on top of the first polymer layer, wherein the first metallic component extends from a first end of the first polymer layer over a portion of the first polymer layer that is less than the full length of the first polymer layer;
forming a second polymer layer over the first polymer layer and first metallic component using extrusion based additive manufacturing, wherein the second polymer layer comprises a first internal gap that leaves a portion of the first polymer layer and first metallic component uncovered;
depositing a second metallic component on top of the second polymer layer, wherein the second metallic component is on a side of the first internal gap opposite the first metallic component;
providing at least one structural integrated metal object spanning a portion of said first internal gap for enhanced electromagnetic properties and bonded between the first metallic component and the second metallic component located at different layers of said three-dimensional structure;
forming a third polymer layer over the second polymer layer and second metallic components using extrusion based additive manufacturing, wherein the third polymer layer comprises a second internal gap that is wider than the first internal gap and forms with the first internal gap a reservoir in which the structural integrated metal object and portions of the first and second metallic components to which the structural integrated metal object is bonded are uncovered;
filling the reservoir with a liquid curable polymer such that the structural integrated metal object is completely encased within the liquid curable polymer; and
curing said liquid curable polymer to set and protect the structural integrated metal object within the reservoir such that a bond between first metallic component and second metallic component becomes stable and permanent.

2. The method of claim 1 wherein said at least one structural integrated metal object comprises a wire.

3. The method of claim 1 , wherein the first metallic component and the second metallic component comprise a wire or a foil.

4. The method of claim 1 wherein said at least one structural integrated metal object is bonded ultrasonically to the first metallic component and the second metallic component.

5. The method of claim 2 wherein said wire comprises an arching wire.

6. The method of claim 5 further comprising:
configuring the second internal cavity to completely subsume said arching wire.

7. The method of claim 1 wherein at least one of the first polymer layer, second polymer layer, and third polymer layer comprise a dielectric polymer.

8. The method of claim 1 wherein the liquid curable polymer is thermally cured.

9. The method of claim 1 wherein the liquid curable polymer is UV cured.

Assignees

• Univ Texas

Inventors

• Macdonald Eric
• Espalin David
• Wicker Ryan

Classifications

• B23K20/004

  Wire welding · CPC title

• B23K2101/36

  Electric or electronic devices · CPC title

• B23K20/10

  making use of vibrations, e.g. ultrasonic welding · CPC title

• B33Y70/00

  Materials specially adapted for additive manufacturing · CPC title

• B33Y40/00

  Auxiliary operations or equipment, e.g. for material handling · CPC title