Mother ceramic substrate, ceramic substrate, mother module component, module component, and method of manufacturing mother ceramic substrate

Patent metadata

Field	Value
Publication number	US-10257927-B2
Application number	US-201615358241-A
Country	US
Kind code	B2
Filing date	Nov 22, 2016
Priority date	May 27, 2014
Publication date	Apr 9, 2019
Grant date	Apr 9, 2019

Abstract

Provided is a mother ceramic substrate that, when divided into individual substrates (ceramic substrates), can be divided to cause divided end surfaces to be perpendicular to principal surfaces of the individual substrates, and that can provide ceramic substrates with high form accuracy; an individual ceramic substrate obtained from the mother ceramic substrate; a module component including the ceramic substrate; and a method of manufacturing a mother ceramic substrate. In a mother ceramic substrate that can be divided at a predetermined position and separated into a plurality of individual substrates, a dividing groove that defines a division position is formed in a principal surface on one side, and a protruding thread is formed on a principal surface on another side at a position corresponding to a position of the dividing groove formed in the principal surface on the one side in view in a thickness direction of the mother ceramic substrate.

First claim

The invention claimed is:

1. A mother ceramic substrate dividable at a predetermined position and separated into a plurality of individual substrates, the mother ceramic substrate comprising:
a dividing groove defining a division position formed in one principal surface, and
a protruding thread formed on another principal surface and protruding integrally with the mother ceramic substrate from a position corresponding to a position of the dividing groove formed in the one principal surface in viewing in a thickness direction of the mother ceramic substrate.

2. The mother ceramic substrate according to claim 1 , further comprising inner conductors in such a manner that the individual substrates obtained after dividing the mother ceramic substrate respectively include the inner conductors.

3. A ceramic substrate comprising the individual substrate obtained by dividing the mother ceramic substrate according to claim 1 along the dividing groove.

4. A mother module component comprising surface mount devices respectively mounted in regions where the individual substrates are located after dividing the mother ceramic substrate according to claim 1 .

5. A module component obtained by dividing the mother module component according to claim 4 along the dividing groove of the mother ceramic substrate.

6. A method of manufacturing the mother ceramic substrate according to claim 1 , comprising:
providing a first die having a protruding thread portion on a surface of the first die and a second die having a groove portion in a surface of the second die at a position at which the groove portion directly faces the protruding thread portion of the first die;
bringing the surface of the first die having the protruding thread portion into contact with one principal surface of an unfired mother ceramic substrate and bringing the surface of the second die having the groove portion into contact with another principal surface of the unfired mother ceramic substrate;
performing press processing on the first die and the second die to form the dividing groove in the one principal surface of the unfired mother ceramic substrate, and to form a protruding thread on the another principal surface of the unfired mother ceramic substrate at a position corresponding to a position of the dividing groove formed in the one principal surface of the unfired mother ceramic substrate in viewing in a thickness direction of the unfired mother ceramic substrate; and
firing the unfired mother ceramic substrate having the dividing groove and the protruding thread.

7. A method of manufacturing the mother ceramic substrate according to claim 1 , comprising:
performing isostatic press while a surface of a die having a protruding thread portion is in contact with one principal surface of an unfired mother ceramic substrate and an elastic body is in contact with another principal surface of the unfired mother ceramic substrate to form the dividing groove in the one principal surface of the unfired mother ceramic substrate, and to form a protruding thread on the another principal surface of the unfired mother ceramic substrate at a position corresponding to a position of the dividing groove formed in the one principal surface of the unfired mother ceramic substrate in viewing in a thickness direction of the unfired mother ceramic substrate; and
firing the unfired mother ceramic substrate having the dividing groove and the protruding thread.

8. A method of manufacturing the mother ceramic substrate according to claim 1 , comprising:
performing press processing while a surface of a die having a protruding thread portion is in contact with one principal surface of an unfired mother ceramic substrate and a rigid body is arranged at another principal surface of the unfired mother ceramic substrate with an elastic body interposed between the unfired mother ceramic substrate and the rigid body to form the dividing groove in the one principal surface of the unfired mother ceramic substrate, and to form a protruding thread on the another principal surface of the unfired mother ceramic substrate at a position corresponding to a position of the dividing groove formed in the one principal surface of the unfired mother ceramic substrate in viewing in a thickness direction of the unfired mother ceramic substrate; and
firing the unfired mother ceramic substrate having the dividing groove and the protruding thread.

9. A method of manufacturing the mother ceramic substrate according to claim 1 , comprising:
bringing a surface of a die having a groove portion into contact with one principal surface of an unfired mother ceramic substrate;
performing press processing on the die and the unfired mother ceramic substrate to form a protruding thread on the one principal surface of the unfired mother ceramic substrate;
performing processing on the die and the unfired mother ceramic substrate to form the dividing groove in the another principal surface of the unfired mother ceramic substrate at a position corresponding to a position of the protruding thread formed on the one principal surface of the unfired mother ceramic substrate in viewing in a thickness direction of the unfired mother ceramic substrate; and
firing the unfired mother ceramic substrate having the dividing groove and the protruding thread.

10. A ceramic substrate comprising the individual substrate obtained by dividing the mother ceramic substrate according to claim 2 along the dividing groove.

11. A mother module component comprising surface mount devices respectively mounted in regions where the individual substrates are located after dividing the mother ceramic substrate according to claim 2 .

12. A method of manufacturing the mother ceramic substrate according to claim 2 , comprising:
providing a first die having a protruding thread portion on a surface of the first die and a second die having a groove portion in a surface of the second die at a position at which the groove portion directly faces the protruding thread portion of the first die;
bringing the surface of the first die having the protruding thread portion into contact with one principal surface of an unfired mother ceramic substrate and bringing the surface of the second die having the groove portion into contact with another principal surface of the unfired mother ceramic substrate;
performing press processing on the first die and the second die to form the dividing groove in the one principal surface of the unfired mother ceramic substrate, and to form a protruding thread on the another principal surface of the unfired mother ceramic substrate at a position corresponding to a position of the dividing groove formed in the one principal surface of the unfired mother ceramic substrate in viewing in a thickness direction of the unfired mother ceramic substrate; and
firing the unfired mother ceramic substrate having the dividing groove and the protruding thread.

13. A method of manufacturing the mother ceramic substrate according to claim 2 , comprising:
performing isostatic press while a surface of a die having a protruding thread portion is in contact with one principal surface of an unfired mother ceramic substrate and an elastic body is in contact with another principal surface of the unfired mother ceramic substrate to form the dividing groove in the one principal surface of the unfired mother ceramic substrate, and to form a protruding thread on the another principal surface of the unfired mother ceramic substrate at a position corresponding to a position of the dividing groove formed in the one principal surface of the unfired mother ceramic substrate in viewing in a thickness direc

Assignees

• Murata Manufacturing Co

Inventors

• Maeda Yukio
• Matsubara Masashi
• Matsubara Daigo
• Kariya Masatoshi

Classifications

• H05K2201/09127

  PCB or component having an integral separable or breakable part · CPC title

• H05K3/0014

  Shaping of the substrate, e.g. by moulding · CPC title

• H05K2203/0113

  Female die used for patterning or transferring, e.g. temporary substrate having recessed pattern · CPC title

• H05K3/0097

  Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards (H05K3/0052 takes precedence) · CPC title

• H05K2201/0909

  Preformed cutting or breaking line · CPC title