Portable terminal and a component mounting method

Patent metadata

Field	Value
Publication number	US-10257332-B2
Application number	US-201615016945-A
Country	US
Kind code	B2
Filing date	Feb 5, 2016
Priority date	Feb 12, 2015
Publication date	Apr 9, 2019
Grant date	Apr 9, 2019

Abstract

An electronic device that includes a circuit board which is arranged between a front cover and a back cover, and includes a conductive pattern inserted into the circuit board. A signal generation or power supply element is electrically connected with the conductive pattern. An adhesion layer is attached onto the circuit board and overlaps at least part of the conductive pattern when viewed from above the circuit board. A first structure is arranged on the adhesion layer and overlaps at least part of the adhesion layer when viewed from above the circuit board. A second structure is arranged on a top of the first structure, overlaps at least part of the first structure when viewed from above the circuit board, and the second structure includes a bottom surface including metal. A metal layer is inserted between the first structure and the bottom surface of the second structure to attach the second structure to the first structure.

First claim

What is claimed is:

1. A portable terminal comprising:
a circuit board comprising a conductive pattern inserted into the circuit board;
a signal generation or power supply element being electrically connected with the conductive pattern;
a non-conductive adhesion layer attached onto the circuit board that overlaps at least part of the conductive pattern when viewed from above the circuit board;
a first structure arranged on the adhesion layer that overlaps at least part of the adhesion layer when viewed from above the circuit board, wherein the first structure includes a metal material and is insulated from the circuit board by the non-conductive adhesion layer, and wherein the first structure has an annular shape;
a second structure arranged above the first structure that overlaps at least part of the first structure when viewed from above the circuit board, and comprises a bottom surface comprising metal;
a metal layer inserted between the first structure and the bottom surface of the second structure so as to couple therebetween; and
an optical sensor disposed on the circuit board and enclosed by the annular-shaped first structure,
wherein the second structure comprises:
an annular metal bracket; and
a light transmission sheet arranged on a penetrating portion of the metal bracket.

2. The portable terminal of claim 1 , further comprising:
a front cover;
a back cover; and
wherein the circuit board is arranged between the front cover and the back cover.

3. The portable terminal of claim 1 , wherein a top of the first structure comprises metal.

4. The portable terminal of claim 1 , wherein the first structure has a plate shape.

5. The portable terminal of claim 1 , wherein the first structure has a substantially same size and/or shape as the adhesion layer when viewed from above the circuit board.

6. The portable terminal of claim 1 , wherein the metal layer comprises solder.

7. The portable terminal of claim 1 , wherein a border surface of the metal layer comprises one of at least one concave portion or at least one convex portion arranged between the first structure and the second structure.

8. The portable terminal of claim 1 , wherein the adhesion layer is in contact with a treatment surface of the circuit board.

9. The portable terminal of claim 1 , wherein the adhesion layer does not overlap a pad exposed on the circuit board to facilitate soldering.

10. The portable terminal of claim 1 , wherein the first structure does not overlap a pad which is exposed on the circuit board to facilitate soldering.

11. The portable terminal of claim 2 , further comprising a wireless communication module and at least one antenna arranged between the front cover and the back cover.

12. An electronic device comprising:
a first member;
a circuit board including a conductive pattern arranged therein;
an annular-shaped second member arranged between the first member and the circuit board and including a metal material;
a non-conductive adhesion layer arranged between the second member and the circuit board so as to couple therebetween;
a metal layer arranged between the first member and the second member so as to couple therebetween; and
an optical sensor disposed on the circuit board and enclosed by the annular-shaped second member,
wherein first member comprises:
an annular bracket; and
a light transmission sheet arranged on a penetrating portion of the metal bracket.

13. The electronic device of claim 12 , wherein the second member comprises a metal formed on a part thereof connected with the metal layer.

14. The electronic device of claim 12 , wherein the second member does not overlap a pad exposed on the circuit board to facilitate soldering.

15. The electronic device of claim 12 , wherein the adhesion layer does not overlap a pad exposed on the circuit board to facilitate soldering.

16. The electronic device of claim 12 , wherein the metal layer comprises solder.

Assignees

• Samsung Electronics Co Ltd

Inventors

• Kim Manho
• JUNG Hwajoong
• Kim Youngseok
• Yoon Youngkwon
• Lee Kihuk
• Choi Yonghwan
• PYO Sunhyoung

Classifications

• H05K3/341

  Surface mounted components · CPC title

• H04M1/0202

  Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets (constructional features of telephone transmitters or receivers, e.g. of speakers or microphones H04M1/03) · CPC title

• H04M1/0277 Primary

  for a printed circuit board assembly · CPC title

• H05K1/0271

  Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion · CPC title

• H05K1/183

  associated with components mounted in and supported by recessed areas of the PCBs · CPC title