Component for secondary battery and manufacturing method thereof, and secondary battery and multi-battery system manufactured by using the component

Patent metadata

Field	Value
Publication number	US-10256454-B2
Application number	US-201614991677-A
Country	US
Kind code	B2
Filing date	Jan 8, 2016
Priority date	Jun 17, 2011
Publication date	Apr 9, 2019
Grant date	Apr 9, 2019

Abstract

The present invention describes a component for a secondary battery and a manufacturing method thereof, and a secondary battery manufactured by using the component. The component for a secondary battery according to the present invention comprises a lead-free soldering bridge having a melting point of 150 to 300° C. and containing tin (Sn) and copper (Cu) as a main ingredient; the first and second metal plates spaced therebetween through a gap and coupling with the lead-free soldering bridge. According to the present invention, when an over-current flows through the component for a secondary battery, the temperature of the lead-free soldering bridge is locally increased rapidly to melt the lead-free soldering bridge, thereby efficiently interrupting the flow of an over-current.

First claim

What is claimed is:

1. A component for a secondary battery comprising:
a lead-free soldering bridge having a melting point of 150° C. to 300° C. and containing tin (Sn), copper (Cu), and an additional metal; and
a first metal plate and a second metal plate spaced from each other with a minute gap between side edges of the first metal plate and the second metal plate and coupled with the lead-free soldering bridge,
wherein the content of copper is in the range of 4 to 8 wt%,
wherein the content of the additional metal is 0.01 to 10 wt%,
wherein the lead-free soldering bridge is coupled with the first and second metal plates at an area formed by an encounter of grooves formed at edges of top surfaces of the first and second metal plates,
wherein a top surface of the lead-free soldering bridge is coplanar with the top surfaces of the first and second metal plates.

2. The component for a secondary battery according to claim 1 , wherein the first metal plate and the second metal plate are positioned on the same plane.

3. The component for a secondary battery according to claim 1 , wherein the gap has a width of 0.3 mm or less.

4. The component for a secondary battery according to claim 1 , wherein the gap has any one pattern selected from a straight pattern, a zigzag pattern, a saw-toothed pattern, a wave pattern, and a combination thereof.

5. The component for a secondary battery according to claim 1 , wherein the additional metal is selected from nickel, zinc and silver.

6. The component for a secondary battery according to claim 1 , further comprising an insulating tape to cover the lead-free soldering bridge, the gap, or both.

7. A secondary battery comprising:
an electrode assembly in which a cathode lead and an anode lead are electrically coupled to each other; and
a packing for sealing the electrode assembly to externally expose a part of the cathode lead and the anode lead,
wherein the component for a secondary battery of claim 1 is used as the cathode lead, the anode lead, or both.

8. A multi battery system having a plurality of secondary batteries, comprising:
a connector for connecting the plurality of secondary batteries to each other in series, in parallel, or both,
wherein the component for a secondary battery of claim 1 is used as the connector.

9. The multi battery system according to claim 8 , wherein the multi battery system is used as a power source of power tools; vehicles powered by electricity including electric vehicles (EV), hybrid electric vehicle (HEV) and plug-in hybrid electric vehicles (PHEV); electric trucks; or power storage apparatuses.

10. The component for a secondary battery according to claim 1 , wherein the top surface of the lead-free soldering bridge faces a same direction as the top surfaces of the first and second metal plates.

11. The component for a secondary battery according to claim 1 , wherein an entirety of the top surface of the lead-free soldering bridge is not covered by the first and second metal plates.

Assignees

• Lg Chemical Ltd

Inventors

• Yang Jung-Hoon
• Choi Seung-Don
• Jeon Ji-Hoon
• Cho Young-Suk

Classifications

• B23K35/262 Primary

  Sn as the principal constituent · CPC title

• H01H85/11

  with applied local area of a metal which, on melting, forms a eutectic with the main material of the fusible member, i.e. M-effect devices · CPC title

• B23K2103/18

  Dissimilar materials · CPC title

• B23K2103/12

  Copper or alloys thereof · CPC title

• B23K2103/08

  Non-ferrous metals or alloys · CPC title