Optoelectronic component and method for producing an optoelectronic component

Patent metadata

Field	Value
Publication number	US-10256379-B2
Application number	US-201615579090-A
Country	US
Kind code	B2
Filing date	May 25, 2016
Priority date	Jun 2, 2015
Publication date	Apr 9, 2019
Grant date	Apr 9, 2019

Abstract

An optoelectronic component and a method for producing an optoelectronic component are disclosed. In an embodiment an optoelectronic component includes at least one metallic surface, a contacted optoelectronic semiconductor chip configured to emit radiation and a protective layer arranged on the at least one metallic surface, wherein the protective layer comprises a protective material of at least one N-heterocyclic carbene, and wherein a covalent bond is formed between the protective material and the at least one metallic surface.

First claim

The invention claimed is:

1. An optoelectronic component comprising:
at least one metallic surface;
a contacted optoelectronic semiconductor chip configured to emit radiation; and
a protective layer arranged on the at least one metallic surface,
wherein the protective layer comprises a protective material of at least one N-heterocyclic carbene, and
wherein a covalent bond is formed between the protective material and the at least one metallic surface.

2. The optoelectronic component according to claim 1 ,
wherein the protective layer is formed as self-assembled monolayer.

3. The optoelectronic component according to claim 2 , wherein the protective layer has a layer thickness equal to or less than 1 nm.

4. The optoelectronic component according to claim 1 ,
wherein the protective material is at least one N-heterocyclic carbene,
wherein the N-heterocyclic carbene is selected from the group consisting of

wherein R 1 , R 1 ′, R 2 , R 3 , R 4 , R 5 , R 6 , R 7 , R 8 , R 9 , R 10 and R 11 are selected independently from one another of hydrogen, alkyl groups, alkoxy groups, groups with amines, amides, esters, carbonates, substituted or unsubstituted aromatic compounds, substituted or unsubstituted hetero-aromatic compounds, halogens or pseudo-halogens, and wherein —X is a covalent bond to the metallic surface.

5. The optoelectronic component according to claim 1 ,
wherein the protective material is selected from the group consisting of

wherein R 1 and R 2 are in each case an alkyl-substituted phenyl, or

wherein R 1 , R 2 and R 9 are in each case a phenyl, and wherein —X is a covalent bond to the metallic surface.

6. The optoelectronic component according to claim 1 ,
wherein the metallic surface comprises a surface of a first metallic connecting contact, of a second metallic connecting contact, of a lead frame, of a bond pad or of a bond wire, and wherein the metallic surface includes at least one metal or alloy selected from silver, aluminum, cadmium, barium, indium, magnesium, calcium, lithium or gold.

7. The optoelectronic component according to claim 1 ,
wherein all metallic surfaces of the optoelectronic component are covered with the protective layer in a form-fit manner.

8. The optoelectronic component according to claim 1 ,
wherein the contacted optoelectronic semiconductor chip is arranged in a housing having a recess, wherein the metallic surface of the optoelectronic component includes at least the metallic surfaces of a bond pad, of a bond wire and of a lead frame, wherein the protective layer covers the metallic surfaces of the optoelectronic component within the recess in a form-fit manner, and wherein the recess is potted with a potting material including silicone.

9. The optoelectronic component according to claim 1 ,
wherein the protective layer is diffusion-resistant toward corrosive gases.

10. A method for producing the optoelectronic component having at least one metallic surface according to claim 1 , the method comprising:
providing the contacted optoelectronic semiconductor chip;
providing the at least one metallic surface; and
applying the protective layer on the at least one metallic surface so that the at least one N-heterocyclic carbene is a monolayer.

11. The method according to claim 10 ,
wherein applying the protective layer on the at least one metallic surface comprises applying the protective layer by a vapor deposition.

12. The method according to claim 10 ,
wherein applying the protective layer on the at least one metallic surface comprises applying the protective layer by wet-chemical processes.

13. The method according to claim 10 , further comprising
after applying the protective layer, potting the contacted optoelectronic semiconductor chip and the metallic surface coated with the protective layer.

14. The method according to claim 13 , wherein potting is performed with silicone.

Assignees

• Osram Opto Semiconductors Gmbh

Inventors

• Lindberg Gudrun

Classifications

• H10W72/5363

  the connected ends being wedge-shaped · CPC title

• H10W72/536

  the connected ends being ball-shaped · CPC title

• H10W72/01515

  Forming coatings · CPC title

• H10W72/075

  of bond wires · CPC title

• H10W90/756

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title