Apparatus and methods for micro-transfer-printing

Patent metadata

Field	Value
Publication number	US-10252514-B2
Application number	US-201615387389-A
Country	US
Kind code	B2
Filing date	Dec 21, 2016
Priority date	Jul 20, 2014
Publication date	Apr 9, 2019
Grant date	Apr 9, 2019

Abstract

In an aspect, a system and method for assembling a semiconductor device on a receiving surface of a destination substrate is disclosed. In another aspect, a system and method for assembling a semiconductor device on a destination substrate with topographic features is disclosed. In another aspect, a gravity-assisted separation system and method for printing semiconductor device is disclosed. In another aspect, various features of a transfer device for printing semiconductor devices are disclosed.

First claim

What is claimed:

1. A method for assembling a semiconductor device on a receiving surface of a destination substrate by micro-transfer printing, the method comprising:
providing the semiconductor device formed on a native substrate, wherein the semiconductor device has a relatively low coefficient of thermal expansion;
contacting a top surface of the semiconductor device with a conformable transfer device comprising an elastomer stamp comprising a protruding post having a contact surface, wherein contact between the contact surface and the top surface of the semiconductor device at least temporarily binds the semiconductor device to the conformable transfer device, wherein the conformable transfer device has a relatively high coefficient of thermal expansion that is higher than the relatively low coefficient of thermal expansion of the semiconductor device;
separating the semiconductor device from the native substrate such that the contact surface of the conformable transfer device has the semiconductor device disposed thereon with the semiconductor device released from the native substrate;
contacting the semiconductor device disposed on the contact surface with the receiving surface of the destination substrate;
heating the destination substrate and the conformable transfer device to cause the conformable transfer device to expand more than the semiconductor device; and
separating the contact surface of the conformable transfer device from the semiconductor device, thereby micro-transfer printing the semiconductor device onto the receiving surface of the destination substrate.

2. The method of claim 1 , wherein the heat is provided by a heating element.

3. The method of claim 2 , wherein the heating element is disposed on a side of the destination substrate opposite the receiving surface.

4. The method of claim 2 , wherein the heating element a non-contact thermal source that does not make direct physical contact with the destination substrate.

5. The method of claim 1 , wherein the destination substrate is heated.

6. The method of claim 1 , wherein the heating element is a hotplate.

7. The method of claim 6 , wherein the hotplate is direct thermal contact with the destination substrate.

8. The method of claim 1 , wherein the destination substrate is heated to an equilibrium temperature prior to the printable semiconductor elements being transferred to the substrate.

Assignees

• X Celeprint Ltd

Inventors

• Bower Christopher
• Meitl Matthew
• Gomez David
• Bonafede Salvatore
• Kneeburg David

Classifications

• H10W72/0198

  batch processes · CPC title

• H10W72/07141

  Means for applying energy, e.g. ovens or lasers · CPC title

• H10W72/07331

  Connecting techniques · CPC title

• H10W72/07304

  the auxiliary member being temporary, e.g. a sacrificial coating · CPC title

• H10W72/01371

  Cleaning, e.g. oxide removal or de-smearing · CPC title