Acoustic wave device

Patent metadata

Field	Value
Publication number	US-10250219-B2
Application number	US-201715430849-A
Country	US
Kind code	B2
Filing date	Feb 13, 2017
Priority date	May 26, 2016
Publication date	Apr 2, 2019
Grant date	Apr 2, 2019

Abstract

An acoustic wave device includes: a first substrate that includes a first acoustic wave filter located on an upper surface of the first substrate; a second substrate that is flip-chip mounted on the upper surface of the first substrate through a bump, and includes a second acoustic wave filter on a lower surface of the second substrate, the lower surface of the second substrate facing the upper surface of the first substrate across an air gap; and a shield electrode that is supported by the upper surface of the first substrate, and is located between at least a part of the first acoustic wave filter and at least a part of the second acoustic wave filter through the air gap.

First claim

What is claimed is:

1. An acoustic wave device comprising:
a first substrate that includes a first acoustic wave filter located on an upper surface of the first substrate;
a second substrate that is flip-chip mounted on the upper surface of the first substrate through a bump, and includes a second acoustic wave filter on a lower surface of the second substrate, the lower surface of the second substrate facing the upper surface of the first substrate across an air gap; and
a shield electrode that is only supported by the upper surface of the first substrate among the upper surface of the first substrate and the lower surface of the second substrate, and is located between at least a part of the first acoustic wave filter and at least a part of the second acoustic wave filter through the air gap.

2. The acoustic wave device according to claim 1 , wherein
the first acoustic wave filter and the second acoustic wave filter have different passbands.

3. The acoustic wave device according to claim 1 , wherein
the first acoustic wave filter includes a plurality of acoustic wave resonators, and the shield electrode overlaps with at least one of the plurality of acoustic wave resonators in plan view.

4. The acoustic wave device according to claim 3 , wherein
the shield electrode is a single body, and overlaps with at least two of the plurality of acoustic wave resonators.

5. The acoustic wave device according to claim 3 , wherein
the shield electrode does not overlap with a part of the plurality of acoustic wave resonators in plan view.

6. The acoustic wave device according to claim 1 , wherein
the first acoustic wave filter is connected between an input terminal, to which a high-frequency signal is input, and an output terminal, from which a high-frequency signal is output, and
the shield electrode overlaps with at least a part of an input pad and an input wiring line that connect the input terminal and an acoustic wave resonator located closest to the input terminal in the first acoustic wave filter in plan view.

7. The acoustic wave device according to claim 6 , wherein
the shield electrode does not overlap with an output pad and an output wiring line that connect the output terminal and an acoustic wave resonator located closest to the output terminal in the first acoustic wave filter in plan view.

8. The acoustic wave device according to claim 1 , wherein
the first acoustic wave filter includes a plurality of acoustic wave resonators,
the first acoustic wave filter is connected between an input terminal, to which a high-frequency signal is input, and an output terminal, from which a high-frequency signal is output, and
the shield electrode overlaps with an acoustic wave resonator located closest to the input terminal among the plurality of acoustic wave resonators in plan view.

9. The acoustic wave device according to claim 8 , wherein
the shield electrode does not overlap with an acoustic wave resonator other than the acoustic wave resonator located closest to the input terminal among the plurality of acoustic wave resonators in plan view.

10. The acoustic wave device according to claim 1 , wherein
one of the first acoustic wave filter and the second acoustic wave filter is a transmit filter connected between a common terminal and a transmit terminal, and
another one of the first acoustic wave filter and the second acoustic wave filter is a receive filter connected between the common terminal and a receive terminal.

11. An acoustic wave device comprising:
a first substrate that includes a first acoustic wave filter located on an upper surface of the first substrate;
a second substrate that is flip-chip mounted on the upper surface of the first substrate through a bump, and includes a second acoustic wave filter on a lower surface of the second substrate, the lower surface of the second substrate facing the upper surface of the first substrate across an air gap; and
a shield electrode that is supported by the upper surface of the first substrate, and is located between at least a part of the first acoustic wave filter and at least a part of the second acoustic wave filter through the air gap, wherein
the shield electrode includes a plurality of apertures.

12. An acoustic wave device comprising:
a first substrate that includes a first acoustic wave filter located on an upper surface of the first substrate;
a second substrate that is flip-chip mounted on the upper surface of the first substrate through a bump, and includes a second acoustic wave filter on a lower surface of the second substrate, the lower surface of the second substrate facing the upper surface of the first substrate across an air gap; and
a shield electrode that is supported by the upper surface of the first substrate, and is located between at least a part of the first acoustic wave filter and at least a part of the second acoustic wave filter through the air gap,
wherein
the first acoustic wave filter includes a plurality of acoustic wave resonators, and the shield electrode overlaps with at least one of the plurality of acoustic wave resonators in plan view,
the shield electrode comprises a plurality of shield electrodes, and each of the plurality of the shield electrodes overlaps with a corresponding one of at least two of the plurality of acoustic wave resonators.

Assignees

• Taiyo Yuden Kk

Inventors

• Hatakeyama Kazushige
• Kuroyanagi Takuma

Classifications

• H03H9/1071

  the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the SAW device · CPC title

• H03H9/0576

  including surface acoustic wave [SAW] devices · CPC title

• H03H9/02086

  Means for compensation or elimination of undesirable effects · CPC title

• H03H9/1014

  the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device · CPC title

• H03H9/0547

  consisting of a vertical arrangement (H03H9/0566 takes precedence) · CPC title