Resin composition, bonded body and semiconductor device

Patent metadata

Field	Value
Publication number	US-10249591-B2
Application number	US-201615766109-A
Country	US
Kind code	B2
Filing date	Oct 17, 2016
Priority date	Oct 29, 2015
Publication date	Apr 2, 2019
Grant date	Apr 2, 2019

Abstract

A resin composition is provided, including a binder resin, and silver-coated particles in which a functional group is introduced to a surface. A ratio (a/b) of Young's modulus (a) of the silver-coated particles to Young's modulus (b) of the binder resin after being cured is 0.1 to 2.0, and the Young's modulus (a) of the silver-coated particles is 0.05 to 2.0 GPa.

First claim

The invention claimed is:

1. A resin composition, comprising:
a binder resin; and
silver-coated particles in which a functional group is introduced to a surface,
wherein a ratio (a/b) of Young's modulus (a) of the silver-coated particles to Young's modulus (b) of the binder resin after being cured is 0.1 to 2.0, and
the Young's modulus (a) of the silver-coated particles is 0.05 to 2.0 GPa.

2. The resin composition according to claim 1 ,
wherein the ratio (a/b) of the Young's modulus (a) of the silver-coated particles to the Young's modulus (b) of the binder resin after being cured is 0.4 to 2.0, and
the Young's modulus (a) of the silver-coated particles is 0.2 to 2.0 GPa.

3. The resin composition according to claim 1 ,
wherein the functional group is selected from the group consisting of an epoxy group, a carboxyl group, a carbonyl group, an amino group, an amide group, an imino group, an imidazole group, and a mercapto group.

4. A bonded body, comprising:
a first member and a second member bonded to each other,
wherein the resin composition according to claim 1 is interposed between the first member and the second member.

5. A semiconductor device, comprising:
an insulating circuit substrate in which a circuit layer is disposed on one surface of an insulating layer; and
a semiconductor element bonded to a surface of the circuit layer, said surface being opposite the insulating layer,
wherein the resin composition according to claim 1 is interposed between the circuit layer and the semiconductor element.

6. The resin composition according to claim 2 ,
wherein the functional group is selected from the group consisting of an epoxy group, a carboxyl group, a carbonyl group, an amino group, an amide group, an imino group, an imidazole group, and a mercapto group.

7. A bonded body, comprising:
a first member and a second member bonded to each other,
wherein the resin composition according to claim 2 is interposed between the first member and the second member.

8. A bonded body, comprising:
a first member and a second member bonded to each other,
wherein the resin composition according to claim 3 is interposed between the first member and the second member.

9. A bonded body, comprising:
a first member and a second member bonded to each other,
wherein the resin composition according to claim 6 is interposed between the first member and the second member.

10. A semiconductor device, comprising:
an insulating circuit substrate in which a circuit layer is disposed on one surface of an insulating layer; and
a semiconductor element bonded to a surface of the circuit layer, said surface being opposite the insulating layer,
wherein the resin composition according to claim 2 is interposed between the circuit layer and the semiconductor element.

11. A semiconductor device, comprising:
an insulating circuit substrate in which a circuit layer is disposed on one surface of an insulating layer; and
a semiconductor element bonded to a surface of the circuit layer, said surface being opposite the insulating layer,
wherein the resin composition according to claim 3 is interposed between the circuit layer and the semiconductor element.

12. A semiconductor device, comprising:
an insulating circuit substrate in which a circuit layer is disposed on one surface of an insulating layer; and
a semiconductor element bonded to a surface of the circuit layer, said surface being opposite the insulating layer,
wherein the resin composition according to claim 6 is interposed between the circuit layer and the semiconductor element.

Assignees

• Mitsubishi Materials Corp

Inventors

• Akaike Hiroto
• Yamasaki Kazuhiko

Classifications

• H10W72/07338

  hardening the adhesive by curing, e.g. thermosetting · CPC title

• H10W72/074

  of anisotropic conductive adhesives · CPC title

• H10W72/952

  comprising metals or metalloids, e.g. PbSn, Ag or Cu · CPC title

• H10W72/073

  of die-attach connectors · CPC title

• H10W72/07341

  Controlling the bonding environment, e.g. atmosphere composition or temperature · CPC title