Diamond like carbon layer formed by an electron beam plasma process

US10249495B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10249495-B2
Application numberUS-201615195640-A
CountryUS
Kind codeB2
Filing dateJun 28, 2016
Priority dateJun 28, 2016
Publication dateApr 2, 2019
Grant dateApr 2, 2019

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

Methods for forming a diamond like carbon layer with desired film density, mechanical strength and optical film properties are provided. In one embodiment, a method of forming a diamond like carbon layer includes generating an electron beam plasma above a surface of a substrate disposed in a processing chamber, and forming a diamond like carbon layer on the surface of the substrate. The diamond like carbon layer is formed by an electron beam plasma process, wherein the diamond like carbon layer serves as a hardmask layer in an etching process in semiconductor applications. The diamond like carbon layer may be formed by bombarding a carbon containing electrode disposed in a processing chamber to generate a secondary electron beam in a gas mixture containing carbon to a surface of a substrate disposed in the processing chamber, and forming a diamond like carbon layer on the surface of the substrate from elements of the gas mixture.

First claim

Opening claim text (preview).

What is claimed is: 1. A method of forming a diamond like carbon layer, comprising: generating an electron beam plasma above a surface of a substrate disposed in a processing chamber, generating the electron beam plasma comprising: applying a first RF source power to an electrode disposed in the processing chamber; and bombarding the electrode to provide secondary electrons and a secondary electron beam flux to the surface of the substrate; and forming a diamond like carbon layer on the surface of the substrate disposed in the processing chamber. 2. The method of claim 1 , wherein providing the electron beam plasma further comprises: supplying a gas mixture to the processing chamber while generating the electron beam plasma, wherein the gas mixture includes a hydrocarbon compound. 3. The method of claim 2 , wherein the hydrocarbon compound is selected from a group consisting of CH 4 , C 3 H 6 , C 2 H 2 and C 2 H 4 . 4. The method of claim 1 , wherein bombarding the electrode to provide secondary electrons and secondary electron beam flux further comprises: providing secondary electron with low electron energy less than 1 eV to the surface of the substrate. 5. The method of claim 4 , wherein providing low electron energy further comprises: maintaining a substrate temperature less than 100 degrees Celsius. 6. The method of claim 1 , wherein the secondary electron beam flux carries an electron beam energy greater than 100 eV. 7. The method of claim 1 , wherein the diamond like carbon layer has a film density greater than 2.5 g/cc. 8. The method of claim 1 , wherein the diamond like carbon layer has a film stress less than 800 mega-pascal (MPa) compressive. 9. The method of claim 1 , wherein applying the first RF source power further comprises: applying a second RF power to an antenna coil disposed adjacent to the processing chamber. 10. The method of claim 1 , wherein applying the first RF source power further comprises: applying a remote plasma source to the processing chamber. 11. The method of claim 1 , wherein the electrode is fabricated from a carbon material. 12. The method of claim 1 , further comprising: performing a post electron beam treatment process on the diamond like carbon layer. 13. The method of claim 12 , wherein the post electron beam treatment process includes an inert gas treatment process. 14. The method of claim 1 , wherein the diamond like carbon layer serves as a hardmask layer in an etching process. 15. The method of claim 1 , wherein the substrate comprises a material layer disposed thereon prior to forming the diamond like carbon layer on the substrate, wherein the material layer is selected from a group consisting of silicon oxide, silicon nitride, silicon oxynitride, silicon carbide, low-k and porous dielectric material. 16. A method of forming a diamond like carbon layer, the method comprising: bombarding a carbon containing electrode disposed in a processing chamber to generate a secondary electron beam plasma and a secondary electron beam flux in a gas mixture containing carbon above a surface of a substrate disposed in the processing chamber; and forming a diamond like carbon layer on the surface of the substrate from elements of the gas mixture.

Assignees

Inventors

Classifications

  • characterised by the processes involved to create the masks · CPC title

  • characterised by the process involved to create the mask, e.g. lift-off masks or sidewalls or to modify the mask · CPC title

  • characterised by their composition, e.g. multilayer masks or materials · CPC title

  • H10P50/242Primary

    of Group IV materials · CPC title

  • using masks for conductive or resistive materials · CPC title

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What does patent US10249495B2 cover?
Methods for forming a diamond like carbon layer with desired film density, mechanical strength and optical film properties are provided. In one embodiment, a method of forming a diamond like carbon layer includes generating an electron beam plasma above a surface of a substrate disposed in a processing chamber, and forming a diamond like carbon layer on the surface of the substrate. The diamond…
Who is the assignee on this patent?
Applied Materials Inc
What technology area does this patent fall under?
Primary CPC classification H10P50/242. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Apr 02 2019 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 2 related publications on this page (citations in our corpus or others sharing the same primary CPC).