Coated article supporting high-entropy nitride and/or oxide thin film inclusive coating, and/or method of making the same
US-2018022929-A1 · Jan 25, 2018 · US
US10247864B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10247864-B2 |
| Application number | US-201715482717-A |
| Country | US |
| Kind code | B2 |
| Filing date | Apr 8, 2017 |
| Priority date | Nov 4, 2016 |
| Publication date | Apr 2, 2019 |
| Grant date | Apr 2, 2019 |
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In the present invention, a multi-film structure being coated on the surface of a workpiece is disclosed. The multi-film structure is formed by making a high-entropy material film of at least two layers and a non-high-entropy material film of at least one layer be stacked on each other. In addition, the multi-film structure can also be formed by making a first high-entropy material film of at least one layer and a second non-high-entropy material film of at least one layer be stacked on each other. This multi-film structure particularly contains interlaminar interfaces to inhibit crack extension and reduce plastic deformation, so that the hardness and toughness of the workpiece coated with this inventive multi-film structure would be obviously enhanced. Moreover, the appearance color of the workpiece can also be changed by the multi-film structure, wherein the color type is dependent on the optical interferences occurring in the multi-film structure.
Opening claim text (preview).
What is claimed is: 1. A multi-film structure being coated on the surface of a workpiece and being formed by making a high-entropy material film of at least two layers and a non-high-entropy material film of at least one layer be periodically stacked onto each other; wherein the multi-film structure exhibits a total nano-indentation hardness of at least 10 GPa. 2. The multi-film structure of claim 1 , wherein the non-high-entropy material film is selected from the group consisting of: non-high-entropy pure metal film, non-high-entropy alloy film, non-high-entropy nitride film, non-high-entropy carbide film, non-high-entropy boride film, non-high-entropy diamond-like carbon film, non-high-entropy nitroxide film, non-high-entropy carbonitride film, non-high-entropy oxide film, non-high-entropy carboxide film, and other non-high-entropy ceramic films. 3. The multi-film structure of claim 1 , wherein the high-entropy material film is selected from the group consisting of: high-entropy alloy film, high-entropy nitride film, high-entropy carbide film, high-entropy nitroxide film, high-entropy carbonitride film, high-entropy oxide film, high-entropy carbon oxide film, and other high-entropy ceramic films. 4. The multi-film structure of claim 1 , wherein both the high-entropy material film and the non-high-entropy material film are formed by a process technology of physical vapor deposition (PVD). 5. The multi-film structure of claim 4 , wherein the said physical vapor deposition is sputter deposition, arc vapor deposition, or ion plating. 6. A multi-film structure being coated on the surface of a workpiece and being formed by making a first high-entropy material film of at least one layer and a second high-entropy material film of at least one layer be periodically stacked onto each other; wherein the multi-film structure has a layer number of at least two layers and exhibits a total nano-indentation hardness of at least 10 GPa. 7. The multi-film structure of claim 6 , wherein both the first high-entropy material film and the second high-entropy material film are selected from the group consisting of: high-entropy alloy film, high-entropy nitride film, high-entropy carbide film, high-entropy nitroxide film, high-entropy carbonitride film, high-entropy oxide film, high-entropy carboxide film, and other high-entropy ceramic films. 8. The multi-film structure of claim 6 , wherein both the first high-entropy material film and the second high-entropy material film are formed by a process technology of physical vapor deposition (PVD). 9. The multi-film structure of claim 8 , wherein the said physical vapor deposition is sputter deposition, arc vapor deposition, or ion plating.
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