Multi-film structure

US10247864B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10247864-B2
Application numberUS-201715482717-A
CountryUS
Kind codeB2
Filing dateApr 8, 2017
Priority dateNov 4, 2016
Publication dateApr 2, 2019
Grant dateApr 2, 2019

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

In the present invention, a multi-film structure being coated on the surface of a workpiece is disclosed. The multi-film structure is formed by making a high-entropy material film of at least two layers and a non-high-entropy material film of at least one layer be stacked on each other. In addition, the multi-film structure can also be formed by making a first high-entropy material film of at least one layer and a second non-high-entropy material film of at least one layer be stacked on each other. This multi-film structure particularly contains interlaminar interfaces to inhibit crack extension and reduce plastic deformation, so that the hardness and toughness of the workpiece coated with this inventive multi-film structure would be obviously enhanced. Moreover, the appearance color of the workpiece can also be changed by the multi-film structure, wherein the color type is dependent on the optical interferences occurring in the multi-film structure.

First claim

Opening claim text (preview).

What is claimed is: 1. A multi-film structure being coated on the surface of a workpiece and being formed by making a high-entropy material film of at least two layers and a non-high-entropy material film of at least one layer be periodically stacked onto each other; wherein the multi-film structure exhibits a total nano-indentation hardness of at least 10 GPa. 2. The multi-film structure of claim 1 , wherein the non-high-entropy material film is selected from the group consisting of: non-high-entropy pure metal film, non-high-entropy alloy film, non-high-entropy nitride film, non-high-entropy carbide film, non-high-entropy boride film, non-high-entropy diamond-like carbon film, non-high-entropy nitroxide film, non-high-entropy carbonitride film, non-high-entropy oxide film, non-high-entropy carboxide film, and other non-high-entropy ceramic films. 3. The multi-film structure of claim 1 , wherein the high-entropy material film is selected from the group consisting of: high-entropy alloy film, high-entropy nitride film, high-entropy carbide film, high-entropy nitroxide film, high-entropy carbonitride film, high-entropy oxide film, high-entropy carbon oxide film, and other high-entropy ceramic films. 4. The multi-film structure of claim 1 , wherein both the high-entropy material film and the non-high-entropy material film are formed by a process technology of physical vapor deposition (PVD). 5. The multi-film structure of claim 4 , wherein the said physical vapor deposition is sputter deposition, arc vapor deposition, or ion plating. 6. A multi-film structure being coated on the surface of a workpiece and being formed by making a first high-entropy material film of at least one layer and a second high-entropy material film of at least one layer be periodically stacked onto each other; wherein the multi-film structure has a layer number of at least two layers and exhibits a total nano-indentation hardness of at least 10 GPa. 7. The multi-film structure of claim 6 , wherein both the first high-entropy material film and the second high-entropy material film are selected from the group consisting of: high-entropy alloy film, high-entropy nitride film, high-entropy carbide film, high-entropy nitroxide film, high-entropy carbonitride film, high-entropy oxide film, high-entropy carboxide film, and other high-entropy ceramic films. 8. The multi-film structure of claim 6 , wherein both the first high-entropy material film and the second high-entropy material film are formed by a process technology of physical vapor deposition (PVD). 9. The multi-film structure of claim 8 , wherein the said physical vapor deposition is sputter deposition, arc vapor deposition, or ion plating.

Assignees

Inventors

Classifications

  • G02B5/285Primary

    comprising deposited thin solid films (G02B5/281 - G02B5/289 take precedence; multilayered film filters for fibre optic multiplexing G02B6/29361) · CPC title

  • Chemical coating by decomposition of either solid compounds or suspensions of the coating forming compounds, without leaving reaction products of surface material in the coating · CPC title

  • characterised by the coating material ({C23C14/0021} , C23C14/04 take precedence) · CPC title

  • Protective coatings, e.g. hard coatings · CPC title

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Frequently asked questions

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What does patent US10247864B2 cover?
In the present invention, a multi-film structure being coated on the surface of a workpiece is disclosed. The multi-film structure is formed by making a high-entropy material film of at least two layers and a non-high-entropy material film of at least one layer be stacked on each other. In addition, the multi-film structure can also be formed by making a first high-entropy material film of at l…
Who is the assignee on this patent?
Univ Nat Tsing Hua
What technology area does this patent fall under?
Primary CPC classification G02B5/285. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue Apr 02 2019 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).