Method for Producing an Antireflection Layer on a Silicone Surface and Optical Element
US-2015309214-A1 · Oct 29, 2015 · US
US10247856B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10247856-B2 |
| Application number | US-201514693627-A |
| Country | US |
| Kind code | B2 |
| Filing date | Apr 22, 2015 |
| Priority date | Apr 28, 2014 |
| Publication date | Apr 2, 2019 |
| Grant date | Apr 2, 2019 |
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
What the patent document calls the invention.
A short plain-language summary of the technical disclosure.
Who owns or filed the patent and who is credited as inventor.
Filing, priority, publication, and grant dates set the timeline.
The legal scope of protection — read this for what is actually claimed.
Technology tags used to group this patent with similar filings.
Prior art links and similar publications in this corpus.
Official abstract text for this publication.
A method for producing an antireflection layer on a silicone surface is described. The method includes application of an organic layer, production of a nanostructure in the organic layer by a plasma etching process, and application of at least one cover layer onto the nanostructure. An optical element can be produced by the method.
Opening claim text (preview).
What is claimed is: 1. A method for producing an antireflection layer, the method comprising: forming an adhesion layer having a thickness of less than 50 nm on a silicone surface; forming an organic layer on the adhesion layer; forming a first reflection-reducing nanostructure in the organic layer using a plasma etching process; forming a cover layer over the nanostructure; after forming the first nanostructure, forming a second organic layer over the first nanostructure; and forming a second nanostructure in the second organic layer using a second plasma etching process. 2. The method according to claim 1 , wherein the organic layer is thermally stable up to a temperature of at least 150° C. 3. The method according to claim 1 , wherein the organic layer is formed by thermal evaporation. 4. The method according to claim 1 , further comprising pretreating the silicone surface by ion bombardment before forming the organic layer. 5. The method according to claim 1 , wherein the organic layer comprises a material selected from the group consisting of: melamine (2,4,6-triamino-1,3,5-triazine), MBP (5,5′-di(4-biphenylyl)-2,2′-bithiophene), TPD (N,N′-bis(3-methylphenyl)-N,N′-diphenyl-benzidine), NPB (N,N-di(naphth-1-yl)-N,N′-diphenyl-benzidine), TPB (N,N,N′,N′-tetraphenylbenzidine), TCTA (tris(4-carbazoyl-9-ylphenyl)amine), B2TP (5,5′-di-(4-byphenylyl)-2,2′-bithiophene), and parylene. 6. The method according to claim 1 , wherein the first or second nanostructure has a depth of at least 30 nm. 7. The method according to claim 1 , wherein the cover layer has a thickness of no more than 40 nm. 8. A method for producing an antireflection layer, the method comprising: forming an organic layer over a silicone surface; forming a reflection-reducing nanostructure in the organic layer using a plasma etching process; applying a second organic layer on the nanostructure; producing a second nanostructure in the second organic layer by using a second plasma etching process; and forming a cover layer over the second nanostructure. 9. The method according to claim 8 , wherein the organic layer is thermally stable up to a temperature of at least 150° C. 10. The method according to claim 8 , wherein the organic layer is formed by thermal evaporation. 11. The method according to claim 8 , further comprising pretreating the silicone surface by ion bombardment before forming the organic layer. 12. The method according to claim 8 , wherein the organic layer comprises a material selected from the group consisting of: melamine (2,4,6-triamino-1,3,5-triazine), MBP (5,5′-di(4-biphenylyl)-2,2′-bithiophene), TPD (N,N′-bis(3-methylphenyl)-N,N′-diphenyl-benzidine), NPB (N,N-di(naphth-1-yl)-N,N′-diphenyl-benzidine), TPB (N,N,N′,N′-tetraphenylbenzidine), TCTA (tris(4-carbazoyl-9-ylphenyl)amine), B2TP (5,5′-di-(4-byphenylyl)-2,2′-bithiophene), and parylene. 13. The method according to claim 8 , wherein the cover layer has a thickness of no more than 40 nm.
using plasmas · CPC title
of Group IV materials · CPC title
Localised processing · CPC title
using layers comprising organic materials · CPC title
by surface treatment, e.g. by irradiation · CPC title
Related publications grouped by family.
Answers are generated from the same data shown on this page.