Device for controlled heat transfer to and from a component

Patent metadata

Field	Value
Publication number	US-10247493-B2
Application number	US-201515509745-A
Country	US
Kind code	B2
Filing date	Sep 11, 2015
Priority date	Sep 29, 2014
Publication date	Apr 2, 2019
Grant date	Apr 2, 2019

Abstract

A component coupling system for controllable heat transfer from or to a component which is heated by an external and/or internal heat source and is disposed adjacent to a cooler. The component coupling system includes a carrier plate, on which least one first means for spacing is disposed such that a component disposed on the means for spacing and the carrier plate, together with the means for spacing, form a first cavity. If needed, this cavity can be evacuated, filled with a fluid medium, or have a fluid medium flow through it, whereby the heat transfer or the heat dissipation from the component can be controlled in a simple manner.

First claim

The invention claimed is:

1. A component coupling system for controllable heat transfer from or to a component,
comprising
a carrier plate having a side consisting of a planar face;
at least one first means for spacing disposed on the carrier plate, the first means for spacing having a continuous bottommost surface in a first plane and a continuous topmost surface in a second plane parallel to the first plane, the continuous bottommost surface of the first means for spacing being in contact with the planar face of the carrier plate, and a component disposed on the first means for spacing, the component having a side consisting of a planar face, the planar face of the component being in contact with the continuous topmost surface of the first means for spacing, the carrier plate and the first means for spacing thereby being so configured that the first means for spacing together with the carrier plate and the component form a first cavity, the first cavity being within a perimeter created by the first means for spacing; and
a first line for feeding a fluid medium to or discharging the fluid medium from the first cavity; wherein
the carrier plate and the means for spacing each comprise a ceramic or metallic material.

2. The component coupling system according to claim 1 ,
wherein the first means for spacing is a peripheral bead or an O-ring seal.

3. The component coupling system according to claim 1 ,
wherein the first means for spacing has a triangular cross-section with a base of the triangle in contact with the carrier plate and an apex of the triangle in contact with the component.

4. The component coupling system according to claim 1 , wherein the carrier plate comprises silicon carbide, a titanium-zirconium-molybdenum material or tungsten.

5. The component coupling system according to claim 1 , wherein the first means for spacing comprises silicon carbide, a titanium-zirconium-molybdenum material or tungsten.

6. A component coupling system according to claim 1 , further comprising a second means for spacing so configured that the second means for spacing together with the carrier plate and the component form a second cavity within a perimeter of the second means for spacing.

7. The component coupling system according to claim 6 ,
wherein the second means for spacing has a triangular cross-section with a base of the triangle in contact with the carrier plate and an apex of the triangle in contact with the component.

8. The component coupling system according to claim 6 ,
wherein the second cavity is between the respective perimeters of the first and second means for spacing and the component coupling system further comprises a second line for feeding a fluid medium to and discharging the fluid medium from the second cavity.

9. The component coupling system according to claim 1 , wherein the first means for spacing has a height of more than 1 mm but less than 10 mm.

10. A method for operating a component coupling system according to claim 1 , comprising:
evacuating a fluid medium from the first cavity via at least the first line; or
filling the first cavity with a fluid medium via at least the first line; or
flowing a fluid medium through the first cavity by feeding the fluid into the first cavity via at least one feed line and discharging the fluid from the cavity via the first line.

11. A method for operating a component coupling system according to claim 6 , comprising
evacuating a fluid medium from the first cavity via at least the first line; or
filling the first cavity with a fluid medium via at least the first line; or
flowing a fluid medium through the first cavity by feeding the fluid medium into the first cavity via at least one feed line and discharging the fluid medium from the cavity via the first line; and
evacuating a fluid medium from the second cavity via the second line.

12. The component coupling system according to claim 9 , wherein the first means for spacing has a height less than 5 mm.

13. The component coupling system according to claim 6 , wherein the first and second means for spacing each has a height of more than 1 mm but less than 10 mm.

14. The component coupling system according to claim 13 , wherein the height of each of the first and the second means for spacing is less than 5 mm.

Assignees

• Forschungszentrum Juelich Gmbh

Inventors

• Scheibl Lothar
• Schruff Joachim

Classifications

• F28F13/00

  Arrangements for modifying heat-transfer, e.g. increasing, decreasing (F28F1/00 - F28F11/00 take precedence) · CPC title

• B01J19/0013 Primary

  Controlling the temperature of the process · CPC title

• G21B1/13

  First wall; Blanket; Divertor · CPC title

• F28F2013/006

  Heat conductive materials · CPC title

• Y02E30/128

  Cross-Sectional Technologies · mapped topic