Resin composition for underlayer film formation, layered product, method for forming pattern, imprint forming kit, and process for producing device

Patent metadata

Field	Value
Publication number	US-10246605-B2
Application number	US-201715441716-A
Country	US
Kind code	B2
Filing date	Feb 24, 2017
Priority date	Aug 27, 2014
Publication date	Apr 2, 2019
Grant date	Apr 2, 2019

Abstract

Provided are a resin composition for underlayer film formation with which a variation hardly occurs in the line width distribution after processing due to a small thickness of a residual film after mold pressing, a layered product, a method for forming a pattern, an imprint forming kit, and a process for producing a device.
Disclosed is a resin composition for underlayer film formation which is used to form an underlayer film by being applied onto a base material, including a first resin having a radical reactive group in the side chain, a second resin containing at least one selected from a fluorine atom and a silicon atom, and a solvent. The second resin is preferably a resin containing a fluorine atom. The radical reactive group of the first resin is preferably a (meth)acryloyl group.

First claim

What is claimed is:

1. A resin composition for underlayer film formation which is used to form an underlayer film by being applied onto a base material, comprising:
a first resin having a radical reactive group in a side chain;
a second resin containing at least one selected from a fluorine atom and a silicon atom; and
a solvent,
wherein the second resin contains a repeating unit having a fluorine atom and a repeating unit represented by General Formula (CIII):

wherein R c31 represents a hydrogen atom, an alkyl group, a cyano group, or a CH 2 —O-Rac 2 group; Rac 2 represents a hydrogen atom, an alkyl group, or an acyl group; R c32 represents a group having an alkyl group, a cycloalkyl group, an alkenyl group, a cycloalkenyl group, or an aryl group; and L c3 represents a single bond or a divalent linking group; and
the repeating unit having a fluorine atom contains at least one unit selected from the group consisting Formulae (C-Ia) to (C-Id):

wherein R 10 and R 11 each independently represents a hydrogen atom, a fluorine atom, or an alkyl group; and W 3 to W 6 each independently represents an organic group containing at least one or more fluorine atoms.

2. The resin composition for underlayer film formation according to claim 1 , wherein 0.01 to 20 mass % of the second resin is contained with respect to the total solids content of the resin composition for underlayer film formation.

3. The resin composition for underlayer film formation according to claim 1 , wherein the radical reactive group contained in the first resin is a (meth)acryloyl group.

4. The resin composition for underlayer film formation according to claim 1 , wherein the first resin has a radical reactive group, and at least one group selected from a group represented by General Formula (B), an oxiranyl group, an oxetanyl group, a nonionic hydrophilic group, and a group having an interaction with a base material in a side chain:

in General Formula (B), a wavy line represents a position of connection to a main chain or side chain of the resin,
R b1 , R b2 , and R b3 each independently represent a group selected from an unsubstituted linear or branched alkyl group having 1 to 20 carbon atoms and an unsubstituted cycloalkyl group having 3 to 20 carbon atoms, and
two of R b1 , R b2 , and R b3 may be bonded to each other to form a ring.

5. The resin composition for underlayer film formation according to claim 1 , wherein the first resin has at least one repeating unit selected from the following (X1) to (X4):

in Formulae (X1) to (X4), R X1 , R X2 , and R X3 each independently represent a hydrogen atom or a methyl group, and a wavy line represents a position of connection to a side chain of the resin.

6. The resin composition for underlayer film formation according to claim 1 , wherein the resin composition for underlayer film formation contains a solvent in the range of 95 to 99.9 mass %.

7. The resin composition for underlayer film formation according to claim 1 , wherein a contact angle of the film formed of the resin composition for underlayer film formation with respect to water is 50° or more, and a contact angle of the film with respect to diiodomethane is 30° or more.

8. The resin composition for underlayer film formation according to claim 1 , which is used in the formation of an underlayer film for imprints.

9. A layered product comprising an underlayer film obtained by curing the resin composition for underlayer film formation according to claim 1 , on a surface of a base material.

10. A method for forming a pattern, comprising:
applying the resin composition for underlayer film formation according to claim 1 onto a surface of a base material in the form of a layer;
heating the applied resin composition for underlayer film formation to form an underlayer film;
applying a photocurable composition onto a surface of the underlayer film in the form of a layer;
pressing a mold having a pattern on the photocurable composition;
curing the photocurable composition by photoirradiation in a state of the mold being pressed; and
separating the mold.

11. An imprint forming kit comprising:
the resin composition for underlayer film formation according to claim 1 ; and
a photocurable composition.

12. The imprint forming kit according to claim 11 , wherein a contact angle of the film formed of the resin composition for underlayer film formation with respect to a photocurable composition is 10° or more.

13. A process for producing a device, comprising the method for forming a pattern according to claim 10 .

14. The resin composition for underlayer film formation according to claim 1 , wherein the content of the second resin is 10 to 20 mass % with respect to the total solids content of the resin composition for underlayer film formation.

15. The resin composition for underlayer film formation according to claim 1 , wherein the repeating unit having a fluorine atom contains at least one unit of Formulae (C-Ia).

Assignees

• Fujifilm Corp

Inventors

• Oomatsu Tadashi
• Kitagawa Hirotaka
• Goto Yuichiro

Classifications

• H10P95/08

  Planarisation of organic insulating materials · CPC title

• H10P14/6536

  by exposure to radiation, e.g. visible light · CPC title

• H10P14/6342

  Liquid deposition, e.g. spin-coating, sol-gel techniques or spray coating · CPC title

• H10P14/683

  carbon-based polymeric organic materials, e.g. polyimides, poly cyclobutene or PVC · CPC title

• C08F290/142

  Polyethers · CPC title